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Renesas 70T3589S133BCI
- Part No.:
- 70T3589S133BCI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3589S133BCI.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 256CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,604
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Product details
Overview
70T3589S133BCI from Integrated Device Technology is a high-speed 64K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location on independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes. Designed for industrial temperature range (–40°C to +85°C), it serves as a buffer in high-bandwidth inter-processor communication systems.
For engineers reviewing the 70T3589S133BCI datasheet, 70T3589S133BCI pinout, 70T3589S133BCI application, or 70T3589S133BCI equivalent, key selection criteria include dual-port timing coordination, voltage-flexible I/O banks, JTAG-compliant boundary scan support, and low-latency interrupt/collision flag signaling - all critical for real-time embedded control and FPGA co-processor interfacing.
Technical Context
This device implements fully synchronous dual-port operation with independent clock domains (CLKL/CLKR), register-controlled address/data paths, and self-timed write logic that enables minimal setup/hold times (1.5ns setup, 0.5ns hold @133MHz). Each port has dedicated chip enables (CE0/CE1), byte enables (BE0–BE3), and pipeline/flow-through mode selection (PL/FTL/R).
It integrates collision detection and interrupt logic triggered by simultaneous access to identical addresses, plus counter-based address generation with repeat functionality. Power management includes dual-chip-enable standby and ZZ sleep mode (5mA typical), with separate VDD (2.5V core) and VDDQ (2.5V/3.3V I/O) supplies controlled per port via OPTL/OPTR pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 64K × 36 bits (2.3 Mbit total); supports depth expansion via dual CE without external logic |
| Max Clock Frequency | 133MHz (7.5ns cycle time in pipelined mode); validated for industrial temp range |
| Access Time | 4.2ns max clock-to-data-out (tCD2) in pipelined mode; enables tight timing closure in burst data transfers |
| I/O Voltage Support | Selectable 2.5V or 3.3V per port via OPTL/OPTR; VDDQ must match selected level (2.4–2.6V or 3.15–3.45V) |
| Operating Temperature | –40°C to +85°C; qualified for industrial applications with full AC/DC specs across range |
| Package | 256-pin BGA (BC256); 17mm × 17mm body, 1.0mm ball pitch; no NC pins on A16/A17 for this variant |
| Power Supply | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV/±100mV per port; separate supply domains |
Pinout & Package
70T3589S133BCI is housed in a 256-pin Ball Grid Array (BC256) package with 17mm × 17mm footprint and 1.0mm ball pitch. Pin functions are defined per port (Left/Right), with dedicated I/O banks (I/O0L–I/O35L, I/O0R–I/O35R), dual clock inputs (CLKL/CLKR), and independent control sets including CE0/CE1, R/WL/R/WR, OEL/OER, BE0–BE3, ADSL/ADSR, CNTENL/CNTENR, REPEATL/REPEATR, PL/FTL/PL/FTR, OPTL/OPTR, and ZZL/ZZR.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Drives internal registers on rising edge; defines timing domain for all port signals except OE, ZZ, PL/FT |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable inputs | Enable/disable port activity; double-buffered in pipelined mode; allow depth expansion without glue logic |
| R/WL / R/WR | Read/write direction control | Synchronous active-high signal; determines data flow direction on I/O bus during clock cycle |
| OEL / OER | Asynchronous output enable | Tri-states I/O bus immediately; independent of clock; used for bus sharing or power gating |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | DC-level input (VIH/VIL) selecting output latency: pipelined (1-cycle delay) or flow-through (no delay) |
| INTL / INTR, COLL / COLR | Open-drain interrupt/collision flags | Asserted asynchronously on address collision or user-triggered event; require external pull-up |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses on left/right ports - essential for lock-free inter-processor communication |
| Configurable I/O voltage per port | OPTL/OPTR pins independently set each port's interface to 2.5V or 3.3V logic levels, simplifying mixed-voltage system integration |
| Address counter with repeat | CNTENL/R enables auto-incrementing address generation; REPEATL/R reloads last ADS-loaded address - ideal for FIFO-like burst transfers |
| JTAG boundary scan (IEEE 1149.1) | Full TAP controller (TCK/TMS/TDI/TDO/TRST) supported in BC256 package; enables board-level test and debug without intrusive probing |
| Dual-chip-enable power control | CE0/CE1 per port allow selective shutdown of dynamic circuitry; reduces active current to ≤260mA (133MHz, both ports) |
| Collision and interrupt detection | Dedicated COLL/INT flags assert within 4.2ns of conflicting access; eliminates software polling overhead in real-time systems |
Applications
| Telecom Line Card Buffering | FPGA-CPU Co-Processor Interface |
|---|---|
Use Scenario: High-speed packet buffering between line interface ASIC and traffic manager ASIC in 10Gbps+ telecom equipment. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between two independent clock domains (line rate vs. backplane clock), synchronized via CLKL/CLKR. Use Value: 4.2ns tCD2 and 7.5ns tCYC2 enable sub-8ns memory access - meeting strict jitter budgets for deterministic packet forwarding. |
Use Scenario: Real-time data exchange between Xilinx Kintex FPGA and ARM Cortex-A9 processor in industrial motion control PLC. IC Role / Device Role / Timing Role: Serves as a ping-pong buffer with hardware-managed address counters (CNTENL/R), eliminating CPU overhead for DMA address updates. Use Value: REPEATL/R and ADSL/ADSR allow automatic address wrap-around on burst transfers - reducing firmware complexity and improving loop timing predictability. |
| Avionics Data Concentrator | Medical Imaging Pipeline Memory |
Use Scenario: ARINC 664 (AFDX) end-system aggregating sensor data from multiple LRUs into a unified time-stamped stream. IC Role / Device Role / Timing Role: Left port receives time-tagged frames from sensor interfaces; right port feeds deterministic scheduler engine - collision detection prevents data corruption during concurrent access. Use Value: COLL/INT flags trigger immediate hardware exception - ensuring <100ns response to memory contention in DO-254 safety-critical paths. |
Use Scenario: Real-time pixel buffering between CT scanner detector array and reconstruction ASIC, requiring sustained 1.2GB/s throughput. IC Role / Device Role / Timing Role: Dual-port architecture decouples acquisition (left port) from processing (right port); pipelined mode (tCD2 = 4.2ns) sustains 133MHz burst reads/writes. Use Value: 2.5V/3.3V I/O flexibility allows direct connection to both 2.5V ADC front-end and 3.3V GPU interface - avoiding level-shifters and signal integrity loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 3.3V-only core/I/O; no VDDQ voltage selection; 166MHz max; 208-pin TQFP package | Lacks per-port voltage flexibility and industrial temp support at 133MHz; no JTAG | Choose only if system uses uniform 3.3V logic and requires smaller footprint than BGA |
| IDT70V9269L133PFI | Lower density (32K × 18); 3.3V core; 208-pin PQFP; no pipelined mode or address counter | Insufficient bandwidth and feature set for high-throughput inter-processor links | Consider only for cost-sensitive, lower-bandwidth legacy designs where pin count constraints prohibit BGA |
Compared with CY7C1362BV33-133BZI and IDT70V9269L133PFI, the 70T3589S133BCI delivers unique per-port voltage configurability, integrated address counter with repeat, and JTAG testability - making it the only option among the three qualified for new industrial and avionics designs requiring mixed-voltage, low-latency dual-port memory.
Availability
70T3589S133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for 70T3589S133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 70T35xxS family was designed specifically for deterministic, low-latency inter-processor communication in real-time embedded systems - emphasizing true dual-port concurrency, flexible I/O voltage scaling, and robust industrial temperature operation.
FAQ
What is the maximum operating frequency of the 70T3589S133BCI in pipelined mode?
The 70T3589S133BCI is rated for 133MHz operation in pipelined mode (tCYC2 = 7.5ns), with guaranteed 4.2ns clock-to-data-out (tCD2) across the full industrial temperature range (–40°C to +85°C). This specification applies to both left and right ports independently when PL/FTL and PL/FTR are set to VIH. The device does not support 166MHz or 200MHz speeds in the BC256 package per datasheet revision DSC 5666/14.
Does the 70T3589S133BCI support independent voltage selection for left and right I/O banks?
Yes, the 70T3589S133BCI supports fully independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels (requiring VDDQL = 3.3V), while setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels (requiring VDDQR = 2.5V). This enables mixed-voltage system integration without external level shifters.
How does collision detection work on the 70T3589S133BCI, and what is its timing behavior?
The 70T3589S133BCI asserts COLL (left) or COLR (right) within 4.2ns (tCOLS) of detecting simultaneous access to the same memory address from both ports. The flag remains asserted until cleared by completing a valid access cycle on the contending port. Collision detection is asynchronous and independent of clock edges, providing hardware-level arbitration without CPU intervention - critical for real-time determinism.
What package type and pin count does the 70T3589S133BCI use, and are A16/A17 pins functional?
The 70T3589S133BCI uses a 256-pin Ball Grid Array (BC256) package with 17mm × 17mm body size and 1.0mm ball pitch. Per datasheet note 1 on page 3, A17L, A17R, A16L, and A16R are No Connect (NC) pins for the IDT70T3589 variant - they must be left unconnected and should not be used for addressing. Addressing is limited to A0–A15 (64K depth).
Is JTAG boundary scan supported on the 70T3589S133BCI, and which pins are required?
Yes, JTAG boundary scan compliant with IEEE 1149.1 is supported on the 70T3589S133BCI in the BC256 package. Required pins are TCK (pin E16), TMS (pin P3), TDI (pin A2), TDO (pin B3), and TRST (pin R3). JTAG is not available in the DR208 PQFP or BF208 fpBGA packages per datasheet note 9 on page 4.
70T3589S133BCI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3589S133BCI FAQ
1.How can I place an order for 70T3589S133BCI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3589S133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3589S133BCI reliable?
The price and inventory of 70T3589S133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S133BCI is usually 5 days.
3.What payment methods are accepted for 70T3589S133BCI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3589S133BCI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3589S133BCI?
70T3589S133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3589S133BCI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3589S133BCI?
For technical support, including 70T3589S133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3589S133BCI requirements.
6.How does Aetrix verify that 70T3589S133BCI is sourced from the original manufacturer or authorized distributors?
All 70T3589S133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S133BCI meets industry standards.
7.What is the process for return or replacement of 70T3589S133BCI?
All 70T3589S133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S133BCI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3589S133BCI part is unused and in its original packaging.
Return procedure for 70T3589S133BCI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3589S133BCI Tags
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