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Renesas 70T3589S133BFI
- Part No.:
- 70T3589S133BFI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T3589S133BFI.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 208CABGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
70T3589S133BFI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes. Designed for real-time inter-processor communication in industrial networking equipment.
For engineers reviewing the 70T3589S133BFI datasheet, 70T3589S133BFI pinout, 70T3589S133BFI application, or 70T3589S133BFI equivalent, key selection criteria include guaranteed 133MHz operation over –40°C to +85°C, independent port voltage configuration (2.5V/3.3V), low-latency collision detection, and BGA package compatibility with high-density PCB layouts.
Technical Context
This device implements fully synchronous dual-port operation on both left and right ports, with clocked address, data, and control registers minimizing setup/hold requirements. Each port includes independent chip enables (CE0/CE1), byte enables (BE0–BE3), and pipeline/flow-through mode selection via PL/FT pins.
It integrates dedicated interrupt and collision detection logic with sub-5ns flag assertion, supports JTAG IEEE 1149.1 boundary scan (in BGA packages), and provides automatic power-down via CE-controlled standby modes and ZZ sleep mode-reducing current to 5mA typical in full standby.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 bits (9Mbit total); supports depth expansion using dual chip enables without external logic |
| Max Clock Frequency | 133MHz (7.5ns cycle time); validated for industrial temperature range (–40°C to +85°C) |
| I/O Voltage Support | Selectable 2.5V ±100mV or 3.3V ±150mV per port via OPTL/OPTR; core VDD fixed at 2.5V |
| Access Time | 4.2ns max clock-to-data (tCD2) in pipelined mode; enables tight timing closure in burst-data systems |
| Package | 256-pin Ball Grid Array (BGA); 17mm × 17mm body, 1.0mm ball pitch; RoHS-compliant green variant |
| Power Consumption | 260mA max dynamic current (both ports active); 5mA typical full standby (ISB3) with CMOS-level inputs |
| Collision Detection | Dedicated COLL/INTR flags with 4.2ns max set/reset latency; enables deterministic arbitration in shared-memory systems |
Pinout & Package
256-pin BGA package (BC256/BCG256); 17mm × 17mm × 1.4mm body; 1.0mm ball pitch; thermal pad not present. Requires separate 2.5V core (VDD) and configurable I/O (VDDQ) supplies per port.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Clock Input (Left/Right Port) | Synchronous edge-triggered timing reference; all control/data/address registered on rising edge |
| A0L–A15L / A0R–A15R | Address Input | 16-bit address bus; A16/A17 are No Connect for 70T3589 - simplifies routing vs. higher-density variants |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional Data Bus | 36-bit parallel interface; byte-enable controlled (BE0–BE3) for 9-bit granularity writes |
| CE0L/CE1L / CE0R/CE1R | Chip Enable Pair | Dual enable logic allows seamless depth expansion (e.g., 512K×36) without glue logic |
| PL/FTL / PL/FTR | Output Mode Select | Configures pipelined (low-latency streaming) or flow-through (zero-cycle read) output behavior per port |
| ZZL / ZZR | Sleep Mode Input | Asserting VIH disables dynamic inputs (except JTAG), reducing supply current to 5mA typical |
| INTL / INTR / COLL / COLR | Interrupt & Collision Flags | Open-drain outputs signaling memory contention or completion; critical for lock-free inter-processor sync |
| OPTL / OPTR | I/O Voltage Option | Set to VDD (2.5V) for 3.3V I/O operation; set to VSS (0V) for 2.5V I/O - configures VDDQX supply requirement |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Enables concurrent read/write to identical addresses - eliminates arbitration overhead in symmetric multiprocessing |
| Dual Cycle Deselect (DCD) | Prevents bus contention during pipelined output mode transitions by delaying deselect by two clocks |
| Independent Port Configuration | Left and right ports can operate at different I/O voltages (2.5V/3.3V) simultaneously - supports mixed-voltage system integration |
| Address Counter & Repeat Logic | Hardware counter with ADS-triggered load and REPEAT-driven reset enables efficient burst transfers without CPU intervention |
| JTAG Boundary Scan | IEEE 1149.1 compliance in BGA packages enables production testability and debug visibility without physical probes |
| Industrial Temperature Support | Guaranteed 133MHz operation from –40°C to +85°C - qualified for base station, motor drive, and railway control applications |
Applications
| Telecom Line Card Buffering | Real-Time Industrial PLC |
|---|---|
|
Use Scenario: High-throughput packet buffering between line interface units and switching fabric in carrier-grade Ethernet switches. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress processors, synchronized via independent clocks. Use Value: 133MHz sustained bandwidth (9.5Gbps aggregate) and sub-5ns collision detection ensure deterministic packet forwarding under full load. |
Use Scenario: Coordinating motion control tasks across multiple servo axes in CNC machines with hard real-time deadlines. IC Role / Device Role / Timing Role: Shared memory hub between master motion controller and distributed axis controllers; pipelined mode minimizes jitter in position update cycles. Use Value: Guaranteed industrial-temp operation and 4.2ns tCD2 enable <1µs inter-processor handshaking - meeting IEC 61131-3 cycle time requirements. |
| Avionics Data Concentrator | Medical Imaging Pipeline |
|
Use Scenario: Aggregating sensor data from ARINC 429 and MIL-STD-1553 buses into a unified avionics health monitoring subsystem. IC Role / Device Role / Timing Role: Left port receives time-stamped telemetry; right port feeds analysis engine - collision detection prevents data corruption during concurrent access. Use Value: Independent 2.5V/3.3V I/O support allows direct interfacing to legacy 3.3V buses and modern 2.5V FPGAs without level shifters. |
Use Scenario: Staging raw CT/MRI voxel data between acquisition ASICs and reconstruction DSPs in real-time imaging pipelines. IC Role / Device Role / Timing Role: Flow-through mode enables zero-cycle reads for pixel streaming; address counter automates sequential buffer addressing. Use Value: 7.5ns cycle time sustains >1.2GB/s throughput required for 4K medical video processing - eliminating frame-drop bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress CY7C1362KV18 | 144-pin TQFP; 166MHz max; 128K × 36 organization; no JTAG; 3.3V-only I/O | Limited to commercial temp (0°C to +70°C); lacks independent port voltage control and sleep mode | Choose when board space permits TQFP and system operates only at 3.3V with no industrial temp requirement |
| Renesas R1EX24032AS0C | 208-pin fpBGA; 100MHz max; 256K × 36; 2.5V core + 2.5V/3.3V I/O; no collision detection logic | No hardware interrupt/collision flags; requires software arbitration; lower max frequency reduces bandwidth headroom | Choose when cost sensitivity outweighs need for hardware arbitration and 133MHz bandwidth margin |
Compared with CY7C1362KV18 and R1EX24032AS0C, the 70T3589S133BFI delivers unique value through guaranteed industrial-temp 133MHz operation, per-port voltage configurability, integrated collision detection, and JTAG testability - making it optimal for safety-critical embedded systems requiring deterministic timing and mixed-voltage interoperability.
Availability
70T3589S133BFI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and medical imaging systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for 70T3589S133BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 70T35xxS family was designed specifically for deterministic, low-latency inter-processor communication in real-time embedded systems - emphasizing simultaneous access, hardware arbitration, and industrial-grade reliability.
FAQ
What is the maximum operating frequency of the 70T3589S133BFI across its full temperature range?
The 70T3589S133BFI is rated for 133MHz operation (7.5ns cycle time) over the full industrial temperature range of –40°C to +85°C. This is verified per datasheet Table 10 (AC Electrical Characteristics) and applies to both pipelined and flow-through output modes. Higher speeds (166MHz/200MHz) are available only in commercial-grade variants or specific packages not applicable to this part number.
Does the 70T3589S133BFI support independent I/O voltage levels on its left and right ports?
Yes, the 70T3589S133BFI supports independent I/O voltage configuration: OPTL sets the left port's interface level (2.5V or 3.3V), while OPTR sets the right port's level. Corresponding VDDQL and VDDQR supplies must match the selected voltage. This enables direct interfacing with mixed-voltage FPGAs, ASICs, or processors without external level shifters.
How does collision detection work on the 70T3589S133BFI, and what is its latency?
The 70T3589S133BFI includes dedicated hardware collision detection logic that asserts COLL/ COLR flags within 4.2ns (max) when simultaneous write attempts target the same memory location. The flags remain asserted until cleared by subsequent non-conflicting accesses. This hardware mechanism eliminates software polling overhead and ensures deterministic response in real-time inter-processor synchronization.
What package type and pin count does the 70T3589S133BFI use, and are there NC pins I should avoid routing to?
The 70T3589S133BFI uses a 256-pin BGA (BC256/BCG256) package with 1.0mm ball pitch. Per datasheet Note 6 on page 6, address pins A16L, A17L, A16R, and A17R are No Connect for this variant - they must be left unconnected and not tied to any net. Other NC pins include B16, A16, and several test/reserved balls documented in the pin configuration diagram.
Can the 70T3589S133BFI enter a low-power state, and how is it controlled?
Yes, the 70T3589S133BFI supports two low-power states: CE-based standby (ISB1–ISB4) and ZZ sleep mode. Asserting ZZR or ZZL (VIH) disables dynamic circuitry while retaining memory content, reducing current to 5mA typical (ISB3). JTAG remains functional during sleep mode, but boundary scan is not recommended per datasheet Note 4.
70T3589S133BFI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70T3589S133BFI FAQ
1.How can I place an order for 70T3589S133BFI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3589S133BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3589S133BFI reliable?
The price and inventory of 70T3589S133BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S133BFI is usually 5 days.
3.What payment methods are accepted for 70T3589S133BFI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3589S133BFI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3589S133BFI?
70T3589S133BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3589S133BFI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3589S133BFI?
For technical support, including 70T3589S133BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3589S133BFI requirements.
6.How does Aetrix verify that 70T3589S133BFI is sourced from the original manufacturer or authorized distributors?
All 70T3589S133BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S133BFI meets industry standards.
7.What is the process for return or replacement of 70T3589S133BFI?
All 70T3589S133BFI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S133BFI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3589S133BFI part is unused and in its original packaging.
Return procedure for 70T3589S133BFI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3589S133BFI Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
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24AA02UIDT-I/OT
Microchip Technology
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AT24C08C-STUM-T
Microchip Technology
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