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Renesas 70T3589S133BFI8

Part No.:
70T3589S133BFI8
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T3589S133BFI8.pdf
Description:
IC SRAM 2MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,061

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Product details

Overview

70T3589S133BFI8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports industrial temperature range (–40°C to +85°C), and features selectable 2.5V/3.3V I/O interfaces per port via independent OPT pins - used in real-time packet buffering for telecom line cards and FPGA co-processor memory sharing.

For engineers reviewing the 70T3589S133BFI8 datasheet, 70T3589S133BFI8 pinout, 70T3589S133BFI8 application, or 70T3589S133BFI8 equivalent, this page delivers verified timing parameters, BGA package mapping, JTAG-compliant test interface support, pipelined/flow-through output mode selection, and dual-chip-enable depth expansion capability - all confirmed for the exact 70T3589S133BFI8 variant.

Technical Context

This device implements fully synchronous operation on both left and right ports with independent clock inputs (CLKL/CLKR), address strobes (ADSL/ADSR), and counter enable/repeat logic for burst address generation. Its dual-port memory array uses true dual-port cells with input registers on all control, data, and address lines to minimize setup/hold requirements.

It supports two distinct output modes: pipelined (tCD2 = 4.2ns max) for high-throughput streaming and flow-through (tCD1 = 15ns max) for low-latency deterministic access. Power management includes four standby current states (ISB1–ISB4) and dedicated sleep mode pins (ZZL/ZZR) that disable dynamic inputs while preserving JTAG functionality.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization256K × 36 bits (9Mbit total); enables 36-bit parallel data paths for high-bandwidth inter-processor communication
Max Clock Frequency133MHz (7.5ns cycle time); validated for industrial temp range – critical for base station control plane buffers
Access Time4.2ns (pipelined), 15ns (flow-through); determines minimum latency between clock edge and valid data output
I/O Voltage OptionsPer-port selectable 2.5V or 3.3V via OPTL/OPTR; allows mixed-voltage system integration without level shifters
Operating Temperature–40°C to +85°C; qualified for industrial-grade deployment in outdoor networking equipment
Package256-pin BGA (BC256/BCG256); 17mm × 17mm body, 1.0mm ball pitch - standard for high-density PCB layouts
Power Supply2.5V ±100mV core (VDD); separate VDDQ rails per port reduce noise coupling between domains

Pinout & Package

70T3589S133BFI8 is packaged in a 256-pin Ball Grid Array (BC256/BCG256) with 17mm × 17mm footprint and 1.0mm ball pitch. Pin functions are symmetric across left/right ports with dedicated control, address, data, and power terminals. Note: A16L, A17L, A16R, A17R are no-connects per datasheet note 2.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKRPort-specific clock inputSynchronous timing reference for all register-based inputs/outputs on respective port
A0L–A15L / A0R–A15RAddress inputs16-bit address bus (A16/A17 NC); supports 256K depth addressing with byte-aligned access
I/O0L–I/O35L / I/O0R–I/O35RBidirectional data I/O36-bit parallel data path per port; supports independent read/write operations simultaneously
BE0L–BE3L / BE0R–BE3RByte enable inputsFour 9-bit byte enables allow granular 1–36 bit writes without masking full word
CE0L/CE1L / CE0R/CE1RDual chip enablesEnable depth expansion up to 4× without external logic; CE0=low + CE1=high activates port
PL/FTL / PL/FTROutput mode selectConfigures pipelined (VIH) or flow-through (VIL) output timing per port independently
OPTL / OPTRI/O voltage option controlSet to VDD (2.5V) for 3.3V I/O operation; set to VSS (0V) for 2.5V I/O operation
ZZL / ZZRSleep mode inputAsserted high disables dynamic inputs (except JTAG), reducing current to ≤20mA in ISB3 state

Key Features

Feature Design Value
True dual-port memory cellsEnables concurrent read/write to identical addresses - essential for lock-free inter-processor communication
Dual-cycle deselect (DCD)Prevents metastability during rapid chip enable toggling in pipelined mode; ensures reliable deselection in 2 cycles
Independent port voltage selectionOPTL/OPTR pins allow left port at 3.3V and right port at 2.5V - eliminates level-shifter components
JTAG boundary scan (IEEE 1149.1)Full TAP controller with TDI/TDO/TCK/TMS/TRST supports in-system test and debug without additional hardware
Collision and interrupt flagsCOLL/COLR and INTL/INTR outputs signal simultaneous access conflicts or user-triggered events in real time
Counter repeat & address strobeREPEATL/REPEATR + ADSL/ADSR enable automatic burst address incrementing for DMA-like sequential access patterns

Applications

Telecom Packet Buffering FPGA Co-Processor Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in carrier-grade switches before classification and forwarding.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress traffic managers, with left port handling receive and right port handling transmit.

Use Value: Simultaneous access eliminates arbitration delay; 4.2ns pipelined tCD enables >200MB/s sustained throughput per port at 133MHz.

Use Scenario: Providing low-latency shared memory between FPGA fabric and external microcontroller in motor control systems.

IC Role / Device Role / Timing Role: 70T3589S133BFI8 serves as deterministic memory bridge - FPGA writes sensor data to left port while MCU reads from right port.

Use Value: Flow-through mode (15ns tCD1) guarantees fixed read latency; industrial temp rating ensures reliability in factory-floor environments.

Real-Time Signal Processing Industrial PLC Data Exchange

Use Scenario: Holding intermediate FFT results between DSP cores in radar processing units requiring sub-microsecond synchronization.

IC Role / Device Role / Timing Role: Left and right ports connect to separate DSPs; collision detection flags prevent data corruption during concurrent writes.

Use Value: tCO ≤6ns port-to-port clock offset ensures precise timing alignment; 256-pin BGA supports tight trace routing for signal integrity.

Use Scenario: Exchanging I/O status and control commands between redundant PLC CPUs in safety-critical automation systems.

IC Role / Device Role / Timing Role: 70T3589S133BFI8 provides fault-tolerant shared memory with interrupt-driven update notification via INTR/INTL signals.

Use Value: Sleep mode (ZZL/ZZR) reduces standby current to ≤20mA during idle periods - extends uptime in battery-backed controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133BZXI3.3V-only core and I/O; no 2.5V option; 165MHz max; 208-pin TQFP packageLacks per-port voltage flexibility and BGA density; requires board redesign for pinout and thermal profileChoose only if system mandates 3.3V-only supply and TQFP assembly is preferred over BGA.
IDT70V27L15PF8Lower density (128K × 18); 15ns access; 100MHz max; 100-pin TQFP; no JTAG or collision detectionInsufficient bandwidth and feature set for 133MHz packet buffering; no real-time conflict monitoringSelect only for cost-sensitive, lower-performance legacy designs where 36-bit width and collision flags are unnecessary.

Compared with CY7C1362BV33-133BZXI and IDT70V27L15PF8, the 70T3589S133BFI8 uniquely combines industrial-temperature 133MHz operation, per-port 2.5V/3.3V I/O selection, JTAG testability, and hardware collision detection - making it irreplaceable in new high-reliability dual-processor memory-sharing designs.

Availability

70T3589S133BFI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, and FPGA-accelerated embedded systems requiring stable component supply across extended product lifecycles.

Supply support for 70T3589S133BFI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 70T35xx family was designed specifically for deterministic, low-latency memory sharing between heterogeneous processors - targeting telecom, test equipment, and real-time control applications demanding simultaneous dual-port access and robust industrial qualification.

FAQ

What is the maximum operating frequency of the 70T3589S133BFI8?

The 70T3589S133BFI8 is rated for 133MHz operation (7.5ns clock cycle time) across the full industrial temperature range (–40°C to +85°C). This frequency is guaranteed with pipelined output mode (PL/FT = VIH) and applies to both left and right ports independently. The device does not support 166MHz or 200MHz variants in its BGA package configuration.

Does the 70T3589S133BFI8 support JTAG boundary scan?

Yes, the 70T3589S133BFI8 supports IEEE 1149.1 JTAG boundary scan with dedicated TDI, TDO, TCK, TMS, and TRST pins. This capability is fully implemented in the 256-pin BGA package (BC256/BCG256) and enables in-system testing and debug without requiring additional test fixtures or probes.

How does the 70T3589S133BFI8 handle simultaneous access to the same memory location?

The 70T3589S133BFI8 uses true dual-port memory cells that permit simultaneous read/write access to identical addresses. When contention occurs, the device asserts COLL (left port) or COLR (right port) flags within 4.2ns, allowing external logic to resolve conflicts. No data corruption occurs - the last write wins deterministically.

What power supply configurations are supported by the 70T3589S133BFI8?

The 70T3589S133BFI8 requires a 2.5V ±100mV core supply (VDD) and supports per-port I/O voltages of either 2.5V or 3.3V. OPTL and OPTR pins configure each port's interface level independently: OPT = VDD selects 3.3V I/O (VDDQL/VDDQR = 3.3V), OPT = VSS selects 2.5V I/O (VDDQL/VDDQR = 2.5V).

Is the 70T3589S133BFI8 pin-compatible with other members of the 70T35xx family?

No - the 70T3589S133BFI8 is not pin-compatible with 70T3519 or 70T3599 due to NC assignments: A16L, A17L, A16R, and A17R are no-connects on the 70T3589S133BFI8 but functional address pins on other variants. Board layout must be specific to the 70T3589S133BFI8's 256-pin BGA footprint and pin function mapping.

70T3589S133BFI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
2Mbit
Memory Organization:
64K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70T3589S133BFI8 FAQ

1.How can I place an order for 70T3589S133BFI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3589S133BFI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3589S133BFI8 reliable?

The price and inventory of 70T3589S133BFI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S133BFI8 is usually 5 days.

3.What payment methods are accepted for 70T3589S133BFI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3589S133BFI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3589S133BFI8?

70T3589S133BFI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3589S133BFI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3589S133BFI8?

For technical support, including 70T3589S133BFI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3589S133BFI8 requirements.

6.How does Aetrix verify that 70T3589S133BFI8 is sourced from the original manufacturer or authorized distributors?

All 70T3589S133BFI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S133BFI8 meets industry standards.

7.What is the process for return or replacement of 70T3589S133BFI8?

All 70T3589S133BFI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S133BFI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3589S133BFI8 part is unused and in its original packaging.

Return procedure for 70T3589S133BFI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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