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Renesas 70T3589S133DR
- Part No.:
- 70T3589S133DR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-BFQFP
- Datasheet:
-
70T3589S133DR.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 208PQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,230
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Product details
Overview
70T3589S133DR from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes. Used in real-time packet buffering for telecom line cards and FPGA co-processor interconnects.
For engineers reviewing the 70T3589S133DR datasheet, 70T3589S133DR pinout, 70T3589S133DR application, or 70T3589S133DR equivalent, key selection criteria include dual-port latency tolerance, independent port voltage configuration (via OPTL/OPTR), industrial temperature support (–40°C to +85°C), and 208-pin PQFP package compatibility with legacy board layouts.
Technical Context
This device implements fully synchronous operation on both left and right ports with separate clock inputs (CLKL/CLKR), dual chip enables (CE0/CE1 per port) for depth expansion, and address counter logic with ADS strobe, CNTEN enable, and REPEAT reload functionality. It supports JTAG boundary scan (IEEE 1149.1) in BGA packages but not in the DR208 PQFP variant.
The memory array uses true dual-port cells with input/output registers on all control, data, and address lines-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz). Power management includes dynamic standby (ISB1–ISB4) and sleep mode (ZZL/ZZR) reducing current to 5mA typical when asserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.2 Mbit); supports 256K-word addressing with 36-bit parallel I/O per port |
| Max Clock Frequency | 133MHz (7.5ns cycle time); validated for industrial temperature range (–40°C to +85°C) |
| Access Time | 4.2ns (max) clock-to-data valid in pipelined mode; enables sub-8ns system-level timing closure |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port (configured via OPTL/OPTR) |
| Operating Temperature | Industrial grade: –40°C to +85°C; qualified for telecom infrastructure and industrial control systems |
| Package | 208-pin plastic quad flat pack (PQFP), 28mm × 28mm × 3.5mm body, no JTAG support |
| Power Consumption | Dynamic IDD = 370mA max (both ports active, 133MHz); full standby ISB3 = 20mA max |
Pinout & Package
208-pin PQFP (DR208 package), 28mm × 28mm × 3.5mm body, 0.5mm lead pitch. All VDD pins require 2.5V; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS). A17L/A17R and A16L/A16R are no-connects per datasheet Note 1 & 2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for left/right port operations; no skew tolerance required between ports |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable inputs | Enable depth expansion without external logic; CE0X = low + CE1X = high activates port X |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | VIH = pipelined (3.4ns tCD2 @ 133MHz); VIL = flow-through (15ns tCD1); configures output latency per port |
| OPTL / OPTR | I/O voltage option control | Set to VDD (2.5V) → 3.3V I/O interface; set to VSS (0V) → 2.5V I/O interface; independent per port |
| ZZL / ZZR | Port-specific sleep mode input | Asserted high disables dynamic inputs (except JTAG), reduces current to 5–15mA; static inputs remain functional |
| I/O0L–I/O35L / I/O0R–I/O35R | 36-bit bidirectional data bus | Byte-enableable (BE0–BE3) 9-bit segments; supports partial writes without read-modify-write overhead |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cell architecture | Enables concurrent read/write to identical addresses-critical for lock-free FIFOs and real-time data exchange |
| Independent per-port voltage configuration | OPTL/OPTR allow mixed-voltage interfacing (e.g., 2.5V FPGA left port, 3.3V ASIC right port) without level shifters |
| Dual-cycle deselect (DCD) in pipelined mode | Prevents bus contention during rapid port switching by delaying chip disable by two clocks |
| Address counter with ADS/CNTEN/REPEAT | Eliminates external address generation logic; REPEAT reloads last ADS-loaded address for burst transfers |
| Collision and interrupt flag outputs | COLL/COLR and INTL/INTR provide hardware-asserted status for arbitration and debug without polling |
Applications
| Telecom Line Card Buffering | FPGA-CPU Co-Processor Interconnect |
|---|---|
|
Use Scenario: High-throughput packet buffering between SerDes PHY and traffic manager ASIC in 10G/25G line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress pipelines, synchronized to independent clocks. Use Value: 133MHz operation and 4.2ns tCD2 enable deterministic <8ns round-trip latency for cut-through forwarding. |
Use Scenario: Real-time data exchange between Xilinx Kintex FPGA and ARM Cortex-A9 processor in industrial vision system. IC Role / Device Role / Timing Role: Serves as scratchpad memory with FPGA writing image buffers and CPU reading processed results concurrently. Use Value: Independent 2.5V/3.3V I/O allows direct connection to FPGA bank (2.5V) and CPU bus (3.3V), eliminating level-shifter BOM cost. |
| Avionics Data Acquisition Hub | Medical Imaging Pipeline Memory |
|
Use Scenario: Time-stamped sensor fusion in DO-254-certified flight control unit with redundant ADC interfaces. IC Role / Device Role / Timing Role: Left port captures synchronized analog samples; right port feeds DSP engine with timestamp-aligned frames. Use Value: Industrial temp rating (–40°C to +85°C) and sleep mode (ZZL/ZZR) meet avionics power cycling requirements. |
Use Scenario: Pixel data staging between CT scanner detector array and reconstruction GPU in FDA-cleared imaging system. IC Role / Device Role / Timing Role: Buffers raw 16-bit pixel streams at 120MB/s while GPU processes prior frame-no software arbitration needed. Use Value: Collision detection (COLL/COLR) flags prevent data corruption during concurrent access, satisfying IEC 62304 safety requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 70T3589S133BG | 256-pin BGA package (BC256), supports JTAG; same electrical specs and timing | Requires PCB redesign for BGA layout; preferred for new designs needing boundary scan testability | Select when JTAG debug capability and higher pin-count routing flexibility are required |
| 70T3589S166DR | Same DR208 PQFP package but rated for 166MHz (6ns cycle time); higher IDD (450mA max) | Delivers 25% higher bandwidth but increases thermal load; requires tighter power delivery design | Select when system clock budget permits 166MHz and thermal margin supports increased current draw |
Compared with 70T3589S133DR, the 70T3589S133BG offers JTAG testability in a denser BGA footprint, while 70T3589S166DR trades higher speed and power for backward-compatible PQFP packaging-neither is pin-compatible due to differing pin counts and JTAG signal allocation.
Availability
70T3589S133DR is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, avionics, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for 70T3589S133DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF power solutions for high-performance computing and communications.
The 70T35xx family was designed specifically for deterministic, low-latency inter-processor communication in systems requiring concurrent access to shared memory-targeting telecom, defense, and medical imaging applications.
FAQ
What is the maximum operating frequency of the 70T3589S133DR?
The 70T3589S133DR is rated for 133MHz operation (7.5ns clock cycle time) across the industrial temperature range (–40°C to +85°C). This is confirmed in the AC Electrical Characteristics table (Page 12, Table 11) under the S133 version column. Higher frequencies (e.g., 166MHz) are supported only in other variants like 70T3589S166DR and are not guaranteed for this specific part number.
Does the 70T3589S133DR support JTAG boundary scan?
No, the 70T3589S133DR does not support JTAG boundary scan. As stated in the Pin Configuration notes (Page 4, Note 9), "Due to limited pin count, JTAG is not supported in the DR208 package." JTAG signals (TCK, TMS, TDI, TDO, TRST) are omitted from the 208-pin PQFP pinout, unlike BGA variants such as 70T3589S133BG.
How do I configure the I/O voltage for each port on the 70T3589S133DR?
Configure I/O voltage per port using the OPTL and OPTR pins. Set OPTL = VDD (2.5V) for 3.3V I/O on the left port (requiring VDDQL = 3.3V); set OPTL = VSS (0V) for 2.5V I/O (requiring VDDQL = 2.5V). OPTR controls the right port identically and independently. This is detailed in Pin Names table (Page 6) and DC Operating Conditions (Pages 8–9).
What is the function of the ZZL and ZZR pins on the 70T3589S133DR?
ZZL and ZZR are independent sleep mode inputs for the left and right ports. When asserted high (VIH), they disable dynamic inputs (except JTAG, which is absent here), reducing current to 5–15mA typical. Static inputs (PL/FTx, OPTx, ZZx) remain active. Sleep mode recovery requires three clock cycles, as specified in Table 11 (tZZRC = 3 cycles).
Are A16 and A17 pins functional on the 70T3589S133DR?
No, A16L, A16R, A17L, and A17R are no-connect (NC) pins on the 70T3589S133DR. The datasheet explicitly states in multiple locations-including Pin Configuration (Pages 4 & 5, Notes 1 & 2) and Pin Names table (Page 6, Note 6)-that "Addresses A17 and A16 are NC's for the IDT70T3589." These pins must be left unconnected or tied to ground per PCB design guidelines.
70T3589S133DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PQFP (28x28)
70T3589S133DR FAQ
1.How can I place an order for 70T3589S133DR through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3589S133DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3589S133DR reliable?
The price and inventory of 70T3589S133DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S133DR is usually 5 days.
3.What payment methods are accepted for 70T3589S133DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3589S133DR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3589S133DR?
70T3589S133DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3589S133DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3589S133DR?
For technical support, including 70T3589S133DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3589S133DR requirements.
6.How does Aetrix verify that 70T3589S133DR is sourced from the original manufacturer or authorized distributors?
All 70T3589S133DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S133DR meets industry standards.
7.What is the process for return or replacement of 70T3589S133DR?
All 70T3589S133DR units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S133DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3589S133DR part is unused and in its original packaging.
Return procedure for 70T3589S133DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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