Renesas 70T3589S133DRI

Overview

70T3589S133DRI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (7.5ns cycle time), supports independent 2.5V core and selectable 2.5V/3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric.

For engineers reviewing the 70T3589S133DRI datasheet, 70T3589S133DRI pinout, 70T3589S133DRI application, or 70T3589S133DRI equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), dual chip enables for depth expansion, JTAG IEEE 1149.1 compliance, and 256-pin BGA packaging with verified pin mapping for PCB layout verification.

Technical Context

This device implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz). Its dual-port memory array supports concurrent access without arbitration logic, while internal address counters with ADS strobe, CNTEN enable, and REPEAT latch provide burst addressing capability.

The 70T3589S133DRI integrates separate OPT pins per port to configure I/O voltage (2.5V or 3.3V) independently, with corresponding VDDQ supplies. Sleep mode (ZZL/ZZR) reduces dynamic power by disabling non-JTAG inputs, and collision/interrupt flags (COLL/INTR, COLR/INTR) signal concurrent access conflicts between ports.

Key Specifications

Pinout & Package

256-pin Ball Grid Array (BGA) package with 17mm × 17mm footprint and 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin configuration (2.5V if OPT = VSS, 3.3V if OPT = VDD).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with IDT70T3589S133PFI and CY7C1362AV33-133BZI, the 70T3589S133DRI uniquely combines industrial-temperature 133MHz operation, JTAG testability, and per-port I/O voltage flexibility-making it the sole option for new mixed-voltage telecom and radar designs requiring full boundary scan coverage.

Availability

70T3589S133DRI is available at Aetrix Electronics and suitable for telecom switching fabric, network packet buffering, and real-time industrial control applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3589S133DRI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF power solutions for communications and computing infrastructure.

The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in telecom, networking, and defense systems-emphasizing deterministic timing, mixed-voltage interoperability, and robust testability.

FAQ

What is the maximum operating frequency of the 70T3589S133DRI at industrial temperature?

The 70T3589S133DRI is rated for 133MHz operation across the full industrial temperature range (–40°C to +85°C), with a guaranteed 7.5ns clock cycle time (tCYC2) in pipelined mode. This specification is validated per datasheet Table 11 and applies exclusively to the 256-pin BGA package variants-166MHz and 200MHz grades are not available in industrial temperature for this part number.

Does the 70T3589S133DRI support JTAG boundary scan testing?

Yes, the 70T3589S133DRI supports full IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. JTAG functionality is explicitly enabled in the 256-pin BGA package (BC256/BCG256) per datasheet Section 3 and Figure 2; it is omitted in the 208-pin fpBGA and PQFP variants per note on page 4.

How does the OPT pin configuration affect I/O voltage levels on the 70T3589S133DRI?

On the 70T3589S133DRI, OPTL and OPTR independently set I/O voltage per port: when OPT = VDD (2.5V), the corresponding port operates at 3.3V logic levels and requires VDDQ = 3.3V; when OPT = VSS (0V), the port operates at 2.5V levels with VDDQ = 2.5V. This enables mixed-voltage interfacing-for example, left port at 3.3V to a microcontroller and right port at 2.5V to an FPGA.

What is the purpose of the REPEAT pin on the 70T3589S133DRI?

The REPEATL and REPEATR pins on the 70T3589S133DRI latch the last valid address loaded via ADSL or ADSR, allowing the internal address counter to restart from that location on subsequent cycles. This enables efficient burst transfers without reissuing full addresses-critical for streaming applications like packet buffering or radar sample processing where sequential access patterns dominate.

Can the 70T3589S133DRI operate with different supply voltages on left and right ports?

Yes, the 70T3589S133DRI supports independent supply configurations: its core (VDD) is fixed at 2.5V, but VDDQL and VDDQR can be set to either 2.5V or 3.3V depending on OPTL/OPTR states. This allows the left port to interface with 3.3V logic while the right port connects to 2.5V circuitry-eliminating external level shifters and simplifying mixed-voltage system design.