Renesas 70T3589S166BF
- Part No.:
- 70T3589S166BF
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T3589S166BF.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3589S166BF from Integrated Device Technology is a high-speed 64K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (3.6ns access), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined/flow-through output modes, JTAG IEEE 1149.1 compliance, and industrial temperature range (–40°C to +85°C) - deployed in real-time DSP co-processing and network packet buffering systems.
For engineers reviewing the 70T3589S166BF datasheet, 70T3589S166BF pinout, 70T3589S166BF application, or 70T3589S166BF equivalent, key selection criteria include dual-port timing coordination, VDDQ voltage configuration per port, sleep mode (ZZ) behavior, collision/interrupt flag latency, and fpBGA-208 package layout constraints for high-density PCB routing.
Technical Context
This device implements fully synchronous operation on both ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz). Its dual-chip-enable architecture allows depth expansion without external logic, while counter enable (CNTEN) and repeat (REPEAT) functions support burst-addressed streaming applications.
The memory array uses true dual-port cells with self-timed write cycles, and supports independent power-down per port via CE0/CE1. The OPT pin configures each port's I/O voltage level (2.5V or 3.3V), requiring corresponding VDDQ supply alignment-no shared rail assumption between ports.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64K × 36 bits (2.304 Mbit); usable as 64K × 32 + parity or two independent 64K × 18 banks |
| Max Clock Frequency | 166MHz (industrial grade); enables 5ns cycle time in pipelined mode for 14Gbps aggregate bandwidth |
| Access Time | 3.6ns (max) at 166MHz pipelined mode; determines minimum clock-to-data valid delay in real-time pipelines |
| I/O Voltage Support | Selectable 2.5V or 3.3V per port via OPT pin; requires matching VDDQ supply and VIH/VIL thresholds |
| Operating Temperature | –40°C to +85°C; validated for industrial environments with full AC/DC specs across range |
| Package | 208-pin fine-pitch BGA (BF208/BFG208); 15mm × 15mm body, 0.8mm ball pitch, no JTAG support |
| Sleep Mode Current | 5–20mA (typ/max) with ZZR/ZZL asserted; shuts down dynamic inputs except JTAG, preserving boundary scan capability |
Pinout & Package
208-pin fine-pitch Ball Grid Array (fpBGA), package code BF208/BFG208. Body size: 15mm × 15mm × 1.4mm, 0.8mm ball pitch. All VDD pins require 2.5V ±100mV; VDDQ pins must match OPT pin setting (3.3V if OPT = VDD, 2.5V if OPT = VSS).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Edge-triggered master clock for respective port; all registers (address, data, control) sample on rising edge |
| A0L–A15L / A0R–A15R | Address inputs | 16-bit address bus per port; A16/A17 are No Connect for 70T3589, reducing routing complexity |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel interface per port; byte enables (BE0–BE3) allow 9-bit granularity writes without masking logic |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Independent port enable; CE0=low + CE1=high activates port; dual CE allows seamless depth expansion |
| PL/FTL / PL/FTR | Output mode select | Configures pipelined (VIH) or flow-through (VIL) output; pipelined adds 1-cycle latency but improves throughput |
| ZZL / ZZR | Sleep mode control | Asynchronous active-high sleep; disables dynamic inputs (except JTAG) to reduce standby current to 5–20mA |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cell | Enables concurrent read/write to identical addresses-critical for producer-consumer FIFOs in telecom baseband processing |
| Dual-cycle deselect (DCD) | Prevents metastability during rapid chip disable by delaying deactivation over two clocks-ensures clean bus release |
| Separate OPT pin per port | Allows mixed-voltage system integration: e.g., left port at 3.3V (FPGA interface), right port at 2.5V (ASIC core) |
| Interrupt & collision detection | Dedicated INTL/INTR and COLL/COLR flags with sub-7ns assertion-enables lock-free synchronization in real-time OS kernels |
| JTAG IEEE 1149.1 compliance | Supports boundary scan testing on BGA-256 variant; omitted in BF208 due to pin count limitation |
Applications
| Telecom Packet Buffering | DSP Co-Processor Interface |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet frames in a line card where ingress and egress paths operate independently. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between MAC and switch fabric controllers, with left port handling RX and right port handling TX. Use Value: Simultaneous access eliminates arbitration delays; 3.6ns access ensures sub-10ns round-trip latency for 10Gbps packet steering. | Use Scenario: Real-time audio/video processing where a DSP writes processed samples while a host processor reads results. IC Role / Device Role / Timing Role: Memory bridge between C6000-series DSP (3.3V I/O) and ARM host (2.5V I/O), configured via separate OPT pins. Use Value: Independent voltage domains eliminate level shifters; pipelined mode sustains 166MHz throughput for 24-bit stereo audio at 192kHz. |
| Radar Signal Processing | Industrial PLC Data Exchange |
Use Scenario: Capturing ADC samples from phased-array radar front-end while FPGA performs beamforming in parallel. IC Role / Device Role / Timing Role: Left port accepts ADC data stream (flow-through mode for deterministic latency); right port feeds beamformed output to DAC controller (pipelined for throughput). Use Value: Dual-mode flexibility meets conflicting requirements: <10ns latency for capture path, >100MB/s sustained bandwidth for processing path. | Use Scenario: Synchronizing motion control I/O between safety PLC and main controller in factory automation. IC Role / Device Role / Timing Role: Shared memory for cyclic process data exchange; collision detection flags prevent data corruption during overlapping writes. Use Value: Hardware-level collision alert (COLL/COLR) replaces software polling, reducing CPU load by >40% in SIL2-certified architectures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166BZXI | 3.3V-only core/I/O; no OPT-selectable voltage; 166MHz max; 64K × 36 in 208-pin TQFP | Lacks mixed-voltage support and sleep mode; higher static current (ISB1 = 230mA vs. 175mA) | Choose when board already uses 3.3V-only design and TQFP footprint is preferred over BGA. |
| IDT70V27L15PF8 | Lower density (32K × 18); 15ns access; 3.3V I/O only; 100-pin TQFP; no JTAG or collision detection | Targeted at cost-sensitive legacy systems; lacks interrupt/collision flags and pipelined mode | Choose only for retrofitting older designs where 32K × 18 capacity suffices and feature reduction is acceptable. |
Compared with CY7C1362BV33-166BZXI and IDT70V27L15PF8, the 70T3589S166BF provides unique mixed-voltage I/O configurability, hardware collision detection, and industrial-grade 166MHz performance in fpBGA-making it the sole option for new designs requiring voltage-flexible, real-time synchronized dual-port memory.
Availability
70T3589S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, radar signal processing, industrial PLC data exchange, and DSP co-processor interfacing requiring stable component supply across extended product lifecycles.
Supply support for 70T3589S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in real-time systems-emphasizing simultaneous port operation, flexible voltage interfaces, and deterministic timing under industrial conditions.
FAQ
What is the maximum operating frequency of the 70T3589S166BF in industrial temperature range?
The 70T3589S166BF is rated for 166MHz operation across the full industrial temperature range (–40°C to +85°C), with guaranteed 3.6ns maximum access time in pipelined mode. This specification is validated per datasheet Table 12 and applies only to the BF208 fpBGA package; 200MHz operation is not supported in this package variant.
Does the 70T3589S166BF support independent I/O voltage levels on left and right ports?
Yes, the 70T3589S166BF supports independent I/O voltage selection per port using OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O operation with VDDQL = 3.3V; setting OPTR = VSS (0V) configures the right port for 2.5V I/O with VDDQR = 2.5V. This enables mixed-voltage system integration without external level shifters.
How does the sleep mode (ZZ) function on the 70T3589S166BF affect JTAG testability?
When ZZR or ZZL is asserted high, the 70T3589S166BF disables all dynamic inputs except JTAG signals (TCK, TMS, TDI, TDO, TRST). Boundary scan remains fully operational during sleep mode, allowing in-system test and debug without waking the memory core-critical for low-power diagnostic modes in field-deployed equipment.
What is the purpose of the REPEAT and CNTEN pins on the 70T3589S166BF?
The CNTEN pin enables the internal address counter on each port's rising clock edge, while REPEAT resets the counter to the last valid address loaded via ADS. Together, they support burst-mode sequential addressing-e.g., streaming ADC samples into contiguous memory locations without external address generation logic. This reduces FPGA resource usage in data acquisition systems using the 70T3589S166BF.
Are A16 and A17 address pins functional on the 70T3589S166BF?
No, A16L, A16R, A17L, and A17R are No Connect (NC) pins on the 70T3589S166BF, as confirmed in datasheet Note 2 on page 3 and Pin Names table footnote 6. The device implements only 16-bit addressing (A0–A15) for its 64K × 36 configuration, simplifying PCB layout and eliminating unused address traces.
70T3589S166BF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 64K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70T3589S166BF FAQ
1.How can I place an order for 70T3589S166BF through Aetrix?
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The price and inventory of 70T3589S166BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S166BF is usually 5 days.
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For technical support, including 70T3589S166BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3589S166BF requirements.
6.How does Aetrix verify that 70T3589S166BF is sourced from the original manufacturer or authorized distributors?
All 70T3589S166BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S166BF meets industry standards.
7.What is the process for return or replacement of 70T3589S166BF?
All 70T3589S166BF units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S166BF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3589S166BF part is unused and in its original packaging.
Return procedure for 70T3589S166BF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3589S166BF Tags

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