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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3589S166BF8

Name: 70T3589S166BF8
Brand: Renesas
SKU: 70T3589S166BF8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3589S166BF8

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70T3589S166BF8.pdf

Description:: IC SRAM 2MBIT PARALLEL 208CABGA

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Product details

Overview

70T3589S166BF8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (3.6ns access time), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes. It is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70T3589S166BF8 datasheet, 70T3589S166BF8 pinout, 70T3589S166BF8 application, or 70T3589S166BF8 equivalent, key selection criteria include industrial temperature support (−40°C to +85°C), 208-pin fpBGA package, JTAG-compliant IEEE 1149.1 test interface, and dual chip enable for depth expansion without external logic.

Technical Context

This device implements fully synchronous operation on both left and right ports with register-controlled inputs for minimal setup/hold timing-1.5ns setup and 0.5ns hold at 200MHz. Its dual-port memory array uses true dual-port cells, not pseudo-dual-port emulation, enabling concurrent access without arbitration overhead.

The architecture includes independent address counters with ADS strobe, CNTEN enable, and REPEAT latch per port; configurable sleep mode via ZZL/ZZR pins; and byte-enable granularity (four 9-bit bytes) with asynchronous OE control. Pipelined output mode reduces tCD to 3.6ns at 166MHz, while flow-through mode provides deterministic 12ns latency.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 36 bits (9.2 Mbit); supports burst data transfers in telecom and networking ASIC interfaces.
Max Clock Frequency	166 MHz (industrial grade); enables 5 ns cycle time for high-throughput buffer applications.
Access Time	3.6 ns (max, pipelined mode); guarantees sub-4ns data valid after clock edge for tight-timing systems.
Supply Voltages	VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150 mV per port (I/O); enables mixed-voltage system integration.
Operating Temperature	−40°C to +85°C; qualified for industrial-grade deployment in base station and industrial controller environments.
Package	208-pin fine-pitch BGA (BF208/BFG208); 15 mm × 15 mm body, 0.8 mm ball pitch, RoHS-compliant green variant available.
JTAG Support	IEEE 1149.1 compliant; full boundary-scan capability enabled-critical for board-level testability in dense PCBs.

Pinout & Package

70T3589S166BF8 is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA) package designated BF208/BFG208, with 15 mm × 15 mm footprint and 0.8 mm ball pitch. All VDD pins require 2.5 V supply; VDDQ pins must match OPT pin configuration (2.5 V if OPT = VSS, 3.3 V if OPT = VDD).

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port clock input	Synchronous edge-triggered timing reference for all registered inputs/outputs on respective port.
A0L–A15L / A0R–A15R	Address inputs	16-bit address bus per port; A16/A17 are no-connect for 70T3589, simplifying routing vs. higher-density variants.
I/O0L–I/O35L / I/O0R–I/O35R	Bidirectional data bus	36-bit wide data path per port; supports independent read/write operations with byte-enable (BE0–BE3) control.
CE0L/CE1L / CE0R/CE1R	Chip enable pair	Dual CE architecture allows seamless depth expansion (e.g., 512K×36) using simple logic-no external decoder required.
PL/FTL / PL/FTR	Output mode select	Configures port output pipeline depth: VIH = pipelined (lower tCD), VIL = flow-through (deterministic latency).
ZZL / ZZR	Sleep mode control	Asynchronous active-high signal disabling dynamic inputs (except JTAG), reducing standby current to ≤20 mA.
TCK/TMS/TDI/TDO/TRST	JTAG interface	Fully compliant IEEE 1149.1 TAP controller; enables boundary-scan testing and in-system programming support.

Key Features

Feature	Design Value
True dual-port memory cell architecture	Enables simultaneous, conflict-free read/write access to identical addresses-eliminates arbitration logic in FPGA-to-ASIC interconnect buffers.
Dual-cycle deselect (DCD) in pipelined mode	Guarantees clean bus release after two clocks when chip enables deactivate-prevents metastability in multi-port memory systems.
Independent per-port voltage selection	OPTL/OPTR pins allow left port at 3.3 V and right port at 2.5 V-supports heterogeneous SoC interfacing without level shifters.
Address counter with ADS/CNTEN/REPEAT	Reduces address bus loading in burst transfers; REPEAT latches last ADS-loaded address for auto-incremented sequential reads.
Interrupt and collision detection flags	INTR/COLR and INTL/COLL outputs signal port contention or completion events-enables hardware-accelerated flow control in real-time systems.

Applications

Telecom Line Card Buffering	Real-Time Industrial PLC Memory
Use Scenario: Storing and forwarding variable-length ATM or Ethernet frames between line interface and switch fabric ASICs. IC Role / Device Role / Timing Role: Dual-port SRAM acts as non-blocking, low-latency frame buffer-left port accepts ingress traffic, right port services egress scheduler. Use Value: 3.6 ns pipelined access ensures sub-4 ns data availability for 166 MHz scheduler clocks, minimizing jitter in packet scheduling.	Use Scenario: Holding real-time I/O status, motion control parameters, and safety-critical state variables in programmable logic controllers. IC Role / Device Role / Timing Role: Serves as deterministic shared memory between CPU core and safety monitor co-processor-both access same data with atomic consistency. Use Value: −40°C to +85°C rating and ZZ sleep mode support ensure reliable operation during thermal cycling and power-save states in factory-floor environments.
Network Processor Packet Buffer	Avionics Data Concentrator
Use Scenario: Temporary storage of fragmented IP packets undergoing reassembly or deep packet inspection in network processors. IC Role / Device Role / Timing Role: Provides parallel access for parser engine (read) and classifier engine (write) on same memory space-no software synchronization needed. Use Value: Independent BE0–BE3 enables selective byte writes during partial packet updates-reducing bus bandwidth and avoiding full-word overwrites.	Use Scenario: Aggregating sensor telemetry (ARINC 429, MIL-STD-1553) and actuator commands across multiple avionics LRUs. IC Role / Device Role / Timing Role: Acts as time-deterministic shared memory between flight control computer and health monitoring unit-guaranteed 5 ns cycle time meets DO-254 timing budgets. Use Value: JTAG IEEE 1149.1 compliance enables in-flight boundary-scan diagnostics and post-deployment fault isolation without physical probe access.

Telecom Line Card Buffering

Real-Time Industrial PLC Memory

Use Scenario: Storing and forwarding variable-length ATM or Ethernet frames between line interface and switch fabric ASICs.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as non-blocking, low-latency frame buffer-left port accepts ingress traffic, right port services egress scheduler.

Use Value: 3.6 ns pipelined access ensures sub-4 ns data availability for 166 MHz scheduler clocks, minimizing jitter in packet scheduling.

Use Scenario: Holding real-time I/O status, motion control parameters, and safety-critical state variables in programmable logic controllers.

IC Role / Device Role / Timing Role: Serves as deterministic shared memory between CPU core and safety monitor co-processor-both access same data with atomic consistency.

Use Value: −40°C to +85°C rating and ZZ sleep mode support ensure reliable operation during thermal cycling and power-save states in factory-floor environments.

Network Processor Packet Buffer

Avionics Data Concentrator

Use Scenario: Temporary storage of fragmented IP packets undergoing reassembly or deep packet inspection in network processors.

IC Role / Device Role / Timing Role: Provides parallel access for parser engine (read) and classifier engine (write) on same memory space-no software synchronization needed.

Use Value: Independent BE0–BE3 enables selective byte writes during partial packet updates-reducing bus bandwidth and avoiding full-word overwrites.

Use Scenario: Aggregating sensor telemetry (ARINC 429, MIL-STD-1553) and actuator commands across multiple avionics LRUs.

IC Role / Device Role / Timing Role: Acts as time-deterministic shared memory between flight control computer and health monitoring unit-guaranteed 5 ns cycle time meets DO-254 timing budgets.

Use Value: JTAG IEEE 1149.1 compliance enables in-flight boundary-scan diagnostics and post-deployment fault isolation without physical probe access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166BZI	3.3 V core (not 2.5 V); 166 MHz max; 256K × 36; 208-pin TQFP (not fpBGA)	Lacks per-port I/O voltage selection and JTAG; requires external level translation for mixed-voltage designs	Select only if legacy TQFP layout reuse is mandatory and 2.5 V core compatibility is not required.
IDT70V3589S166PF	Same architecture but 256-pin BGA; supports 200 MHz (S200 suffix); commercial temp only (0°C to +70°C)	Higher speed but no industrial temp rating; larger package increases PCB area and routing complexity	Choose only for commercial-grade systems needing >166 MHz throughput and available board space for 256-pin BGA.

Compared with CY7C1362BV33-166BZI and IDT70V3589S166PF, the 70T3589S166BF8 uniquely combines industrial temperature range, per-port I/O voltage flexibility, and compact fpBGA packaging-making it optimal for space-constrained, mixed-voltage, mission-critical embedded systems.

Availability

70T3589S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for 70T3589S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications and computing markets.

The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in networking, telecom, and real-time control systems-emphasizing deterministic timing, industrial reliability, and flexible voltage interoperability.

FAQ

What is the maximum operating frequency of the 70T3589S166BF8 under industrial temperature conditions?

The 70T3589S166BF8 is rated for 166 MHz operation across the full industrial temperature range of −40°C to +85°C. This is confirmed in the AC Electrical Characteristics table (page 12), where tCYC2 = 6 ns (min) and tCD2 = 3.6 ns (max) are guaranteed for S166 versions in industrial grade. The BF208 package does not support 200 MHz operation per datasheet note #7.

Does the 70T3589S166BF8 support independent voltage selection on its left and right ports?

Yes, the 70T3589S166BF8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5 V) configures the left port for 3.3 V I/O levels with VDDQL = 3.3 V; setting OPTR = VSS (0 V) configures the right port for 2.5 V I/O levels with VDDQR = 2.5 V. This is documented in Pin Names table (page 6) and DC Operating Conditions (pages 8–9).

What package type and dimensions does the 70T3589S166BF8 use?

The 70T3589S166BF8 uses a 208-pin fine-pitch Ball Grid Array (fpBGA) package designated BF208/BFG208. Its mechanical dimensions are 15 mm × 15 mm × 1.4 mm with 0.8 mm ball pitch. This is specified in the Pin Configuration section (page 5) and confirmed in the ordering information footnote.

How does the sleep mode (ZZ) function on the 70T3589S166BF8?

Asserting ZZL or ZZR high disables dynamic inputs (clock, address, control, data) on the corresponding port, reducing current draw to ≤20 mA (ISB3/ISB4). JTAG inputs remain active during sleep mode, but boundary-scan is not recommended per datasheet note #4. Sleep mode recovery requires three clock cycles (tZZRC), as defined in AC Electrical Characteristics (page 12).

Is JTAG boundary-scan supported on the 70T3589S166BF8, and what are its limitations?

Yes, the 70T3589S166BF8 supports full IEEE 1149.1 JTAG boundary-scan via TCK, TMS, TDI, TDO, and TRST pins. Unlike the DR208 PQFP variant, the BF208 fpBGA package retains JTAG functionality. However, boundary-scan operation is not recommended during sleep mode (ZZ asserted), as stated in Pin Names note #4.

70T3589S166BF8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 2Mbit

Memory Organization:: 64K x 36

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70T3589S166BF8 FAQ

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Please submit a Request for Quotation (RFQ) for 70T3589S166BF8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 70T3589S166BF8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S166BF8 is usually 5 days.

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6.How does Aetrix verify that 70T3589S166BF8 is sourced from the original manufacturer or authorized distributors?

All 70T3589S166BF8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S166BF8 meets industry standards.

7.What is the process for return or replacement of 70T3589S166BF8?

All 70T3589S166BF8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S166BF8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3589S166BF8 part is unused and in its original packaging.

Return procedure for 70T3589S166BF8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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