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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70T3589S200BC

Name: 70T3589S200BC
Brand: Renesas
SKU: 70T3589S200BC
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70T3589S200BC

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70T3589S200BC.pdf

Description:: IC SRAM 2MBIT PARALLEL 256CABGA

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Product details

Overview

70T3589S200BC from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture, 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, and pipelined or flow-through output mode. It supports simultaneous read/write access to the same memory location and delivers 3.4ns clock-to-data-out at 200MHz for telecom switching fabric and packet buffer applications.

For engineers reviewing the 70T3589S200BC datasheet, 70T3589S200BC pinout, 70T3589S200BC application, or 70T3589S200BC equivalent, key selection criteria include dual-port timing latency, independent port voltage configuration (OPTL/OPTR), JTAG-compliant boundary scan support, and industrial-grade operation up to 166MHz in BC256 BGA package.

Technical Context

This device implements fully synchronous dual-port operation with separate address, data, and control registers on left and right ports-enabling minimal 1.5ns setup and 0.5ns hold times at 200MHz. Each port features independent clock (CLKL/CLKR), chip enables (CE0L/CE1L, CE0R/CE1R), byte enables (BE0–BE3), and pipeline/flow-through mode selection (PL/FTL, PL/FTR).

It integrates address counter logic with ADS strobe, CNTEN enable, and REPEAT latch functionality per port, plus collision detection and interrupt flags (COLL/INTR, COLR/INTL) for real-time arbitration. Sleep mode (ZZL/ZZR) reduces dynamic current to 5mA while preserving JTAG accessibility.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 36 bits (9-Mbit total); supports depth expansion via dual chip enables without external logic
Max Clock Frequency	200MHz (commercial grade only); enables 14Gbps aggregate bandwidth with 5ns cycle time
Access Time	3.4ns (clock-to-data-out, pipelined mode); meets tight timing budgets in high-speed packet forwarding engines
Supply Voltages	VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port, selected independently via OPTL/OPTR pins
Operating Temperature	Commercial: 0°C to +70°C; industrial variant (S166/S133) supports –40°C to +85°C but not at 200MHz
Package	256-pin BGA (BC256); 17mm × 17mm body, 1.0mm ball pitch; no NC pins on A16/A17 for left/right ports
JTAG Support	IEEE 1149.1 compliant (TCK/TMS/TDI/TDO/TRST); available only in BC256 and BCG256 packages-not in DR208 or BF208

Pinout & Package

70T3589S200BC is packaged in a 256-pin Ball Grid Array (BC256) with 17mm × 17mm footprint and 1.0mm ball pitch. All VDD pins require 2.5V; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS). A16L, A17L, A16R, A17R are No-Connect pins per datasheet Note 2.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-synchronous clock input	Drives all internal registers per port; rising-edge triggered; enables full synchronous operation with 1.5ns setup on all inputs
CE0L/CE1L, CE0R/CE1R	Dual chip enable inputs	Double-buffered when PL/FT = VIH; allows depth expansion without glue logic; CE0X = VIL & CE1X = VIH enables port
PL/FTL / PL/FTR	Pipeline/Flow-through mode select	VIH = pipelined (3.4ns tCD2, 5ns tCYC2); VIL = flow-through (10ns tCD1, 15ns tCYC1); per-port configurable
OPTL / OPTR	I/O voltage option control	Selects VDDQ level: VDD (2.5V) → 3.3V I/O interface; VSS (0V) → 2.5V I/O interface; independent per port
ZZL / ZZR	Sleep mode enable	Asserting VIH disables dynamic inputs (except JTAG), reducing IDD to 5mA; static inputs (PL/FT, OPT) remain active
ADSL / ADSR	Address strobe enable	Latches external address into internal counter; enables repeatable burst addressing when combined with CNTEN/REPEAT

Key Features

Feature	Design Value
True dual-port memory cells	Enables simultaneous read/write to identical addresses-critical for lock-free FIFOs and shared buffer coherency
Dual-cycle deselect (DCD)	Prevents metastability during rapid port disable; ensures clean bus release in pipelined mode with two-cycle latency
Per-port voltage flexibility	Independent 2.5V/3.3V I/O interface per port via OPTL/OPTR-supports mixed-voltage system interconnect (e.g., 3.3V FPGA ↔ 2.5V ASIC)
Collision and interrupt flags	COLL/INTR and COLR/INTL outputs signal concurrent access to same address-enables hardware arbitration without software polling
Address counter with repeat	ADSL loads address; CNTEN increments; REPEAT resets to last ADS-loaded value-ideal for sequential burst transfers in DMA engines

Applications

Telecom Switching Fabric	Network Packet Buffer
Use Scenario: High-throughput line card buffering where ingress and egress paths access shared memory concurrently. IC Role / Device Role / Timing Role: Dual-port SRAM serving as non-blocking crosspoint buffer with independent 200MHz clocks per port. Use Value: 3.4ns tCD2 latency and 14Gbps bandwidth enable wire-speed 10G Ethernet packet queuing without head-of-line blocking.	Use Scenario: Deep packet inspection engine requiring parallel access to header and payload segments. IC Role / Device Role / Timing Role: Shared memory resource accessed simultaneously by parser (left port) and classifier (right port). Use Value: True dual-port architecture eliminates arbitration delay; collision flags trigger immediate reordering-reducing average packet latency by >12ns.
Real-Time Industrial Controller	Radar Signal Processing
Use Scenario: Deterministic motion control loop where PLC logic writes setpoints and servo driver reads them with sub-microsecond consistency. IC Role / Device Role / Timing Role: Synchronous dual-port RAM acting as low-latency command/status register bank between CPU and FPGA-based motion engine. Use Value: 1.5ns address setup and 0.5ns hold time guarantee timing closure at 200MHz-even under -40°C to +85°C industrial thermal cycling.	Use Scenario: Phased-array radar beamformer requiring simultaneous write of ADC samples and read of coefficient tables. IC Role / Device Role / Timing Role: Memory hub interfacing high-speed ADC (left port) and DSP core (right port) with independent clock domains. Use Value: Per-port OPT configuration allows 3.3V ADC interface and 2.5V DSP interface-eliminating level shifters and reducing BOM count by 3 components.

Telecom Switching Fabric

Network Packet Buffer

Use Scenario: High-throughput line card buffering where ingress and egress paths access shared memory concurrently.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as non-blocking crosspoint buffer with independent 200MHz clocks per port.

Use Value: 3.4ns tCD2 latency and 14Gbps bandwidth enable wire-speed 10G Ethernet packet queuing without head-of-line blocking.

Use Scenario: Deep packet inspection engine requiring parallel access to header and payload segments.

IC Role / Device Role / Timing Role: Shared memory resource accessed simultaneously by parser (left port) and classifier (right port).

Use Value: True dual-port architecture eliminates arbitration delay; collision flags trigger immediate reordering-reducing average packet latency by >12ns.

Real-Time Industrial Controller

Radar Signal Processing

Use Scenario: Deterministic motion control loop where PLC logic writes setpoints and servo driver reads them with sub-microsecond consistency.

IC Role / Device Role / Timing Role: Synchronous dual-port RAM acting as low-latency command/status register bank between CPU and FPGA-based motion engine.

Use Value: 1.5ns address setup and 0.5ns hold time guarantee timing closure at 200MHz-even under -40°C to +85°C industrial thermal cycling.

Use Scenario: Phased-array radar beamformer requiring simultaneous write of ADC samples and read of coefficient tables.

IC Role / Device Role / Timing Role: Memory hub interfacing high-speed ADC (left port) and DSP core (right port) with independent clock domains.

Use Value: Per-port OPT configuration allows 3.3V ADC interface and 2.5V DSP interface-eliminating level shifters and reducing BOM count by 3 components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT70T3589S166BC	Same BC256 package and pinout; rated for 166MHz max (tCD2 = 3.6ns) with industrial temperature support (–40°C to +85°C)	Required for extended temperature environments where 200MHz operation is not needed	Select when industrial temp range is mandatory and 166MHz bandwidth suffices-reduces power by ~15% vs. S200BC
Cypress CY7C1362AV25-200BZI	256K × 36, 200MHz, 2.5V core-but uses 208-pin TQFP (DR208), lacks JTAG, and has fixed 3.3V I/O (no OPT-selectable VDDQ)	Suitable for cost-sensitive, non-JTAG designs where PCB layout accommodates larger PQFP footprint	Choose only if JTAG testability is unnecessary and board space permits 28mm × 28mm DR208 package-no voltage flexibility per port

Compared with IDT70T3589S166BC and CY7C1362AV25-200BZI, the 70T3589S200BC uniquely combines commercial-grade 200MHz performance, per-port I/O voltage selection, and IEEE 1149.1 JTAG in a compact 256-pin BGA-making it optimal for high-density, mixed-voltage, test-critical telecom and defense systems.

Availability

70T3589S200BC is available at Aetrix Electronics and suitable for telecom switching fabric, network packet buffer, and real-time industrial controller applications requiring stable component supply across long production lifecycles.

Supply support for 70T3589S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The IDT70T35xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in telecom infrastructure, military avionics, and industrial automation-emphasizing deterministic timing, voltage flexibility, and JTAG testability.

FAQ

What is the maximum operating frequency of the 70T3589S200BC?

The 70T3589S200BC is rated for 200MHz operation in commercial temperature range (0°C to +70°C), delivering a 5ns clock cycle time and 3.4ns clock-to-data-out in pipelined mode. It does not support 200MHz in industrial temperature range-only S166 and S133 speed grades do, with relaxed timing (3.6ns/4.2ns tCD2).

Does the 70T3589S200BC support independent I/O voltage selection per port?

Yes, the 70T3589S200BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures left-port I/Os for 3.3V operation with VDDQL = 3.3V; setting OPTL = VSS (0V) configures them for 2.5V operation with VDDQL = 2.5V-and likewise for the right port.

Which package options include JTAG support for the 70T3589S200BC?

JTAG support (TCK/TMS/TDI/TDO/TRST) is available only in the BC256 and BCG256 256-pin BGA packages for the 70T3589S200BC. It is explicitly excluded from DR208 (208-pin PQFP) and BF208/BFG208 (208-pin fpBGA) packages due to pin count limitations, as confirmed in datasheet Note 9.

Are A16 and A17 pins functional on the 70T3589S200BC?

No, A16L, A17L, A16R, and A17R are No-Connect (NC) pins on the 70T3589S200BC, as stated in datasheet Notes 1 and 2. The device implements only 16 address bits (A0–A15) for its 256K × 36 configuration-A16/A17 are reserved for higher-density variants like IDT70T3599.

How does sleep mode (ZZL/ZZR) affect JTAG functionality on the 70T3589S200BC?

When ZZL or ZZR is asserted (VIH), the 70T3589S200BC disables all dynamic inputs except JTAG signals (TCK, TMS, TDI, TDO, TRST). Static inputs-including PL/FTx and OPTx-remain active. Boundary scan is fully operational during sleep mode, though datasheet recommends avoiding JTAG activity during deep sleep for reliability.

70T3589S200BC Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 2Mbit

Memory Organization:: 64K x 36

Memory Interface:: Parallel

Clock Frequency:: 200 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.4 ns

Voltage - Supply:: 2.4V ~ 2.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70T3589S200BC FAQ

1.How can I place an order for 70T3589S200BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3589S200BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3589S200BC reliable?

The price and inventory of 70T3589S200BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3589S200BC is usually 5 days.

3.What payment methods are accepted for 70T3589S200BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3589S200BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3589S200BC?

70T3589S200BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3589S200BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3589S200BC?

For technical support, including 70T3589S200BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3589S200BC requirements.

6.How does Aetrix verify that 70T3589S200BC is sourced from the original manufacturer or authorized distributors?

All 70T3589S200BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3589S200BC meets industry standards.

7.What is the process for return or replacement of 70T3589S200BC?

All 70T3589S200BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3589S200BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3589S200BC part is unused and in its original packaging.

Return procedure for 70T3589S200BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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