Renesas 70T3589S200BC8

Overview

70T3589S200BC8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture, 2.5V core supply, selectable 2.5V/3.3V I/O interface per port, and pipelined or flow-through output mode. It supports simultaneous read/write access to the same memory location at 200MHz (5ns cycle time) in commercial temperature range (0°C to +70°C), targeting high-bandwidth inter-processor communication and real-time data buffering.

For engineers reviewing the 70T3589S200BC8 datasheet, 70T3589S200BC8 pinout, 70T3589S200BC8 application, or 70T3589S200BC8 equivalent, key selection criteria include its 200MHz operation with 3.4ns clock-to-data-out, dual chip enables for depth expansion, JTAG-compliant IEEE 1149.1 test support, and industrial-grade variants with 166MHz/133MHz speed grades.

Technical Context

This device implements fully synchronous dual-port operation on independent left and right ports, each with dedicated address, data, control, and clock inputs. Its internal architecture includes input registers for all control, address, and data signals, enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz) and deterministic timing.

The memory supports configurable I/O voltage per port via OPTL/OPTR pins-setting OPTX to VDD (2.5V) selects 3.3V I/O levels with corresponding VDDQX = 3.3V; setting OPTX to VSS (0V) selects 2.5V I/O levels with VDDQX = 2.5V. Sleep mode (ZZL/ZZR) disables dynamic inputs while preserving JTAG functionality.

Key Specifications

Pinout & Package

70T3589S200BC8 is housed in a 256-pin Ball Grid Array (BGA) package (package code BC256), with 17mm × 17mm footprint and 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must match selected I/O voltage (2.5V or 3.3V) per port based on OPTL/OPTR settings.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-200AXC and AS7C33256PFS-200BIN, the 70T3589S200BC8 uniquely combines 2.5V core efficiency, per-port I/O voltage selection, hardware collision detection, and IEEE 1149.1 JTAG-making it optimal for power-aware, mixed-voltage, safety-critical dual-processor systems.

Availability

70T3589S200BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, real-time signal processing, industrial automation, and network processor applications requiring stable component supply and long-term production continuity.

Supply support for 70T3589S200BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70T35xx family was designed specifically for high-bandwidth, low-latency inter-processor communication in telecom line cards, radar systems, and programmable logic controllers-emphasizing deterministic timing, voltage flexibility, and hardware-assisted concurrency control.

FAQ

What is the maximum operating frequency of the 70T3589S200BC8?

The 70T3589S200BC8 is rated for 200MHz operation (5ns clock cycle time) in the commercial temperature range (0°C to +70°C). This speed grade is exclusive to the BC256 BGA package and is not supported in fpBGA or PQFP variants. The device achieves 3.4ns clock-to-data-out in pipelined mode, enabling 14Gbps aggregate bandwidth across both ports.

Does the 70T3589S200BC8 support mixed-voltage operation between its two ports?

Yes, the 70T3589S200BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V. This enables direct interfacing with heterogeneous logic families without level-shifting components.

How does the collision detection feature work in the 70T3589S200BC8?

The 70T3589S200BC8 asserts COLL (left port) or COLR (right port) outputs within 3.4ns when both ports attempt simultaneous access to the same memory location. These open-drain flags require external pull-up resistors and can trigger interrupt service routines or hardware abort logic. Collision detection operates independently of chip enable states and remains active even in sleep mode (ZZ asserted), ensuring robust fault monitoring.

What package type is used for the 70T3589S200BC8?

The 70T3589S200BC8 uses a 256-pin Ball Grid Array (BGA) package with designation BC256. It has a 17mm × 17mm body size, 1.0mm ball pitch, and 1.4mm height. This package supports automated reflow assembly and provides superior thermal and electrical performance compared to PQFP alternatives-critical for sustained 200MHz operation in dense PCB layouts.

Can the 70T3589S200BC8 operate in industrial temperature range?

No, the 70T3589S200BC8 variant is specified only for commercial temperature range (0°C to +70°C) at 200MHz. Industrial-grade operation (–40°C to +85°C) is available only in slower speed grades: 70T3589S166BC8 (166MHz) and 70T3589S133BC8 (133MHz). Attempting 200MHz operation outside the commercial range violates datasheet specifications and may result in timing violations or data corruption.