Renesas 70T3599S133BC
- Part No.:
- 70T3599S133BC
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3599S133BC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3599S133BC from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (4.2ns access), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes for burst data applications in telecom line cards and network packet buffers.
For engineers reviewing the 70T3599S133BC datasheet, 70T3599S133BC pinout, 70T3599S133BC application, or 70T3599S133BC equivalent, this device delivers deterministic low-latency memory access with JTAG-compliant boundary scan, industrial temperature support (–40°C to +85°C), and dual chip enables for seamless depth expansion in high-throughput switching fabric designs.
Technical Context
The 70T3599S133BC implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling 5ns cycle time at 200MHz (though rated for 133MHz in industrial grade). Its dual-port memory array uses true dual-port cells, not pseudo-dual-port emulation, allowing concurrent access without arbitration logic.
It integrates independent address counters with ADS strobe, CNTEN enable, and REPEAT reset per port, plus collision detection and interrupt flags for real-time bus coordination. The device supports JTAG IEEE 1149.1 test access via dedicated TDI/TDO/TCK/TMS/TRST pins and includes sleep mode (ZZL/ZZR) that disables dynamic inputs while preserving JTAG functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.216 Mbit); supports 256K-word addressing with 36-bit parallel I/O per port |
| Access Time | 4.2 ns max (133MHz industrial grade); enables sub-8ns round-trip latency in pipelined read cycles |
| Operating Voltage | 2.5V ±100mV core (VDD); independent 2.5V or 3.3V I/O (VDDQ) per port via OPTL/OPTR configuration |
| Temperature Range | –40°C to +85°C industrial grade; validated for sustained operation at 133MHz under full thermal stress |
| Package | 256-pin BGA (BC256); 17mm × 17mm body, 1.0mm ball pitch, RoHS-compliant green variant available |
| Power Consumption | 260 mA max dynamic current (both ports active, 133MHz); 5 mA full standby (ISB3) with CMOS-level inputs |
| Output Mode | Selectable pipelined (tCD2 = 4.2ns) or flow-through (tCD1 = 15ns); reduces timing margin pressure in high-speed burst transfers |
Pinout & Package
70T3599S133BC is packaged in a 256-pin Ball Grid Array (BC256) with 17mm × 17mm footprint and 1.0mm ball pitch. All VDD pins require 2.5V supply; VDDQ pins must match OPT pin selection (3.3V if OPT = VDD, 2.5V if OPT = VSS). A17L and A17R are no-connect pins per datasheet note.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port clock input | Synchronous edge-triggered timing reference for all registered inputs/outputs on respective port |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A17L/A17R are NC per IDT70T3599 specification |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; byte-enable controlled (BE0–BE3) for 9-bit granularity writes |
| CE0L/CE1L / CE0R/CE1R | Chip enables | Dual CE architecture allows depth expansion without external logic; CE0=low + CE1=high enables port |
| R/WL / R/WR | Read/write control | Active-high write enable; synchronous with CLK edge; determines direction of data transfer on I/O bus |
| OEL / OER | Output enable | Asynchronous control; tri-states outputs independently of clock, enabling shared bus arbitration |
| PL/FTL / PL/FTR | Output mode select | DC-level input selecting pipelined (VIH) or flow-through (VIL) output timing behavior per port |
| ZZL / ZZR | Sleep mode input | Asserting VIH disables dynamic inputs (except JTAG), reducing current to 5mA ISB3 level |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cell architecture | Enables simultaneous read/write to identical addresses without internal arbitration delay or data corruption |
| Independent voltage-selectable I/O interfaces | Each port supports 2.5V or 3.3V signaling via OPTL/OPTR, allowing mixed-voltage system integration |
| Dual-cycle deselect (DCD) in pipelined mode | Prevents metastability during rapid chip disable by requiring two clock cycles to deassert outputs |
| Hardware address counter with repeat function | ADSL/ADSR strobes load base address; CNTENL/CNTENR enables auto-increment; REPEATL/REPEATR resets to last loaded address |
| JTAG boundary scan compliance (IEEE 1149.1) | Full TAP controller with TDI/TDO/TCK/TMS/TRST enables production test and in-system debug without additional hardware |
Applications
| Telecom Line Card Buffering | Network Packet Switching Fabric |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet frames between ingress and egress ports in Layer 2/L3 switches. IC Role / Device Role / Timing Role: Dual-port SRAM acts as non-blocking frame buffer, with one port receiving packets and the other transmitting-coordinated via collision detection flags. Use Value: 4.2ns access time and pipelined output mode reduce packet latency by up to 3.6ns versus flow-through, improving switch throughput at 133MHz. | Use Scenario: Implementing deep, low-latency lookup tables for MAC address or routing table entries in carrier-grade routers. IC Role / Device Role / Timing Role: Serves as high-speed associative memory where left port performs parallel search and right port updates entries-synchronized via shared clock domain. Use Value: True dual-port architecture eliminates arbitration overhead, enabling concurrent search/update operations critical for sub-microsecond forwarding decisions. |
| Industrial PLC Real-Time Data Exchange | Medical Imaging Frame Storage |
Use Scenario: Sharing sensor acquisition data between control CPU and safety monitoring unit in deterministic industrial automation systems. IC Role / Device Role / Timing Role: Acts as synchronized shared memory with interrupt-driven notification (INTL/INTR) upon write completion to ensure deterministic inter-processor handshaking. Use Value: Industrial temperature rating (–40°C to +85°C) and 133MHz guaranteed timing ensure reliable operation in harsh factory environments without derating. | Use Scenario: Buffering uncompressed DICOM image frames (e.g., 1024×1024×16-bit) during real-time MRI reconstruction pipelines. IC Role / Device Role / Timing Role: Provides burst-capable 36-bit wide memory interface to FPGA-based image processors, leveraging pipelined output mode for continuous pixel stream delivery. Use Value: 256K × 36 capacity stores 1.15M pixels per frame; 133MHz clock supports >4.7 Gbps aggregate bandwidth across both ports for real-time processing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 3.3V core and I/O; no 2.5V core option; 133MHz access but only commercial temp (0°C to +70°C) | Lacks industrial temperature support and mixed-voltage I/O flexibility; requires external level-shifting in 2.5V systems | Select when system uses 3.3V-only power domains and does not require extended temperature operation. |
| AS7C33256PFS-133BIN | Single-port architecture; asynchronous interface; 133MHz max frequency only in burst mode with wait states | No true dual-port capability; cannot perform simultaneous read/write; lacks JTAG and collision detection logic | Select only for cost-sensitive applications where concurrent access is unnecessary and latency tolerance exceeds 15ns. |
Compared with CY7C1362BV33-133AXC and AS7C33256PFS-133BIN, the 70T3599S133BC uniquely combines industrial temperature support, selectable 2.5V/3.3V I/O per port, and true dual-port concurrency-making it irreplaceable in deterministic real-time systems requiring guaranteed sub-5ns access and hardware collision management.
Availability
70T3599S133BC is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply across long product lifecycles and rigorous environmental certification.
Supply support for 70T3599S133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor signal conditioning ICs for communications and computing markets.
The 70T35xx family was designed specifically for high-bandwidth, low-latency dual-port memory applications in networking equipment, broadcast video systems, and real-time control systems where deterministic access and concurrent port operation are mandatory.
FAQ
What is the maximum guaranteed operating frequency of the 70T3599S133BC?
The 70T3599S133BC is rated for 133MHz operation across the industrial temperature range (–40°C to +85°C), with 4.2ns maximum access time. While the underlying architecture supports 200MHz in commercial-grade variants (e.g., 70T3599S200BC), the "S133" suffix explicitly denotes the 133MHz industrial version-validated for full performance under thermal stress without derating.
Does the 70T3599S133BC support mixed-voltage operation between its left and right ports?
Yes, the 70T3599S133BC supports independent I/O voltage selection per port: OPTL configures the left port's VDDQL supply (2.5V or 3.3V), and OPTR configures the right port's VDDQR supply. This allows one port to interface with a 2.5V FPGA while the other connects to a 3.3V microcontroller-without level shifters-provided each VDDQ rail matches its OPT setting.
How does the collision detection feature work in the 70T3599S133BC?
The 70T3599S133BC asserts COLL (left) or COLR (right) output flags when both ports attempt to access the same memory address simultaneously during a write cycle. Detection is hardware-implemented with 4.2ns set/reset timing (tCOLS/tCOLR), and flags remain asserted until cleared by a subsequent non-colliding access-enabling software or logic-based resolution without CPU polling overhead.
Is JTAG boundary scan supported on the 70T3599S133BC, and what are the requirements?
Yes, the 70T3599S133BC implements full IEEE 1149.1 JTAG boundary scan with dedicated TDI, TDO, TCK, TMS, and TRST pins. JTAG remains functional even in sleep mode (ZZL/ZZR asserted), but boundary scan operation is not recommended during sleep per datasheet guidance. No external pull-ups are required-the internal weak pull-ups meet JTAG voltage thresholds.
What package options are available for the 70T3599S133BC, and which one is used in this variant?
The 70T3599S133BC is offered exclusively in the 256-pin BGA (BC256) package with 17mm × 17mm body and 1.0mm ball pitch. The "BC" suffix in the part number explicitly denotes this BGA variant; fpBGA (BF208) and PQFP (DR208) packages are available for other speed grades but not for the S133 industrial version per IDT documentation.
70T3599S133BC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3599S133BC FAQ
1.How can I place an order for 70T3599S133BC through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3599S133BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3599S133BC reliable?
The price and inventory of 70T3599S133BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S133BC is usually 5 days.
3.What payment methods are accepted for 70T3599S133BC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3599S133BC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3599S133BC?
70T3599S133BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3599S133BC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3599S133BC?
For technical support, including 70T3599S133BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S133BC requirements.
6.How does Aetrix verify that 70T3599S133BC is sourced from the original manufacturer or authorized distributors?
All 70T3599S133BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S133BC meets industry standards.
7.What is the process for return or replacement of 70T3599S133BC?
All 70T3599S133BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S133BC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3599S133BC part is unused and in its original packaging.
Return procedure for 70T3599S133BC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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