My Inquiry
My Account
Renesas 70T3599S133BCI
- Part No.:
- 70T3599S133BCI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3599S133BCI.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,462
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70T3599S133BCI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location on independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric and network packet buffering applications.
For engineers reviewing the 70T3599S133BCI datasheet, 70T3599S133BCI pinout, 70T3599S133BCI application, or 70T3599S133BCI equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), JTAG-compliant IEEE 1149.1 testability, dual chip enables for depth expansion, and sleep mode (ZZL/ZZR) for dynamic power management in real-time embedded systems.
Technical Context
The 70T3599S133BCI implements fully synchronous operation on both ports with independent clock inputs (CLKL/CLKR), address strobe (ADSL/ADSR), and counter enable/repeat logic for sequential addressing without external controllers. Its dual-port memory array uses dedicated input/output registers per port to achieve minimal setup/hold times (1.5ns setup, 0.5ns hold @133MHz).
It supports configurable I/O voltage per port via OPTL/OPTR pins-setting OPTX to VDD (2.5V) enables 3.3V I/O operation with VDDQX = 3.3V; setting OPTX to VSS (0V) enables 2.5V I/O operation with VDDQX = 2.5V-allowing mixed-voltage system interfacing while maintaining a fixed 2.5V core supply (VDD).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9-Mbit total); supports 256K-word depth with 36-bit parallel interface per port. |
| Max Clock Frequency | 133MHz (7.5ns cycle time in pipelined mode); enables 9.5Gbps aggregate bandwidth (2 × 133MHz × 36-bit). |
| Access Time | 4.2ns max clock-to-data-out (tCD2) in pipelined mode; ensures deterministic latency for real-time buffer applications. |
| Operating Temperature | –40°C to +85°C industrial grade; validated for deployment in base station equipment and industrial control cabinets. |
| I/O Voltage Options | Selectable 2.5V or 3.3V per port via OPTL/OPTR; allows direct interfacing with legacy 3.3V FPGAs and modern 2.5V ASICs. |
| Power Supply | 2.5V ±100mV core (VDD); separate VDDQL/VDDQR supplies per port; supports low-power standby (ISB3 ≤15mA) and sleep mode (Izz ≤15mA). |
| Package | 256-pin BGA (BC256), 17mm × 17mm × 1.4mm body, 1.0mm ball pitch; optimized for high-density PCB layouts in telecom modules. |
Pinout & Package
70T3599S133BCI is housed in a 256-pin Ball Grid Array (BC256) package with 17mm × 17mm footprint and 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port based on OPTL/OPTR state. A17L and A17R are no-connect (NC) pins per datasheet note.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Independent rising-edge-triggered clocks enable asynchronous operation between ports; critical for cross-clock-domain buffering. |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port (A17 is NC); supports full 256K-word addressing without external decoding. |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; byte enables (BE0–BE3) allow 9-bit granularity writes without read-modify-write overhead. |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Two independent enables per port permit seamless depth expansion (e.g., 512K×36) using external logic or daisy-chained control. |
| PL/FTL / PL/FTR | Pipeline/Flow-Through mode select | Configures output timing: pipelined (VIH) gives 4.2ns tCD2 for burst throughput; flow-through (VIL) gives 15ns tCD1 for low-latency single-access. |
| ZZL / ZZR | Sleep mode control | Asserting ZZx disables dynamic inputs (except JTAG), reducing current to ≤15mA; essential for power-gated subsystems in energy-constrained designs. |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Enables concurrent read/write to identical memory locations-eliminates arbitration logic in shared-memory interprocessor communication. |
| Dual Cycle Deselect (DCD) | Chip enables are double-buffered in pipelined mode, preventing metastability during rapid port disable/enable transitions in burst-mode traffic. |
| JTAG Boundary Scan (IEEE 1149.1) | Full TAP controller (TCK/TMS/TDI/TDO/TRST) supports in-system test and debug without requiring additional test points on dense BGA layouts. |
| Address Counter with Repeat | CNTENL/CNTENR and REPEATL/REPEATR enable automatic sequential addressing-reduces FPGA resource usage in packet header parsing engines. |
| Interrupt & Collision Detection | INTR/COLR and INTL/COLL flags signal simultaneous access conflicts or user-defined events-enables real-time error handling in safety-critical buffers. |
Applications
| Telecom Switching Fabric | Network Packet Buffering |
|---|---|
Use Scenario: High-speed line cards in carrier-grade routers performing cut-through switching of 10G Ethernet frames. IC Role / Device Role / Timing Role: Dual-port SRAM acts as frame buffer between ingress and egress MACs, absorbing jitter and enabling store-and-forward decisions. Use Value: 133MHz pipelined operation delivers 4.2ns tCD2 latency, ensuring sub-10ns round-trip buffering delay for time-sensitive control plane packets. | Use Scenario: Deep packet inspection (DPI) appliances buffering encrypted TLS payloads for decryption and policy enforcement. IC Role / Device Role / Timing Role: Left port accepts encrypted payload from NIC; right port feeds decrypted stream to analysis engine-both operating at independent clocks. Use Value: True dual-port capability eliminates arbitration stalls, sustaining 9.5Gbps aggregate throughput across asymmetric traffic loads. |
| Industrial PLC Data Exchange | Radar Signal Processing Buffer |
Use Scenario: Modular programmable logic controllers exchanging real-time I/O status between CPU and distributed I/O modules over SERCOS III. IC Role / Device Role / Timing Role: Shared memory interface between ARM-based controller and FPGA-based motion sequencer, synchronized via discrete clocks. Use Value: Industrial temperature rating (–40°C to +85°C) and sleep mode (ZZL/ZZR) ensure reliable operation in uncooled control cabinets with dynamic power cycling. | Use Scenario: Phased-array radar systems digitizing RF returns at 125MSPS and storing pulse-Doppler FFT results for clutter mapping. IC Role / Device Role / Timing Role: Right port captures ADC samples; left port streams processed data to DSP-address counters auto-increment for zero-CPU-overhead transfers. Use Value: 17-bit address bus (A0–A16) supports 131K-sample buffers; pipelined mode sustains sustained 133MHz write/read rates required for real-time beamforming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 133MHz, 256K×36, 3.3V core/I/O; no sleep mode (ZZ) or JTAG; 208-pin TQFP package. | Lacks industrial temp support and power management features; suited for cost-sensitive commercial designs without boundary scan requirements. | Choose when board space permits larger TQFP and JTAG/testability is not required. |
| AS7C3256B-133JCIN | 133MHz, 256K×36, 3.3V core/I/O; no dual chip enables or address counter; 100-pin TQFP. | Minimal feature set-no CNTEN/REPEAT, no collision detection; targets simple FIFO replacement where burst addressing is handled externally. | Choose only for basic dual-port buffering where advanced control logic resides in FPGA/ASIC. |
Compared with CY7C1362BV33-133BZI and AS7C3256B-133JCIN, the 70T3599S133BCI provides unique value through integrated sleep mode (reducing idle power by >95%), IEEE 1149.1 JTAG for production test, and dual chip enables enabling seamless memory expansion-critical for scalable telecom and defense platforms.
Availability
70T3599S133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and radar signal processing applications requiring stable component supply across extended product lifecycles.
Supply support for 70T3599S133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF power solutions for communications and computing markets.
The 70T35xxS family was designed specifically for high-bandwidth, low-latency dual-port memory applications in networking equipment, baseband processors, and real-time embedded systems demanding deterministic timing and industrial reliability.
FAQ
What is the maximum operating frequency of the 70T3599S133BCI in pipelined mode?
The 70T3599S133BCI supports a maximum clock frequency of 133MHz in pipelined mode, corresponding to a 7.5ns clock cycle time (tCYC2). This is validated for industrial temperature range (–40°C to +85°C) and is specified in the AC Electrical Characteristics table on page 12 of the datasheet. The 70T3599S133BCI achieves 4.2ns clock-to-data-out (tCD2) at this speed, enabling high-throughput burst transfers in telecom and radar applications.
Does the 70T3599S133BCI support JTAG boundary scan testing?
Yes, the 70T3599S133BCI supports IEEE 1149.1 JTAG boundary scan with dedicated TCK, TMS, TDI, TDO, and TRST pins. This capability is explicitly confirmed in the Functional Block Diagram and Pin Names tables. JTAG is available in the 256-pin BGA (BC256) package variant-note that JTAG is not supported in the DR208 PQFP package due to pin count limitations.
How does the sleep mode (ZZL/ZZR) function on the 70T3599S133BCI?
The 70T3599S133BCI sleep mode is activated by asserting ZZL or ZZR high, which shuts off all dynamic inputs except JTAG signals. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain unaffected. Sleep mode reduces current consumption to ≤15mA (Izz), with recovery requiring three clock cycles (tZZRC). This feature is critical for power-gated subsystems in battery-backed or thermally constrained industrial designs.
What are the I/O voltage configuration options for the 70T3599S133BCI?
The 70T3599S133BCI supports independent 2.5V or 3.3V I/O operation per port via OPTL and OPTR pins. Setting OPTX to VDD (2.5V) configures the port for 3.3V I/O levels with VDDQX = 3.3V; setting OPTX to VSS (0V) configures 2.5V I/O with VDDQX = 2.5V. This allows mixed-voltage interfacing-for example, connecting the left port to a 3.3V FPGA and the right port to a 2.5V ASIC-without level shifters.
Is the 70T3599S133BCI pin-compatible with other members of the 70T35xxS family?
No, the 70T3599S133BCI is not pin-compatible with other 70T35xxS variants such as the 70T3519 or 70T3589. While they share the same BC256 package footprint, the 70T3599 has NC pins at A17L and A17R (not present in 70T3519/89), and its internal memory organization (256K×36) differs from 128K×36 and 64K×36 variants. Pin assignments for address, I/O, and control signals are consistent, but NC pin locations and functional pin counts vary across the family.
70T3599S133BCI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3599S133BCI FAQ
1.How can I place an order for 70T3599S133BCI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3599S133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3599S133BCI reliable?
The price and inventory of 70T3599S133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S133BCI is usually 5 days.
3.What payment methods are accepted for 70T3599S133BCI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3599S133BCI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3599S133BCI?
70T3599S133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3599S133BCI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3599S133BCI?
For technical support, including 70T3599S133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S133BCI requirements.
6.How does Aetrix verify that 70T3599S133BCI is sourced from the original manufacturer or authorized distributors?
All 70T3599S133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S133BCI meets industry standards.
7.What is the process for return or replacement of 70T3599S133BCI?
All 70T3599S133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S133BCI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3599S133BCI part is unused and in its original packaging.
Return procedure for 70T3599S133BCI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3599S133BCI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
