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Renesas 70T3599S133BFGI

Part No.:
70T3599S133BFGI
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T3599S133BFGI.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 133MHZ
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,941

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Product details

Overview

70T3599S133BFGI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (4.2ns access time), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric.

For engineers reviewing the 70T3599S133BFGI datasheet, 70T3599S133BFGI pinout, 70T3599S133BFGI application, or 70T3599S133BFGI equivalent, key selection criteria include dual-port timing coordination, per-port voltage configuration via OPT pins, JTAG-compliant IEEE 1149.1 test support, and industrial-grade (-40°C to +85°C) operation at 133MHz in fpBGA packaging.

Technical Context

This device implements fully synchronous dual-port operation with independent clock domains (CLKL/CLKR), register-controlled address/data/control inputs, and self-timed write logic enabling minimal setup/hold times. Each port includes dedicated chip enables (CE0/CE1), byte enables (BE0–BE3), and pipeline/flow-through mode selection (PL/FT).

It integrates on-chip collision detection and interrupt flags (COLL/INTR, COLR/INTL), address counter logic with repeat and enable controls (CNTEN/REPEAT), and sleep mode (ZZL/ZZR) that disables dynamic inputs while preserving JTAG accessibility. JTAG boundary scan is supported per IEEE 1149.1 in BGA packages.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 bits (9Mbit total); supports depth expansion via dual chip enables without external logic.
Max Clock Frequency 133MHz (7.5ns cycle time in pipelined mode); validated for industrial temperature range (-40°C to +85°C).
Access Time 4.2ns (max) in pipelined output mode; enables sub-8ns system-level data throughput in burst applications.
Supply Voltages 2.5V ±100mV core (VDD); independently configurable 2.5V or 3.3V I/O (VDDQ) per port via OPTL/OPTR pins.
Operating Temperature -40°C to +85°C industrial grade; specified for full performance at 133MHz in BFG208 fpBGA package.
Package 208-pin fine-pitch Ball Grid Array (BFG208); 15mm × 15mm body, 0.8mm ball pitch, RoHS-compliant green variant.
JTAG Support IEEE 1149.1 compliant TAP controller (TCK/TMS/TDI/TDO/TRST); functional in BFG208, not supported in PQFP variants.

Pinout & Package

70T3599S133BFGI is packaged in a 208-pin fine-pitch BGA (BFG208), with 15mm × 15mm footprint and 0.8mm ball pitch. Power and ground balls are distributed across the array for low-noise operation; VDD (2.5V core) and VDDQ (2.5V/3.3V I/O) supplies are segregated per port.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-specific clock input Synchronous edge-triggered timing reference for left/right port operations; enables independent clock domain control.
CE0L/CE1L / CE0R/CE1R Dual chip enable inputs Double-buffered when PL/FT = VIH; allows depth expansion without external decode logic.
PL/FTL / PL/FTR Pipeline/Flow-through mode select DC-configurable per port; selects pipelined (1-cycle latency) or flow-through (0-cycle latency) output timing.
OPTL / OPTR I/O voltage option control Configures VDDQX supply level: VDD (2.5V) → 3.3V I/O; VSS (0V) → 2.5V I/O; enables mixed-voltage system interfacing.
ZZL / ZZR Per-port sleep mode enable Asserting ZZx disables dynamic inputs (except JTAG), reducing standby current to ≤20mA per port in ISB3 mode.
ADSL / ADSR Address strobe enable Latches external address into internal counter; enables address auto-increment and REPEAT-based address reuse.

Key Features

Feature Design Value
True dual-port memory cells Enables concurrent read/write access to identical addresses on left and right ports-critical for real-time packet buffering and arbitration.
Dual-cycle deselect (DCD) Guarantees clean bus release after two clock cycles when chip enables deactivate, preventing metastability in pipelined systems.
Per-port voltage configurability Independent OPTL/OPTR pins allow one port to interface with 3.3V logic while the other connects to 2.5V ASICs-no level shifters required.
Collision and interrupt flags COLL/INTR and COLR/INTL outputs signal simultaneous access conflicts within 4.2ns, enabling hardware-level arbitration response.
Address counter with repeat CNTENL/CNTENR and REPEATL/REPEATR enable burst-mode sequential addressing with programmable wrap-around-ideal for FIFO emulation.

Applications

Telecom Switching Fabric Network Packet Buffering

Use Scenario: High-throughput line cards in carrier-grade routers performing parallel header inspection and forwarding decisions.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between ingress and egress ASICs, synchronizing data flow across independent clock domains.

Use Value: 133MHz pipelined operation delivers 9.5Gbps aggregate bandwidth (36-bit × 133MHz), supporting OC-192 line rates without external FIFOs.

Use Scenario: Deep packet inspection engines requiring low-latency, deterministic access to packet payloads during real-time analysis.

IC Role / Device Role / Timing Role: Left port accepts incoming packet fragments from DMA; right port feeds analysis engine-both operating at full 133MHz.

Use Value: True dual-port architecture eliminates arbitration delays; 4.2ns tCD2 ensures sub-5ns data availability for time-critical pattern matching.

Industrial Motion Control Medical Imaging Data Pipeline

Use Scenario: Multi-axis servo controllers coordinating position updates between FPGA-based trajectory planner and DSP-based current loop.

IC Role / Device Role / Timing Role: Serves as deterministic handshake memory: FPGA writes setpoints to left port; DSP reads via right port with synchronized clocks.

Use Value: Industrial temperature rating (-40°C to +85°C) and 133MHz reliability ensure consistent latency in factory-floor environments with thermal cycling.

Use Scenario: Ultrasound beamforming modules acquiring parallel RF channel data and feeding it to real-time digital processing units.

IC Role / Device Role / Timing Role: Buffers raw ADC samples (36-bit parallel) from analog front-end on left port; streams processed echo data to DAC interface on right port.

Use Value: Independent VDDQ configuration allows left port to match 3.3V ADC interface while right port drives 2.5V FPGA logic-no external voltage translation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133BZI 133MHz, 256K × 36, 3.3V core/I/O; no per-port voltage selection; lacks JTAG and REPEAT counter. Requires external level shifting for mixed-voltage systems; no hardware address repeat for burst transfers. Choose when 3.3V-only interface suffices and JTAG debug is unnecessary; lower cost but reduced flexibility.
AS7C3256A-133JIN 133MHz, 256K × 32 (not 36-bit); 3.3V only; no pipelined mode; no collision detection or interrupt flags. 32-bit data path limits compatibility with 36-bit bus architectures; no hardware arbitration signaling. Acceptable for non-critical buffering where 4-bit width reduction is tolerable and collision handling is software-managed.

Compared with CY7C1362BV33-133BZI and AS7C3256A-133JIN, the 70T3599S133BFGI uniquely supports per-port I/O voltage selection, pipelined output mode, and hardware collision/interrupt signaling-enabling tighter timing control and mixed-voltage integration without external components.

Availability

70T3599S133BFGI is available at Aetrix Electronics and suitable for telecom switching fabric, network packet buffering, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for 70T3599S133BFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T35xx family targets high-bandwidth, low-latency dual-port memory applications in telecom infrastructure and real-time embedded systems-emphasizing deterministic timing, mixed-voltage interoperability, and hardware-assisted arbitration.

FAQ

What is the maximum guaranteed operating frequency of the 70T3599S133BFGI at industrial temperature?

The 70T3599S133BFGI is fully characterized and guaranteed to operate at 133MHz across the industrial temperature range (-40°C to +85°C). This specification is validated for both pipelined and flow-through output modes and applies specifically to the BFG208 fpBGA package variant.

Does the 70T3599S133BFGI support independent voltage configuration on left and right ports?

Yes, the 70T3599S133BFGI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR to VSS (0V) configures the right port for 2.5V I/O with VDDQR = 2.5V-enabling direct interfacing with mixed-voltage ASICs without level shifters.

How does the collision detection feature work in the 70T3599S133BFGI?

The 70T3599S133BFGI asserts COLL (left port) or COLR (right port) within 4.2ns when both ports attempt simultaneous access to the same memory location. These open-drain flags can trigger external arbitration logic or interrupt controllers, enabling hardware-level resolution without software polling overhead.

Is JTAG boundary scan supported on the 70T3599S133BFGI in its BFG208 package?

Yes, the 70T3599S133BFGI in the BFG208 fpBGA package fully supports IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. JTAG remains functional even when ZZL/ZZR sleep mode is asserted, allowing in-system test and debug during low-power states.

What is the purpose of the REPEAT function in the 70T3599S133BFGI address counter?

The REPEAT function in the 70T3599S133BFGI resets the internal address counter to the last valid address loaded via ADSL or ADSR. This enables efficient burst-mode access to a fixed memory region-such as descriptor tables or coefficient buffers-without continuous address bus updates, reducing control overhead in FPGA- or DSP-based systems.

70T3599S133BFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
-

70T3599S133BFGI FAQ

1.How can I place an order for 70T3599S133BFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3599S133BFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3599S133BFGI reliable?

The price and inventory of 70T3599S133BFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S133BFGI is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3599S133BFGI transactions.

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70T3599S133BFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3599S133BFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3599S133BFGI?

For technical support, including 70T3599S133BFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S133BFGI requirements.

6.How does Aetrix verify that 70T3599S133BFGI is sourced from the original manufacturer or authorized distributors?

All 70T3599S133BFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S133BFGI meets industry standards.

7.What is the process for return or replacement of 70T3599S133BFGI?

All 70T3599S133BFGI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S133BFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3599S133BFGI part is unused and in its original packaging.

Return procedure for 70T3599S133BFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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