Renesas 70T3599S133BFGI8
- Part No.:
- 70T3599S133BFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T3599S133BFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 133MHZ
- Quantity:
- Payment:

- Shipping:

Inventory:3,974
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70T3599S133BFGI8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location on independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes. Designed for real-time inter-processor communication in telecom line cards and packet buffer applications.
For engineers reviewing the 70T3599S133BFGI8 datasheet, 70T3599S133BFGI8 pinout, 70T3599S133BFGI8 application, or 70T3599S133BFGI8 equivalent, this device delivers deterministic low-latency memory sharing between heterogeneous processors, supports JTAG IEEE 1149.1 boundary scan, and provides industrial-grade reliability (-40°C to +85°C) in a 208-pin fpBGA package.
Technical Context
The 70T3599S133BFGI8 implements fully synchronous operation on both ports with independent clock inputs (CLKL/CLKR), dual chip enables (CE0/CE1 per port), and byte-enable controls (BE0–BE3) for 9-bit granularity writes. Its address counter logic supports auto-increment via CNTEN and repeat addressing via REPEAT signals, enabling burst transfers without external address generation.
It integrates interrupt and collision detection flags (INTR/COLR, INTL/COLL) to signal concurrent access conflicts, and includes sleep mode (ZZL/ZZR) that reduces dynamic power while preserving JTAG accessibility. The core runs at 2.5V ±100mV, while I/O voltage is independently configurable per port via OPTL/OPTR pins and corresponding VDDQL/VDDQR supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9Mbit total); supports depth expansion using dual CE pins without external logic |
| Max Clock Frequency | 133MHz (7.5ns cycle time in pipelined mode); enables 9.5Gbps aggregate bandwidth across both ports |
| Access Time | 4.2ns max clock-to-data-out (tCD2) in pipelined mode; ensures sub-5ns latency for time-critical buffering |
| I/O Voltage Support | Selectable 2.5V or 3.3V per port via OPTL/OPTR; allows mixed-voltage system integration without level shifters |
| Operating Temperature | -40°C to +85°C industrial range; validated for deployment in base station and industrial control environments |
| Package | 208-pin fine-pitch BGA (BFG208); 15mm × 15mm body with 0.8mm ball pitch for high-density PCB layouts |
| Power Management | Sleep mode (ZZL/ZZR) reduces current to ≤15mA; full standby (ISB3) draws only 5mA typical with CMOS-level inputs |
Pinout & Package
70T3599S133BFGI8 is housed in a 208-pin fine-pitch Ball Grid Array (BFG208) package measuring 15mm × 15mm × 1.4mm with 0.8mm ball pitch. All VDD pins require 2.5V supply; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port based on OPTL/OPTR configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Independent synchronous timing domains enable asymmetric data rates or phase-shifted operation between ports |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable per port | Enables depth expansion up to 4× without external decoding logic; supports hierarchical memory mapping |
| PL/FTL / PL/FTR | Pipeline/Flow-through mode select | VIH = pipelined (1-cycle latency, higher throughput); VIL = flow-through (0-cycle latency, deterministic timing) |
| ADSL / ADSR | Address strobe enable | Latches external address into internal counter; enables burst-mode address auto-increment without CPU intervention |
| INTL / INTR, COLL / COLR | Interrupt and collision flags | Open-drain outputs signal memory contention events to host processors for arbitration or error recovery |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous read/write to identical addresses - critical for lock-free inter-processor communication |
| Configurable I/O voltage per port | OPTL/OPTR pins allow independent 2.5V/3.3V interface selection - eliminates need for external voltage translators |
| Address counter with repeat function | REPEATL/REPEATR resets counter to last ADS-loaded address - simplifies circular buffer implementation |
| JTAG IEEE 1149.1 compliance | Full boundary-scan support (TCK/TMS/TDI/TDO/TRST) enables in-system testability and debug visibility |
| Dual-cycle deselect (DCD) | Double-buffered CE/BE signals prevent metastability during rapid enable/disable transitions in pipelined mode |
Applications
| Telecom Line Card Buffering | Real-Time DSP Co-Processing |
|---|---|
|
Use Scenario: High-speed packet buffering between network processor and framer ASIC in OC-192 line cards. IC Role / Device Role / Timing Role: Shared memory conduit enabling zero-copy data exchange with deterministic <4.2ns read latency. Use Value: Eliminates FIFO bottlenecks and reduces jitter in 10Gbps packet forwarding paths. |
Use Scenario: Real-time audio/video frame exchange between ARM host and TI C6000 DSP in broadcast encoders. IC Role / Device Role / Timing Role: Synchronous dual-port SRAM acting as ping-pong buffer with independent clock domains. Use Value: Enables concurrent DMA fill and processing without software synchronization overhead. |
| Radar Signal Processing | Industrial Motion Controller |
|
Use Scenario: Storing intermediate FFT results between FPGA-based acquisition and ARM-based analysis in phased-array radar. IC Role / Device Role / Timing Role: Low-latency shared memory with collision detection for safe multi-master access. Use Value: Prevents data corruption during simultaneous write/read operations in safety-critical timing windows. |
Use Scenario: Coordinating position commands and sensor feedback between motion controller MCU and servo drive FPGA. IC Role / Device Role / Timing Role: Deterministic inter-processor mailbox with interrupt-driven status signaling (INTR/COLR). Use Value: Guarantees sub-microsecond response to emergency stop or fault conditions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 70T3599S133BCGI | Same electrical specs and pinout, but in 256-pin BGA (BC256) instead of 208-pin fpBGA; larger footprint (17mm × 17mm) | Preferred where board space permits larger package and thermal dissipation is prioritized | Select when PCB layout accommodates 256-ball grid and requires marginally better thermal performance |
| CY7C1362KV18-133BZI | 144Mbit (2M × 18) density, 18-bit bus width, 1.8V core; no per-port I/O voltage selection; lacks REPEAT/ADSL counter logic | Better suited for cost-sensitive, lower-bandwidth applications without burst-address requirements | Choose only if 18-bit data path suffices and counter-assisted addressing is unnecessary |
Compared with 70T3599S133BFGI8, the BC256 variant offers identical functionality in a larger package for thermal headroom, while the Cypress part trades configurability and dual-width flexibility for lower density and fixed I/O voltage - making it unsuitable for mixed-voltage or high-burst-rate designs.
Availability
70T3599S133BFGI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and radar signal processing applications requiring stable component supply across extended product lifecycles.
Supply support for 70T3599S133BFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 70T35xx family was designed specifically for deterministic, low-latency inter-processor communication in systems requiring simultaneous dual-port access - targeting telecom, defense, and industrial automation.
FAQ
What is the maximum operating frequency of the 70T3599S133BFGI8?
The 70T3599S133BFGI8 is rated for 133MHz operation (7.5ns cycle time) in both commercial and industrial temperature ranges. This frequency is guaranteed under pipelined output mode with tCYC2 ≤ 7.5ns. It does not support 166MHz or 200MHz variants - those require different suffixes (S166/S200) and are unavailable in the BFG208 package.
Does the 70T3599S133BFGI8 support independent I/O voltage selection per port?
Yes, the 70T3599S133BFGI8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting it to VSS (0V) configures 2.5V operation with VDDQL = 2.5V. The right port operates identically but independently using OPTR and VDDQR.
How does the address counter function work on the 70T3599S133BFGI8?
The 70T3599S133BFGI8 implements an internal address counter controlled by CNTENL/CNTENR and ADSL/ADSR. When CNTENX = VIL and ADSX = VIH on the rising clock edge, the counter increments. REPEATX resets the counter to the last valid ADS-loaded address. This enables automatic burst addressing without CPU involvement - essential for streaming applications like video frame buffers.
What is the purpose of the ZZL and ZZR pins on the 70T3599S133BFGI8?
ZZL and ZZR are independent sleep mode enable inputs for the left and right ports. When asserted (VIH), they disable dynamic inputs and reduce current draw to ≤15mA while preserving JTAG functionality. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain active. Sleep mode requires 2 cycles to activate and 3 cycles to recover, ensuring glitch-free entry/exit.
Is JTAG boundary scan supported on the 70T3599S133BFGI8?
Yes, the 70T3599S133BFGI8 fully supports IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. This capability is retained even in sleep mode, enabling in-system test and debug without waking the memory core - a key advantage over non-JTAG-enabled dual-port SRAMs.
70T3599S133BFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- -
70T3599S133BFGI8 FAQ
1.How can I place an order for 70T3599S133BFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3599S133BFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3599S133BFGI8 reliable?
The price and inventory of 70T3599S133BFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S133BFGI8 is usually 5 days.
3.What payment methods are accepted for 70T3599S133BFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3599S133BFGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3599S133BFGI8?
70T3599S133BFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3599S133BFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3599S133BFGI8?
For technical support, including 70T3599S133BFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S133BFGI8 requirements.
6.How does Aetrix verify that 70T3599S133BFGI8 is sourced from the original manufacturer or authorized distributors?
All 70T3599S133BFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S133BFGI8 meets industry standards.
7.What is the process for return or replacement of 70T3599S133BFGI8?
All 70T3599S133BFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S133BFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3599S133BFGI8 part is unused and in its original packaging.
Return procedure for 70T3599S133BFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3599S133BFGI8 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

