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Renesas 70T3599S133BFGI8

Part No.:
70T3599S133BFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T3599S133BFGI8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 133MHZ
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,974

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Product details

Overview

70T3599S133BFGI8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location on independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 2.5V or 3.3V I/O interfaces per port, and features pipelined or flow-through output modes. Designed for real-time inter-processor communication in telecom line cards and packet buffer applications.

For engineers reviewing the 70T3599S133BFGI8 datasheet, 70T3599S133BFGI8 pinout, 70T3599S133BFGI8 application, or 70T3599S133BFGI8 equivalent, this device delivers deterministic low-latency memory sharing between heterogeneous processors, supports JTAG IEEE 1149.1 boundary scan, and provides industrial-grade reliability (-40°C to +85°C) in a 208-pin fpBGA package.

Technical Context

The 70T3599S133BFGI8 implements fully synchronous operation on both ports with independent clock inputs (CLKL/CLKR), dual chip enables (CE0/CE1 per port), and byte-enable controls (BE0–BE3) for 9-bit granularity writes. Its address counter logic supports auto-increment via CNTEN and repeat addressing via REPEAT signals, enabling burst transfers without external address generation.

It integrates interrupt and collision detection flags (INTR/COLR, INTL/COLL) to signal concurrent access conflicts, and includes sleep mode (ZZL/ZZR) that reduces dynamic power while preserving JTAG accessibility. The core runs at 2.5V ±100mV, while I/O voltage is independently configurable per port via OPTL/OPTR pins and corresponding VDDQL/VDDQR supplies.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256K × 36 bits (9Mbit total); supports depth expansion using dual CE pins without external logic
Max Clock Frequency 133MHz (7.5ns cycle time in pipelined mode); enables 9.5Gbps aggregate bandwidth across both ports
Access Time 4.2ns max clock-to-data-out (tCD2) in pipelined mode; ensures sub-5ns latency for time-critical buffering
I/O Voltage Support Selectable 2.5V or 3.3V per port via OPTL/OPTR; allows mixed-voltage system integration without level shifters
Operating Temperature -40°C to +85°C industrial range; validated for deployment in base station and industrial control environments
Package 208-pin fine-pitch BGA (BFG208); 15mm × 15mm body with 0.8mm ball pitch for high-density PCB layouts
Power Management Sleep mode (ZZL/ZZR) reduces current to ≤15mA; full standby (ISB3) draws only 5mA typical with CMOS-level inputs

Pinout & Package

70T3599S133BFGI8 is housed in a 208-pin fine-pitch Ball Grid Array (BFG208) package measuring 15mm × 15mm × 1.4mm with 0.8mm ball pitch. All VDD pins require 2.5V supply; VDDQL/VDDQR must match selected I/O voltage (2.5V or 3.3V) per port based on OPTL/OPTR configuration.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-specific clock input Independent synchronous timing domains enable asymmetric data rates or phase-shifted operation between ports
CE0L/CE1L, CE0R/CE1R Dual chip enable per port Enables depth expansion up to 4× without external decoding logic; supports hierarchical memory mapping
PL/FTL / PL/FTR Pipeline/Flow-through mode select VIH = pipelined (1-cycle latency, higher throughput); VIL = flow-through (0-cycle latency, deterministic timing)
ADSL / ADSR Address strobe enable Latches external address into internal counter; enables burst-mode address auto-increment without CPU intervention
INTL / INTR, COLL / COLR Interrupt and collision flags Open-drain outputs signal memory contention events to host processors for arbitration or error recovery

Key Features

Feature Design Value
True dual-port memory cells Enables simultaneous read/write to identical addresses - critical for lock-free inter-processor communication
Configurable I/O voltage per port OPTL/OPTR pins allow independent 2.5V/3.3V interface selection - eliminates need for external voltage translators
Address counter with repeat function REPEATL/REPEATR resets counter to last ADS-loaded address - simplifies circular buffer implementation
JTAG IEEE 1149.1 compliance Full boundary-scan support (TCK/TMS/TDI/TDO/TRST) enables in-system testability and debug visibility
Dual-cycle deselect (DCD) Double-buffered CE/BE signals prevent metastability during rapid enable/disable transitions in pipelined mode

Applications

Telecom Line Card Buffering Real-Time DSP Co-Processing

Use Scenario: High-speed packet buffering between network processor and framer ASIC in OC-192 line cards.

IC Role / Device Role / Timing Role: Shared memory conduit enabling zero-copy data exchange with deterministic <4.2ns read latency.

Use Value: Eliminates FIFO bottlenecks and reduces jitter in 10Gbps packet forwarding paths.

Use Scenario: Real-time audio/video frame exchange between ARM host and TI C6000 DSP in broadcast encoders.

IC Role / Device Role / Timing Role: Synchronous dual-port SRAM acting as ping-pong buffer with independent clock domains.

Use Value: Enables concurrent DMA fill and processing without software synchronization overhead.

Radar Signal Processing Industrial Motion Controller

Use Scenario: Storing intermediate FFT results between FPGA-based acquisition and ARM-based analysis in phased-array radar.

IC Role / Device Role / Timing Role: Low-latency shared memory with collision detection for safe multi-master access.

Use Value: Prevents data corruption during simultaneous write/read operations in safety-critical timing windows.

Use Scenario: Coordinating position commands and sensor feedback between motion controller MCU and servo drive FPGA.

IC Role / Device Role / Timing Role: Deterministic inter-processor mailbox with interrupt-driven status signaling (INTR/COLR).

Use Value: Guarantees sub-microsecond response to emergency stop or fault conditions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
70T3599S133BCGI Same electrical specs and pinout, but in 256-pin BGA (BC256) instead of 208-pin fpBGA; larger footprint (17mm × 17mm) Preferred where board space permits larger package and thermal dissipation is prioritized Select when PCB layout accommodates 256-ball grid and requires marginally better thermal performance
CY7C1362KV18-133BZI 144Mbit (2M × 18) density, 18-bit bus width, 1.8V core; no per-port I/O voltage selection; lacks REPEAT/ADSL counter logic Better suited for cost-sensitive, lower-bandwidth applications without burst-address requirements Choose only if 18-bit data path suffices and counter-assisted addressing is unnecessary

Compared with 70T3599S133BFGI8, the BC256 variant offers identical functionality in a larger package for thermal headroom, while the Cypress part trades configurability and dual-width flexibility for lower density and fixed I/O voltage - making it unsuitable for mixed-voltage or high-burst-rate designs.

Availability

70T3599S133BFGI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and radar signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for 70T3599S133BFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 70T35xx family was designed specifically for deterministic, low-latency inter-processor communication in systems requiring simultaneous dual-port access - targeting telecom, defense, and industrial automation.

FAQ

What is the maximum operating frequency of the 70T3599S133BFGI8?

The 70T3599S133BFGI8 is rated for 133MHz operation (7.5ns cycle time) in both commercial and industrial temperature ranges. This frequency is guaranteed under pipelined output mode with tCYC2 ≤ 7.5ns. It does not support 166MHz or 200MHz variants - those require different suffixes (S166/S200) and are unavailable in the BFG208 package.

Does the 70T3599S133BFGI8 support independent I/O voltage selection per port?

Yes, the 70T3599S133BFGI8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting it to VSS (0V) configures 2.5V operation with VDDQL = 2.5V. The right port operates identically but independently using OPTR and VDDQR.

How does the address counter function work on the 70T3599S133BFGI8?

The 70T3599S133BFGI8 implements an internal address counter controlled by CNTENL/CNTENR and ADSL/ADSR. When CNTENX = VIL and ADSX = VIH on the rising clock edge, the counter increments. REPEATX resets the counter to the last valid ADS-loaded address. This enables automatic burst addressing without CPU involvement - essential for streaming applications like video frame buffers.

What is the purpose of the ZZL and ZZR pins on the 70T3599S133BFGI8?

ZZL and ZZR are independent sleep mode enable inputs for the left and right ports. When asserted (VIH), they disable dynamic inputs and reduce current draw to ≤15mA while preserving JTAG functionality. Static inputs (PL/FTx, OPTx, and ZZx themselves) remain active. Sleep mode requires 2 cycles to activate and 3 cycles to recover, ensuring glitch-free entry/exit.

Is JTAG boundary scan supported on the 70T3599S133BFGI8?

Yes, the 70T3599S133BFGI8 fully supports IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. This capability is retained even in sleep mode, enabling in-system test and debug without waking the memory core - a key advantage over non-JTAG-enabled dual-port SRAMs.

70T3599S133BFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
-

70T3599S133BFGI8 FAQ

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The price and inventory of 70T3599S133BFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S133BFGI8 is usually 5 days.

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5.How can I obtain technical support or documentation for 70T3599S133BFGI8?

For technical support, including 70T3599S133BFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S133BFGI8 requirements.

6.How does Aetrix verify that 70T3599S133BFGI8 is sourced from the original manufacturer or authorized distributors?

All 70T3599S133BFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S133BFGI8 meets industry standards.

7.What is the process for return or replacement of 70T3599S133BFGI8?

All 70T3599S133BFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S133BFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3599S133BFGI8 part is unused and in its original packaging.

Return procedure for 70T3599S133BFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70T3599S133BFGI8 Tags

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