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Renesas 70T3599S133BFI

Part No.:
70T3599S133BFI
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T3599S133BFI.pdf
Description:
IC SRAM 4.5MBIT PAR 208CABGA
Quantity:
Payment:
Payment
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Inventory:3,079

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Product details

Overview

70T3599S133BFI from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 133MHz (4.2ns access time), supports independent 2.5V core and selectable 2.5V/3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric.

For engineers reviewing the 70T3599S133BFI datasheet, 70T3599S133BFI pinout, 70T3599S133BFI application, or 70T3599S133BFI equivalent, this device is selected for deterministic latency, JTAG-compliant boundary scan, industrial temperature operation (–40°C to +85°C), and depth-expansion capability via dual chip enables-critical for packet buffer and protocol processor designs.

Technical Context

The 70T3599S133BFI implements fully synchronous dual-port operation with separate clock domains (CLKL/CLKR), address strobe (ADSL/ADSR), and counter-based address generation (CNTENL/CNTENR, REPEATL/REPEATR). Its memory array uses true dual-port cells, eliminating arbitration overhead and enabling concurrent access without collision-induced stalls.

It integrates dedicated interrupt (INTL/INTR) and collision detection (COLL/COLR) logic, dual-cycle deselect (DCD) for pipelined mode, and independent sleep control (ZZL/ZZR) that disables dynamic inputs while preserving JTAG accessibility. The OPTL/OPTR pins configure per-port I/O voltage (2.5V or 3.3V), decoupling core and interface supply domains.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 bits (9Mbit total); supports unidirectional/bidirectional burst transfers without address sequencing.
Max Clock Frequency 133MHz (7.5ns cycle time in pipelined mode); enables 9.5Gbps aggregate bandwidth across both ports.
Access Time 4.2ns (max) at 133MHz; guarantees deterministic data-out timing for real-time packet buffering.
Supply Voltages VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port (I/O); enables mixed-voltage system interfacing.
Operating Temperature –40°C to +85°C (industrial grade); validated for telecom infrastructure and industrial control environments.
Package 256-pin BGA (17mm × 17mm, 1.0mm ball pitch); optimized for high-density PCB layouts with thermal and signal integrity.
JTAG Support IEEE 1149.1 compliant (TCK/TMS/TDI/TDO/TRST); enables in-system test and debug without external probes.

Pinout & Package

70T3599S133BFI is housed in a 256-pin Ball Grid Array (BGA) package measuring 17mm × 17mm × 1.4mm with 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin configuration (3.3V if OPT = VDD, 2.5V if OPT = VSS).

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-specific clock input Synchronizes all register-controlled operations on left/right port; enables independent timing domains.
A0L–A17L / A0R–A17R Address inputs A17 is NC for 70T3599; effective address range is 18-bit (256K); allows full memory mapping without external decoding.
I/O0L–I/O35L / I/O0R–I/O35R Bi-directional data bus 36-bit parallel interface per port; byte enables (BE0–BE3) allow granular 9-bit writes without read-modify-write.
CE0L/CE1L / CE0R/CE1R Dual chip enable inputs Enable depth expansion (e.g., 512K×36) without external logic; CE0=low + CE1=high activates port.
PL/FTL / PL/FTR Pipeline/flow-through mode select VIH = pipelined (3.4ns tCD2 @133MHz); VIL = flow-through (4.2ns tCD1); selects latency vs. throughput trade-off.
INTL / INTR Interrupt flag outputs Active-high asynchronous signals indicating completion of counter-repeated accesses or ADS-triggered events.
COLL / COLR Collision detection outputs Asserted when simultaneous write to same address occurs; enables hardware-level conflict resolution in real-time systems.

Key Features

Feature Design Value
True dual-port memory cells Enables zero-wait-state concurrent read/write to identical addresses-eliminates arbitration logic in switch fabric buffers.
Configurable I/O voltage per port OPTL/OPTR pins independently set each port's VDDQ to 2.5V or 3.3V, simplifying interconnection with mixed-voltage ASICs/FPGAs.
Dual-cycle deselect (DCD) Prevents metastability during pipelined output mode by requiring two clock cycles to disable outputs-ensures clean bus release.
Address counter with repeat CNTENL/R and REPEATL/R support auto-incrementing burst reads/writes and instant return to last ADS-loaded address-ideal for FIFO emulation.
Per-port sleep mode (ZZL/ZZR) Reduces standby current to 5mA/port while retaining JTAG accessibility-enables selective power gating in multi-port systems.

Applications

Telecom Switching Fabric Network Packet Buffer

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress and egress traffic managers; CLKL/CLKR synchronized to separate PHY clocks.

Use Value: 4.2ns access time and pipelined output mode ensure sub-10ns round-trip latency for 64-byte packets-meeting RFC 2544 jitter requirements.

Use Scenario: Temporary storage of fragmented UDP datagrams in VoIP gateways prior to reassembly.

IC Role / Device Role / Timing Role: Left port accepts incoming fragments from MAC layer; right port delivers reassembled payloads to DSP subsystem.

Use Value: Independent 2.5V/3.3V I/O per port allows direct interface to 3.3V Ethernet PHY and 2.5V DSP without level shifters-reducing BOM cost and board area.

Industrial PLC Data Exchange Radar Signal Processing Buffer

Use Scenario: Real-time exchange of sensor data and control commands between redundant CPU modules in safety-critical PLCs.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as fault-tolerant shared memory; collision detection flags trigger failover protocols.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZL/ZZR sleep control ensure reliable operation in harsh factory environments with thermal cycling.

Use Scenario: Buffering digitized IF samples between ADC and FFT engine in phased-array radar receivers.

IC Role / Device Role / Timing Role: Left port streams ADC samples at 133MHz; right port feeds FFT accelerator with burst-aligned 36-bit words.

Use Value: 133MHz pipelined operation delivers 4.8GB/s sustained bandwidth-sufficient for 12-bit, 100MSPS ADC streams with 2× oversampling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133AXC 256K × 36, 133MHz, 3.3V core/I/O; no per-port voltage selection or JTAG. Lacks independent I/O voltage control and IEEE 1149.1 test support-requires external level shifters and limits in-system debug. Select when legacy 3.3V-only systems prioritize cost over flexibility and testability.
AS7C3256P-133JCIN 256K × 36, 133MHz, 3.3V core/I/O; asynchronous reset; no counter/repeat or collision logic. Missing address counter, repeat, and collision detection-unsuitable for burst-oriented or conflict-aware protocols. Select for simple dual-port buffering where deterministic address sequencing and hardware conflict handling are unnecessary.

Compared with CY7C1362BV33-133AXC and AS7C3256P-133JCIN, the 70T3599S133BFI provides unique value through per-port I/O voltage configurability, integrated JTAG, and hardware collision/interrupt logic-enabling higher integration and lower system-level validation effort in telecom and industrial control.

Availability

70T3599S133BFI is available at Aetrix Electronics and suitable for telecom switching fabric, industrial PLC data exchange, network packet buffer, and radar signal processing applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3599S133BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.

The 70T3599S133BFI belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic-latency, high-bandwidth data buffering in telecom infrastructure, military/aerospace systems, and real-time industrial controllers.

FAQ

What is the maximum operating frequency of the 70T3599S133BFI?

The 70T3599S133BFI is rated for 133MHz operation in both commercial and industrial temperature ranges. This corresponds to a 7.5ns clock cycle time in pipelined output mode and guarantees a maximum 4.2ns access time. It is not rated for 166MHz or 200MHz operation in the BGA package variant-those speeds are only supported in other package options like BC256 under commercial conditions.

Does the 70T3599S133BFI support independent voltage selection for each port's I/O interface?

Yes, the 70T3599S133BFI supports independent I/O voltage selection per port using the OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting it to VSS (0V) configures 2.5V I/O with VDDQL = 2.5V. The same applies independently to the right port via OPTR and VDDQR.

How does the collision detection feature work in the 70T3599S133BFI?

The 70T3599S133BFI asserts COLL (left port) or COLR (right port) when both ports attempt to write to the same memory address simultaneously. These open-drain outputs activate within 4.2ns (max) of the violating clock edge and remain asserted until the conflict resolves. They interface directly with external logic or microcontrollers to trigger error-handling routines without software polling.

Is JTAG boundary scan supported on the 70T3599S133BFI?

Yes, the 70T3599S133BFI fully supports IEEE 1149.1 JTAG boundary scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. This capability is retained even when the device enters sleep mode (ZZL/ZZR asserted), allowing in-system test and debug without disrupting system power states.

What is the function of the REPEATL and REPEATR pins on the 70T3599S133BFI?

The REPEATL and REPEATR pins control the address counter's repeat behavior on the left and right ports. When asserted (VIH), the counter resets to the last valid address loaded via ADSL or ADSR-enabling rapid burst access to a fixed memory region without repeated address bus transactions. This is commonly used for descriptor table reads or command queue servicing.

70T3599S133BFI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70T3599S133BFI FAQ

1.How can I place an order for 70T3599S133BFI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T3599S133BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T3599S133BFI reliable?

The price and inventory of 70T3599S133BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S133BFI is usually 5 days.

3.What payment methods are accepted for 70T3599S133BFI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3599S133BFI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T3599S133BFI?

70T3599S133BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T3599S133BFI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T3599S133BFI?

For technical support, including 70T3599S133BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S133BFI requirements.

6.How does Aetrix verify that 70T3599S133BFI is sourced from the original manufacturer or authorized distributors?

All 70T3599S133BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S133BFI meets industry standards.

7.What is the process for return or replacement of 70T3599S133BFI?

All 70T3599S133BFI units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S133BFI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T3599S133BFI part is unused and in its original packaging.

Return procedure for 70T3599S133BFI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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