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Renesas 70T3599S166BF8
- Part No.:
- 70T3599S166BF8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T3599S166BF8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,348
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Product details
Overview
70T3599S166BF8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 166MHz (3.6ns access), supports independent 2.5V core and selectable 2.5V/3.3V I/O supplies per port, and features pipelined or flow-through output modes. It is used in real-time packet buffering for telecom line cards and FPGA co-processor interconnects.
For engineers reviewing the 70T3599S166BF8 datasheet, 70T3599S166BF8 pinout, 70T3599S166BF8 application, or 70T3599S166BF8 equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), 256-pin BGA package compatibility, JTAG IEEE 1149.1 compliance, and dual-chip-enable depth expansion capability without external logic.
Technical Context
This device implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns setup, 0.5ns hold @ 200MHz). Its dual-port memory array supports concurrent access with collision detection and interrupt flags for arbitration.
The architecture includes independent port-level sleep mode (ZZL/ZZR), programmable I/O voltage selection via OPTL/OPTR pins, and an address counter with repeat and enable features. Pipelined output mode delivers 3.6ns tCD2 at 166MHz, while flow-through mode provides deterministic 12ns tCD1 latency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9-Mbit total); enables large burst buffer storage for high-throughput data streams. |
| Max Clock Frequency | 166MHz (industrial grade); supports 5ns cycle time for tightly timed control-plane processing. |
| Access Time | 3.6ns (pipelined, industrial temp); ensures sub-4ns data valid after clock edge in pipeline-critical paths. |
| Supply Voltages | VDD = 2.5V ±100mV (core); VDDQ = 2.5V or 3.3V ±150mV per port; allows mixed-voltage system integration. |
| Operating Temperature | –40°C to +85°C; qualified for base station, industrial PLC, and transportation infrastructure deployments. |
| Package | 256-pin BGA (BC256/BCG256); 17mm × 17mm body, 1.0mm ball pitch; compatible with standard SMT reflow profiles. |
| JTAG Support | IEEE 1149.1 compliant; enables boundary-scan testing and in-system debug without additional test fixtures. |
Pinout & Package
70T3599S166BF8 is housed in a 256-pin Ball Grid Array (BGA) package (BC256/BCG256), measuring 17mm × 17mm × 1.4mm with 1.0mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must match OPT pin configuration (2.5V if OPT = VSS, 3.3V if OPT = VDD).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Drives internal registers on rising edge; determines all timing parameters (tCYC, tCD, setup/hold). |
| A0L–A17L / A0R–A17R | Address inputs | A17 is NC for 70T3599; effective address range is 18-bit (256K words); supports full synchronous addressing. |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data bus (36-bit) | Byte-enableable (BE0–BE3) for 9-bit granularity writes; tri-state controlled by OEL/OER and CE. |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Enable depth expansion: CE0L+CE1L = L/H enables left port; allows stacking without glue logic. |
| PL/FTL / PL/FTR | Output mode select | VIH = pipelined (3.6ns tCD2), VIL = flow-through (12ns tCD1); configures latency vs. determinism trade-off. |
| INTL / INTR / COLL / COLR | Arbitration status flags | Open-drain outputs signal port collision or interrupt events; require external pull-ups for system-level handshaking. |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous read/write to identical addresses-critical for lock-free FIFOs and shared-memory inter-process communication. |
| Dual-cycle deselect (DCD) | Prevents metastability during rapid port disable; ensures clean power-down transitions in pipelined mode. |
| Independent port voltage selection | OPTL/OPTR pins configure each port for 2.5V or 3.3V I/O levels-supports heterogeneous ASIC/FPGA interfacing. |
| Address counter with repeat | REPEATL/REPEATR resets counter to last ADS-loaded address-simplifies burst sequential access without host CPU intervention. |
| Low-power sleep mode | ZZL/ZZR assertion reduces dynamic current to ≤15mA (industrial) while preserving JTAG accessibility for debug. |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Interconnect |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet frames in carrier-grade switches where ingress and egress pipelines operate concurrently. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between MAC and switch fabric engines, synchronized to independent clocks. Use Value: Enables full-duplex 10Gbps line-rate buffering with no arbitration delay-leveraging true dual-port access and 3.6ns pipelined tCD2. |
Use Scenario: High-bandwidth data exchange between Xilinx Kintex FPGA and ARM-based control processor in radar signal processing systems. IC Role / Device Role / Timing Role: Memory bridge providing deterministic latency for DMA transfers and real-time interrupt signaling via INTR/COLL flags. Use Value: Eliminates software-managed semaphores; hardware collision detection and interrupt flags reduce CPU overhead by >40% in benchmarked designs. |
| Industrial PLC Data Logging | Avionics Sensor Fusion Hub |
Use Scenario: Cyclic acquisition of analog sensor data (temperature, pressure, vibration) across multiple I/O modules with timestamped storage. IC Role / Device Role / Timing Role: Left port accepts ADC stream via DMA; right port serves historical queries from HMI controller over parallel bus. Use Value: Industrial temp rating (–40°C to +85°C) and 166MHz operation ensure reliable logging at 100kSPS sustained rates in harsh environments. |
Use Scenario: Aggregating inertial measurement unit (IMU), GPS, and air data computer outputs for real-time Kalman filtering in flight control computers. IC Role / Device Role / Timing Role: Serves as low-jitter shared memory between safety-critical ARM R5F cores and dedicated DSP accelerators. Use Value: JTAG IEEE 1149.1 compliance enables DO-254 traceability; ZZ sleep mode supports power-gating during idle phases without losing state. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 166MHz, 256K × 36, 3.3V core/I/O; no separate VDD/VDDQ rails; lacks JTAG and REPEAT counter. | Requires external level-shifting for 2.5V FPGA interfaces; no hardware address repeat for burst reads. | Choose when cost sensitivity outweighs mixed-voltage flexibility and advanced arbitration features. |
| IDT70V9269L166PFI | 166MHz, 256K × 36, 3.3V-only I/O; 208-pin PQFP; no pipelined mode; higher tCD1 (15ns vs. 12ns). | Not suitable for space-constrained BGA layouts; lacks PL/FT mode for latency-critical paths. | Choose only for legacy through-hole assembly or when JTAG and sleep mode are unnecessary. |
Compared with CY7C1362BV33-166AXC and IDT70V9269L166PFI, the 70T3599S166BF8 uniquely combines industrial temperature support, dual-voltage I/O per port, pipelined output mode, and JTAG-all in a 256-pin BGA-making it optimal for new designs requiring mixed-signal interoperability and deterministic latency.
Availability
70T3599S166BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for 70T3599S166BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.
The 70T35xx family was designed for ultra-low-latency, high-bandwidth inter-processor and packet-buffering applications demanding true dual-port concurrency and industrial reliability.
FAQ
What is the maximum operating frequency of the 70T3599S166BF8 under industrial temperature conditions?
The 70T3599S166BF8 is rated for 166MHz operation across the full industrial temperature range (–40°C to +85°C), delivering guaranteed 3.6ns clock-to-data valid (tCD2) in pipelined mode. This specification is validated per datasheet Table 11 and applies specifically to the BF8 suffix variant in 256-pin BGA packaging.
Does the 70T3599S166BF8 support independent voltage selection for its left and right ports?
Yes, the 70T3599S166BF8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTR = VSS (0V) configures the right port for 2.5V I/O levels with VDDQR = 2.5V-enabling mixed-voltage system integration.
How does the address counter and REPEAT feature function in the 70T3599S166BF8?
In the 70T3599S166BF8, the address counter advances on the rising CLK edge when CNTENL/R = VIL. When REPEATL/R is asserted, the counter resets to the last valid address loaded via ADSL/R-enabling automatic burst sequential access without host CPU address updates. This behavior is defined in Truth Table III and requires initialization via ADS during power-up.
What package type and pin count does the 70T3599S166BF8 use?
The 70T3599S166BF8 uses a 256-pin Ball Grid Array (BGA) package, designated BC256 or BCG256, with a 17mm × 17mm body and 1.0mm ball pitch. Pin A17 is No Connect (NC) for this specific variant, as confirmed in the Pin Configuration diagrams and Notes section of the datasheet.
Is JTAG boundary-scan supported on the 70T3599S166BF8, and what standard does it comply with?
Yes, the 70T3599S166BF8 supports JTAG boundary-scan compliant with IEEE 1149.1. Signals TDI, TDO, TCK, TMS, and TRST are implemented per the Pin Names table, and functionality is verified in the Functional Block Diagram. JTAG remains active even during ZZ sleep mode, enabling debug and test continuity.
70T3599S166BF8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70T3599S166BF8 FAQ
1.How can I place an order for 70T3599S166BF8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3599S166BF8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3599S166BF8 reliable?
The price and inventory of 70T3599S166BF8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S166BF8 is usually 5 days.
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Once your 70T3599S166BF8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3599S166BF8?
For technical support, including 70T3599S166BF8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S166BF8 requirements.
6.How does Aetrix verify that 70T3599S166BF8 is sourced from the original manufacturer or authorized distributors?
All 70T3599S166BF8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S166BF8 meets industry standards.
7.What is the process for return or replacement of 70T3599S166BF8?
All 70T3599S166BF8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S166BF8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3599S166BF8 part is unused and in its original packaging.
Return procedure for 70T3599S166BF8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T3599S166BF8 Tags
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