Renesas 70T3599S200BC
- Part No.:
- 70T3599S200BC
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3599S200BC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3599S200BC from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 200MHz (5ns cycle time), supports 2.5V core and selectable 2.5V/3.3V I/O interfaces per port, and features pipelined or flow-through output modes for burst data transfer in telecom switching fabric and network packet buffering applications.
For engineers reviewing the 70T3599S200BC datasheet, 70T3599S200BC pinout, 70T3599S200BC application, or 70T3599S200BC equivalent, key selection criteria include its 200MHz commercial-grade timing (3.4ns tCD2), independent port voltage configuration via OPT pins, JTAG-compliant IEEE 1149.1 test support, and 256-pin BGA package with industrial-temperature-compatible variants.
Technical Context
The 70T3599S200BC implements fully synchronous operation on both left and right ports with register-controlled address, data, and control inputs-enabling minimal setup/hold times (1.5ns tSA, 0.5ns tHA) at 200MHz. Its dual-chip-enable architecture allows depth expansion without external logic, while counter enable (CNTEN) and repeat (REPEAT) functions support sequential burst addressing.
Each port features independent power domains: VDD = 2.5V ±100mV for core logic, and VDDQ configurable to either 3.3V ±150mV or 2.5V ±100mV via OPTL/OPTR pins. The device includes interrupt and collision detection flags (INTR/COLR, INTL/COLL), sleep mode (ZZL/ZZR), and JTAG boundary-scan support compliant with IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9.2 Mbit); enables single-chip storage for 36-bit wide data paths in switch fabric controllers. |
| Max Clock Frequency | 200 MHz (5 ns cycle time); delivers 14 Gbps aggregate bandwidth across both ports for high-throughput packet buffering. |
| Access Time (Pipelined) | 3.4 ns tCD2 (max); ensures sub-4ns data valid after clock edge in pipelined mode for tight-timing burst reads. |
| Supply Voltages | VDD = 2.5V ±100 mV (core); VDDQ = 2.5V or 3.3V ±150/±100 mV per port; enables mixed-voltage system integration. |
| Operating Temperature | 0°C to +70°C (Commercial grade); validated for stable operation in telecom line cards and enterprise networking equipment. |
| Package | 256-pin BGA (BC256/BCG256); 17 mm × 17 mm body, 1.0 mm ball pitch; compatible with standard SMT reflow profiles. |
| JTAG Support | IEEE 1149.1 compliant (TCK, TMS, TDI, TDO, TRST); enables in-system test and debug without additional probe hardware. |
Pinout & Package
70T3599S200BC is housed in a 256-pin Ball Grid Array (BGA) package (BC256/BCG256), measuring 17 mm × 17 mm × 1.4 mm with 1.0 mm ball pitch. All VDD pins require connection to 2.5V; VDDQ pins must be supplied at 3.3V if corresponding OPT pin is set to VDD, or 2.5V if OPT is tied to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all registered inputs/outputs on left/right port respectively. |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A17 is NC for 70T3599, simplifying address decoding logic. |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data I/O | 36-bit parallel data path per port; supports byte-wise write masking via BE0–BE3 (9-bit granularity). |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Independent port enable control; dual CE architecture permits seamless depth expansion without glue logic. |
| PL/FTL / PL/FTR | Output mode select | Configures pipelined (VIH) or flow-through (VIL) output timing per port-critical for matching system latency requirements. |
| OPTL / OPTR | I/O voltage option control | DC-selects VDDQ operating level: VDD → 3.3V I/O, VSS → 2.5V I/O; enables mixed-voltage interconnect between legacy and modern ASICs. |
| ZZL / ZZR | Sleep mode enable | Asserting VIH disables dynamic inputs (except JTAG), reducing current to ≤15 mA; essential for low-power standby in carrier-grade systems. |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses-required for real-time arbitration in shared-memory switch fabrics. |
| Selectable pipelined or flow-through output | Pipelined mode achieves 3.4ns tCD2 at 200MHz; flow-through mode provides deterministic 10ns tCD1 for latency-sensitive control plane access. |
| Independent port voltage configuration | OPTL/OPTR pins allow left port at 3.3V and right port at 2.5V-eliminates level-shifter components in heterogeneous SoC interfaces. |
| Counter enable and repeat functionality | CNTENL/R and REPEATL/R support auto-incrementing burst reads/writes without CPU intervention-reducing host overhead in packet processing engines. |
| Interrupt and collision detection flags | INTR/COLR and INTL/COLL outputs signal port contention or completion events-enabling hardware-driven synchronization in multi-threaded firmware. |
Applications
| Telecom Switch Fabric Memory | Network Packet Buffering |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-class routers with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress and egress traffic managers, supporting simultaneous packet write (ingress) and read (egress) at line rate. Use Value: 200MHz operation and 3.4ns pipelined access enable full-duplex 10Gbps+ throughput with sub-10ns memory latency, meeting ITU-T G.8261 jitter tolerance. | Use Scenario: Temporary storage of fragmented UDP/TCP segments during deep packet inspection in next-gen firewalls. IC Role / Device Role / Timing Role: High-bandwidth memory resource accessed concurrently by DPI engine (read) and packet classifier (write) on separate ports. Use Value: Independent 2.5V/3.3V I/O per port allows direct interface to 2.5V FPGA packet parser and 3.3V ARM-based control processor-no level shifters required. |
| Real-Time Signal Processing | Industrial PLC Data Exchange |
Use Scenario: Coordinating sensor data acquisition and actuator command generation in radar beamforming subsystems. IC Role / Device Role / Timing Role: Shared memory buffer between ADC front-end (left port) and DSP accelerator (right port), synchronized via common clock domain. Use Value: Collision detection (COLL/COLR) flags provide hardware signaling of concurrent access attempts-preventing data corruption without software arbitration overhead. | Use Scenario: Exchanging process variables between redundant safety controllers and fieldbus masters in SIL2-certified PLC systems. IC Role / Device Role / Timing Role: Deterministic memory interface ensuring atomic read-modify-write cycles across dual-controller architecture. Use Value: 5ns cycle time and 1.5ns address setup time guarantee worst-case 100ns memory transaction-meeting IEC 61508 loop timing constraints for fail-safe logic execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-200AXC | 256K × 36, 3.3V core, 200MHz, 208-pin PQFP; no OPT pin flexibility-fixed 3.3V I/O only. | Lacks per-port voltage selection; requires external level shifters when interfacing to 2.5V logic. | Choose when board layout already accommodates PQFP and system uses uniform 3.3V signaling. |
| IDT70V9269L15PF | 256K × 36, 3.3V core, 15ns access, 208-pin PQFP; asynchronous dual-port, no JTAG or pipelined mode. | No pipelined output or IEEE 1149.1 support; unsuitable for 200MHz synchronous burst applications. | Choose only for cost-sensitive legacy designs where 15ns access suffices and JTAG is unnecessary. |
Compared with CY7C1362BV33-200AXC and IDT70V9269L15PF, the 70T3599S200BC uniquely delivers per-port I/O voltage configurability, pipelined timing at 200MHz, and integrated JTAG-making it the only option among the three that meets modern high-speed, mixed-voltage, and testable system requirements.
Availability
70T3599S200BC is available at Aetrix Electronics and suitable for telecom infrastructure, network security appliances, and industrial automation systems requiring stable component supply across extended production lifecycles.
Supply support for 70T3599S200BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
The 70T35xx family was designed specifically for high-bandwidth, low-latency shared-memory applications in packet-switched networks, telecom base stations, and real-time embedded control systems requiring true dual-port synchronous operation.
FAQ
What is the maximum operating frequency of the 70T3599S200BC and under what conditions is it guaranteed?
The 70T3599S200BC is rated for 200MHz operation (5ns cycle time) in commercial temperature range (0°C to +70°C). This is guaranteed with VDD = 2.5V ±100mV, VDDQ = 3.3V ±150mV or 2.5V ±100mV per port, and proper termination per AC Test Conditions in the datasheet. The 200MHz speed is not available in fpBGA or PQFP packages-only in the 256-pin BGA variant like the 70T3599S200BC.
Does the 70T3599S200BC support independent voltage configuration on its left and right ports?
Yes, the 70T3599S200BC supports fully independent I/O voltage configuration via OPTL and OPTR pins. Setting OPTL to VDD configures the left port for 3.3V I/O levels (requiring VDDQL = 3.3V), while setting OPTR to VSS configures the right port for 2.5V I/O (requiring VDDQR = 2.5V). This enables direct interfacing with mixed-voltage ASICs or FPGAs without external level shifters.
How does the pipelined versus flow-through output mode affect timing in the 70T3599S200BC?
In pipelined mode (PL/FTX = VIH), the 70T3599S200BC achieves 3.4ns clock-to-data valid (tCD2) at 200MHz, ideal for burst transfers where latency can be hidden. In flow-through mode (PL/FTX = VIL), tCD1 is 10ns max-providing deterministic, zero-cycle-delay output timing critical for control-plane accesses. Mode selection is per-port and static during operation.
What is the function of the CNTEN and REPEAT pins on the 70T3599S200BC, and how are they used in practice?
CNTENL/R enables automatic address increment on each clock cycle, while REPEATL/R resets the internal address counter to the last ADS-loaded address. In practice, this allows the 70T3599S200BC to perform sequential burst reads/writes without CPU address updates-reducing host overhead in packet processors and digital signal chains where contiguous memory blocks are accessed repeatedly.
Is JTAG boundary-scan supported on the 70T3599S200BC, and which package options include it?
Yes, the 70T3599S200BC supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, TDO, and TRST pins. JTAG is available only in the 256-pin BGA (BC256/BCG256) package-the 208-pin fpBGA (BF208) and PQFP (DR208) variants omit JTAG due to pin count limitations, as explicitly noted in the datasheet.
70T3599S200BC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3599S200BC FAQ
1.How can I place an order for 70T3599S200BC through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3599S200BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3599S200BC reliable?
The price and inventory of 70T3599S200BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S200BC is usually 5 days.
3.What payment methods are accepted for 70T3599S200BC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3599S200BC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T3599S200BC?
70T3599S200BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3599S200BC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3599S200BC?
For technical support, including 70T3599S200BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S200BC requirements.
6.How does Aetrix verify that 70T3599S200BC is sourced from the original manufacturer or authorized distributors?
All 70T3599S200BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S200BC meets industry standards.
7.What is the process for return or replacement of 70T3599S200BC?
All 70T3599S200BC units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S200BC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3599S200BC part is unused and in its original packaging.
Return procedure for 70T3599S200BC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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