Renesas 70T3599S200BC8
- Part No.:
- 70T3599S200BC8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T3599S200BC8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T3599S200BC8 from Integrated Device Technology is a high-speed 256K × 36-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location. It operates at 200MHz (5ns cycle time), supports independent 2.5V core and selectable 2.5V/3.3V I/O interfaces per port, and delivers 14Gbps aggregate bandwidth. It is used in high-throughput packet buffering for telecom line cards and FPGA co-processor memory subsystems.
For engineers reviewing the 70T3599S200BC8 datasheet, 70T3599S200BC8 pinout, 70T3599S200BC8 application, or 70T3599S200BC8 equivalent, key selection criteria include pipelined vs. flow-through output mode timing, dual-voltage I/O configurability per port, industrial-grade 166MHz operation capability, and BGA package compatibility with high-density PCB layouts.
Technical Context
The 70T3599S200BC8 implements fully synchronous dual-port operation with independent clock domains (CLKL/CLKR), register-controlled address/data/control inputs, and self-timed write logic enabling minimal setup/hold times. Its dual chip enables (CE0/CE1 per port) support depth expansion without external logic, while counter enable (CNTEN) and repeat (REPEAT) features enable burst address generation.
It integrates JTAG IEEE 1149.1 boundary-scan support, interrupt/collision detection flags (INTR/COLR, INTL/COLL), and sleep mode (ZZL/ZZR) that disables dynamic inputs while preserving JTAG accessibility. Address A17 is NC, confirming its 256K × 36 configuration (18-bit address space truncated to 17 bits).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9-Mbit total); supports 256K-word addressing with 36-bit parallel I/O per port |
| Max Clock Frequency | 200MHz (5ns cycle time) - enables 14Gbps aggregate bandwidth across both ports |
| Access Time | 3.4ns (clock-to-data out, pipelined mode) - critical for low-latency inter-processor communication |
| Supply Voltages | 2.5V ±100mV core (VDD); independent 2.5V/3.3V I/O (VDDQ) per port via OPTL/OPTR pins |
| Operating Temperature | -40°C to +85°C (industrial grade) at 166MHz; commercial 0°C to +70°C at 200MHz |
| Package | 256-pin BGA (BC256), 17mm × 17mm × 1.4mm body, 1.0mm ball pitch |
| Power Management | Sleep mode (ZZL/ZZR) reduces current to ≤15mA; full standby (ISB3) draws ≤5mA at f=0 |
Pinout & Package
70T3599S200BC8 is housed in a 256-pin Ball Grid Array (BC256) package with 17mm × 17mm footprint and 1.0mm ball pitch. All VDD pins require 2.5V supply; VDDQ pins must match OPT pin state (3.3V if OPT = VDD, 2.5V if OPT = VSS). NC pins include A17L, A17R, and multiple reserved positions per pin map.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for left/right port operations |
| A0L–A16L / A0R–A16R | Address inputs | 17-bit address bus per port; A17 is NC confirming 256K depth (218 = 256K) |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional data bus | 36-bit parallel interface per port; byte enables (BE0–BE3) allow 9-bit granularity writes |
| CE0L/CE1L / CE0R/CE1R | Chip enable pair | Dual enables permit depth expansion without glue logic; both must be active for access |
| R/WL / R/WR | Read/write control | Active-high signal determining direction of data transfer on respective port |
| OEL / OER | Output enable | Asynchronous control disabling outputs to high-Z; critical for bus sharing |
| PL/FTL / PL/FTR | Pipeline/flow-through mode select | DC-level input selecting pipelined (1-cycle latency) or flow-through (0-cycle latency) output timing |
| ZZL / ZZR | Sleep mode enable | Asserting high disables dynamic inputs (except JTAG), reducing power to ≤15mA |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous independent read/write to identical addresses - essential for lock-free inter-processor communication |
| Selectable pipelined or flow-through output | Reduces system latency by up to 6.6ns (vs. flow-through) or improves timing margin in high-speed designs |
| Dual chip enables per port | Eliminates need for external decode logic when expanding memory depth beyond 256K words |
| Independent I/O voltage per port | Allows interfacing with 2.5V FPGAs on one port and 3.3V ASICs on the other without level shifters |
| Interrupt and collision detection flags | Hardware-asserted INTR/COLR and INTL/COLL signals reduce software polling overhead in real-time systems |
| JTAG IEEE 1149.1 compliance | Enables boundary-scan testing and in-system debugging without dedicated test pads or probes |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade switches. IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between ingress and egress traffic managers with zero-contention access. Use Value: 200MHz operation and 3.4ns tCD2 enable sub-10ns packet header lookup latency, meeting ITU-T G.8261 jitter requirements. |
Use Scenario: Providing low-latency scratchpad memory for Xilinx Virtex UltraScale+ FPGA-based radar signal processors. IC Role / Device Role / Timing Role: Off-chip memory extension synchronized to FPGA's 200MHz AXI4-Stream interface using pipelined output mode. Use Value: Independent 2.5V I/O per port matches FPGA VCCO banks, eliminating level shifters and reducing BOM cost by $0.32/unit. |
| Industrial PLC Motion Control | Avionics Data Concentrator |
Use Scenario: Real-time coordination of multi-axis servo drives requiring deterministic memory access for position/velocity buffers. IC Role / Device Role / Timing Role: Shared memory between ARM Cortex-R5 safety controller and FPGA motion sequencer with collision detection for conflict resolution. Use Value: Industrial -40°C to +85°C rating and 166MHz guaranteed timing ensure reliable operation in uncooled control cabinets. |
Use Scenario: Aggregating sensor data from ARINC 429 and MIL-STD-1553 buses in flight management computers. IC Role / Device Role / Timing Role: Dual-port buffer decoupling asynchronous legacy bus interfaces from deterministic ARINC 664 (AFDX) network stack. Use Value: JTAG boundary-scan support meets DO-254 tool qualification requirements for airborne hardware verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-200AXC | 3.3V core and I/O; no 2.5V option; 200MHz max; 256K × 18-bit (half-width) | Requires two devices for 36-bit width; lacks independent I/O voltage selection per port | Choose only if system uses 3.3V-only logic and board layout accommodates dual-device placement |
| AS7C33256P-20JCIN | Asynchronous interface; 20ns access time; 3.3V only; 256K × 36-bit in 208-pin PQFP | No pipelined mode, no JTAG, no sleep mode; incompatible with high-speed synchronous designs | Consider only for cost-sensitive, non-real-time applications where 20ns latency is acceptable |
Compared with CY7C1362BV33-200AXC and AS7C33256P-20JCIN, the 70T3599S200BC8 uniquely supports mixed-voltage I/O per port, pipelined output timing, and industrial temperature operation at 166MHz - making it the sole option for compact, low-power, high-bandwidth dual-processor memory sharing.
Availability
70T3599S200BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and avionics applications requiring stable component supply across extended product lifecycles.
Supply support for 70T3599S200BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF products for communications and computing markets.
The 70T35xx family was designed specifically for ultra-low-latency, high-bandwidth inter-processor communication in telecom, defense, and industrial control systems requiring true dual-port synchronous SRAM.
FAQ
What is the maximum operating frequency of the 70T3599S200BC8 and under what conditions?
The 70T3599S200BC8 achieves 200MHz operation (5ns cycle time) in commercial temperature range (0°C to +70°C). At industrial temperatures (-40°C to +85°C), it is rated for 166MHz (6ns cycle time). Both ratings assume proper power supply decoupling, VDD = 2.5V ±100mV, and VDDQ matched to OPT pin configuration (2.5V or 3.3V).
Does the 70T3599S200BC8 support independent voltage selection for each port's I/O interface?
Yes, the 70T3599S200BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting OPTL = VSS (0V) configures it for 2.5V I/O with VDDQL = 2.5V. The right port operates identically but independently using OPTR and VDDQR.
How does the pipelined versus flow-through output mode affect system timing in the 70T3599S200BC8?
In pipelined mode (PL/FTX = VIH), the 70T3599S200BC8 adds one clock cycle latency to data output (tCD2 = 3.4ns at 200MHz) but enables tighter clock-to-clock timing margins. In flow-through mode (PL/FTX = VIL), data appears with zero-cycle latency (tCD1 = 10ns at 200MHz), increasing absolute access time but simplifying timing closure in systems with limited skew budget.
What is the function of the ZZL and ZZR pins on the 70T3599S200BC8, and how does sleep mode impact power consumption?
ZZL and ZZR are independent sleep mode enable inputs. When asserted high, each shuts down dynamic circuitry on its respective port while preserving JTAG functionality and static inputs (OPT, PL/FT). In sleep mode, the 70T3599S200BC8 draws ≤15mA total current - a >95% reduction compared to active 200MHz operation (375mA typical).
Is JTAG boundary-scan supported on the 70T3599S200BC8, and which package options include it?
Yes, the 70T3599S200BC8 supports IEEE 1149.1 JTAG boundary-scan with TCK, TMS, TDI, TDO, and TRST pins. JTAG is available in the 256-pin BGA (BC256) and 208-pin fpBGA (BF208) packages, but explicitly excluded from the 208-pin PQFP (DR208) due to pin count limitations per the datasheet note on page 4.
70T3599S200BC8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.4 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T3599S200BC8 FAQ
1.How can I place an order for 70T3599S200BC8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T3599S200BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T3599S200BC8 reliable?
The price and inventory of 70T3599S200BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T3599S200BC8 is usually 5 days.
3.What payment methods are accepted for 70T3599S200BC8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T3599S200BC8 transactions.
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4.How is shipping managed for 70T3599S200BC8?
70T3599S200BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T3599S200BC8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T3599S200BC8?
For technical support, including 70T3599S200BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T3599S200BC8 requirements.
6.How does Aetrix verify that 70T3599S200BC8 is sourced from the original manufacturer or authorized distributors?
All 70T3599S200BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T3599S200BC8 meets industry standards.
7.What is the process for return or replacement of 70T3599S200BC8?
All 70T3599S200BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T3599S200BC8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T3599S200BC8 part is unused and in its original packaging.
Return procedure for 70T3599S200BC8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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