Renesas 70T3719MS133BBG

Overview

70T3719MS133BBG from Integrated Device Technology is a high-speed 256K x 72-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location on independent left and right ports. It operates at 133MHz (7.5ns cycle time) in pipelined mode, supports selectable 2.5V or 3.3V I/O interfaces per port, and features JTAG boundary scan, interrupt/collision flags, and sleep mode (ZZL/ZZR). It is used in high-bandwidth packet buffering for telecom line cards and network switches.

For engineers reviewing the 70T3719MS133BBG datasheet, 70T3719MS133BBG pinout, 70T3719MS133BBG application, or 70T3719MS133BBG equivalent, key selection criteria include pipelined vs. flow-through timing modes, per-port voltage configuration (OPTL/OPTR), byte-enable granularity (BE0–BE7), collision detection latency (tCOLS ≤ 4.2ns), and BGA-324 thermal/mechanical compatibility in space-constrained embedded systems.

Technical Context

The 70T3719MS133BBG implements fully synchronous dual-port operation with independent clock inputs (CLKL/CLKR), separate chip enables (CE0L/CE1L, CE0R/CE1R), and asynchronous output enable (OEL/OER) and sleep control (ZZL/ZZR). Its memory array uses true dual-port cells-no internal arbitration-allowing concurrent access without contention.

It integrates address counter logic with ADSL/ADSR strobes, CNTENL/CNTENR enable, and REPEATL/REPEATR reset functionality for burst address generation. Pipelined output mode (PL/FTL = VIH) delivers tCD2 ≤ 4.2ns clock-to-data, while flow-through mode (PL/FTL = VIL) yields tCD1 ≤ 15ns but eliminates pipeline latency for deterministic timing-critical reads.

Key Specifications

Pinout & Package

70T3719MS133BBG is housed in a green 324-pin Ball Grid Array (BBG324) package with 19mm × 19mm body and 1.0mm ball pitch. Thermal profile and mechanical footprint comply with JEDEC MO-270AB.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1375BV33-167AXC and AS7C33128PFSI-133BIN, the 70T3719MS133BBG uniquely supports 256K × 72-bit density with per-port voltage selection, pipelined/flow-through timing modes, and integrated collision/interrupt signaling-enabling higher throughput and lower system-level complexity in telecom and radar applications.

Availability

70T3719MS133BBG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and defense electronics requiring stable component supply, long lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70T3719MS133BBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T3719MS133BBG belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic, low-latency shared memory in packet-processing and real-time control systems.

FAQ

What is the maximum operating frequency of the 70T3719MS133BBG in pipelined mode?

The 70T3719MS133BBG achieves a maximum operating frequency of 133MHz in pipelined mode, corresponding to a 7.5ns clock cycle time (tCYC2). This specification is guaranteed across the industrial temperature range (−40°C to +85°C) and applies when PL/FTL and PL/FTR are set to VIH. The device also supports 166MHz operation in commercial-grade variants, but the 70T3719MS133BBG is rated specifically for 133MHz.

How does the 70T3719MS133BBG handle simultaneous access to the same memory address from both ports?

The 70T3719MS133BBG uses true dual-port SRAM cells that permit simultaneous, independent read and write operations to the exact same memory address-one port can read while the other writes without arbitration, conflict, or data corruption. This architecture eliminates wait states and ensures deterministic timing, critical for real-time packet buffering and control loop applications where latency predictability is mandatory.

Can the left and right ports of the 70T3719MS133BBG operate at different I/O voltage levels?

Yes-the 70T3719MS133BBG supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5V) configures the left port for 3.3V I/O operation (requiring VDDQL = 3.3V), while OPTR = VSS (0V) sets the right port to 2.5V I/O (requiring VDDQR = 2.5V). This enables seamless interfacing with mixed-voltage SoCs or FPGAs without level-shifting circuitry.

What is the function of the COLL and INTR pins on the 70T3719MS133BBG?

The COLL (collision alert) and INTR (interrupt flag) pins on the 70T3719MS133BBG are open-drain active-low outputs that signal concurrent access attempts and user-triggered events. COLL asserts when both ports attempt write access to the same address within one clock cycle; INTR is set by software via the interrupt register or hardware event. Both flags simplify system-level synchronization and eliminate polling overhead in real-time firmware.

Does the 70T3719MS133BBG support JTAG boundary scan, and what are its capabilities?

Yes-the 70T3719MS133BBG includes full IEEE 1149.1 JTAG boundary scan with TCK, TMS, TDI, TDO, and TRST pins. It supports instruction register testing, data register integrity checks, and interconnect testing across the BGA-324 package. Boundary scan operates independently of sleep mode (ZZL/ZZR), enabling in-system test even during low-power states-critical for high-reliability telecom and aerospace deployments.