Renesas 70T631S10BCI8
- Part No.:
- 70T631S10BCI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70T631S10BCI8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T631S10BCI8 from IDT (now Renesas) is a high-speed 256K × 18-bit asynchronous dual-port static RAM with independent left/right ports, 10 ns max access time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port-used in real-time inter-processor communication, FPGA co-processing, and telecom packet buffering.
For engineers reviewing the 70T631S10BCI8 datasheet, 70T631S10BCI8 pinout, 70T631S10BCI8 application, or 70T631S10BCI8 equivalent, key selection criteria include dual-port arbitration logic, RapidWrite Mode timing compliance, BUSY/INT flag behavior in Master/Slave cascading, and BGA-208 package thermal/mechanical constraints for high-density PCB layout.
Technical Context
This device implements true dual-port SRAM cells enabling simultaneous read/write to the same memory location without external arbitration. Its on-chip port arbitration logic resolves contention via semaphore signaling and BUSY flag handshaking, supporting both autonomous and JTAG-controlled operation.
The 70T631S10BCI8 operates fully asynchronously per port with separate CE0/CE1, R/W, OE, UB/LB controls and supports RapidWrite Mode-eliminating R/W pulse requirements between back-to-back writes by using address transition as the write boundary, subject to tAAS ≤ 1 ns and tARF ≥ 1.5 V/ns.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18 bits (4.5 Mbit), A18 pin NC confirms 256K depth |
| Access Time (tAA) | 10 ns max - defines minimum address hold before valid data at outputs |
| Core Supply (VDD) | 2.5 V ±100 mV - powers internal logic; requires stable low-noise regulation |
| I/O Voltage Support | Selectable 2.5 V or 3.3 V per port via OPTL/OPTR pins - enables mixed-voltage system interfacing |
| Operating Temperature | –40°C to +85°C - qualified for industrial embedded control and base station applications |
| Package | 208-ball fine-pitch BGA (BF208), 0.8 mm pitch, 15 mm × 15 mm body - requires controlled-depth reflow and X-ray inspection |
| Standby Current (ISB3) | 2 mA typ / 10 mA max - achieved when both ports fully deselected with CMOS-level inputs |
Pinout & Package
208-ball fine-pitch BGA (BF208) package, 0.8 mm ball pitch, 15 mm × 15 mm footprint, 1.4 mm height. Thermal pad not present; all VDD/VSS balls require dedicated power/ground plane stitching.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A17L, A0R–A17R | Address Inputs (Left/Right) | 18-bit address bus per port; A18X is NC per datasheet Note 1 - confirms 256K depth |
| I/O0L–I/O17L, I/O0R–I/O17R | Data I/O Bidirectional Bus | 18-bit parallel data path per port; supports byte-wide access via LBL/UBR controls |
| CE0L/CE1L, CE0R/CE1R | Chip Enable Pair | Dual CE architecture enables depth expansion without glue logic; CE0=VIL & CE1=VIH = active |
| R/WL, R/WR | Read/Write Control | Active-low write enable; held low during RapidWrite Mode for consecutive writes |
| BUSYL, BUSYR | Busy Flag | Output when M/S=VIH (Master), input when M/S=VIL (Slave) - enables hardware flow control in cascaded systems |
| SEML, SEMR | Semaphore Enable | Activates 8-bit semaphore register (A0–A2 addressed); used for inter-port synchronization |
| ZZL, ZZR | Sleep Mode Input | Asserted high disables dynamic inputs (except JTAG), reducing current to ≤10 mA |
| M/S | Master/Slave Select | Configures BUSY as output (Master) or input (Slave); required for 36-bit+ bus expansion |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Enables concurrent read/write to identical memory locations - eliminates software arbitration overhead in real-time systems |
| RapidWrite Mode | Removes need to toggle R/W between writes; reduces cycle setup complexity and improves sustained write bandwidth at 10 ns timing |
| Per-Port I/O Voltage Selection | OPTL/OPTR pins independently configure each port for 2.5 V or 3.3 V signaling - simplifies integration with mixed-voltage FPGAs or ASICs |
| On-Chip Semaphore Logic | Hardware-managed 8-bit semaphore flags accessible via I/O0–I/O17 - provides deterministic, low-latency inter-processor coordination |
| JTAG Support (IEEE 1149.1) | Available in BGA-208 package - enables boundary-scan testing without additional test fixtures or probe access |
Applications
| Telecom Packet Buffering | FPGA Co-Processing Interface |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in base station line cards where latency must be sub-20 ns. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state buffer between ingress/egress MACs and traffic manager ASICs. Use Value: 10 ns tAA and full asynchronous operation ensure deterministic frame handoff without CPU intervention or clock domain crossing. | Use Scenario: Sharing real-time sensor data between dual-FPGA subsystems in industrial vision systems. IC Role / Device Role / Timing Role: Memory bridge enabling simultaneous read by one FPGA while the other writes new frame metadata. Use Value: True dual-port cell design guarantees atomic access to shared variables, eliminating race conditions in safety-critical motion control loops. |
| Real-Time Inter-Processor Communication | Avionics Data Concentrator Buffer |
Use Scenario: Exchanging telemetry and command packets between flight control and navigation processors in DO-254-compliant avionics. IC Role / Device Role / Timing Role: Hardware-arbitrated memory conduit with BUSY/INT flags ensuring deterministic handshake timing. Use Value: On-chip arbitration logic and semaphore support reduce firmware complexity and eliminate external logic gates - critical for certification traceability. | Use Scenario: Aggregating ARINC 429 and discrete I/O data streams in airborne data acquisition units. IC Role / Device Role / Timing Role: High-reliability buffer operating across –40°C to +85°C with full JTAG testability for field diagnostics. Use Value: Industrial temperature grade, green RoHS-compliant packaging, and IEEE 1149.1 support meet DO-160E environmental and test requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-10ZXC | 3.3 V core, 10 ns access, 256K × 18, TQFP-100 - no RapidWrite Mode or per-port I/O voltage selection | Requires external level shifters for 2.5 V FPGA interfaces; lacks hardware semaphore logic | Choose only if board space permits TQFP and system uses uniform 3.3 V signaling |
| AS7C33256PFS-10BIN | 2.5 V core, 10 ns access, 256K × 18, BGA-208 - no JTAG, no BUSY/INT flags, no Master/Slave cascade mode | Cannot implement hardware flow control or inter-processor semaphores; limited debug capability | Acceptable only for simple dual-CPU buffers where arbitration is handled entirely in software |
Compared with CY7C1362BV33-10ZXC and AS7C33256PFS-10BIN, the 70T631S10BCI8 uniquely delivers per-port I/O voltage flexibility, RapidWrite Mode for burst throughput, and integrated JTAG - making it the only option supporting certified avionics and telecom infrastructure designs requiring deterministic latency and testability.
Availability
70T631S10BCI8 is available at Aetrix Electronics and suitable for telecom infrastructure, avionics data concentrators, and industrial FPGA co-processing applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant green packaging.
Supply support for 70T631S10BCI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70T631S10BCI8 belongs to IDT's high-speed asynchronous dual-port SRAM product line, designed specifically for deterministic, low-latency inter-processor communication in mission-critical embedded systems where software arbitration introduces unacceptable jitter or overhead.
FAQ
What is the maximum operating frequency supported by the 70T631S10BCI8?
The 70T631S10BCI8 does not operate on a clock signal-it is an asynchronous dual-port SRAM. Its performance is defined by access time (tAA ≤ 10 ns) and cycle time (tRC ≤ 10 ns), enabling reliable operation in systems with effective data rates up to 100 MHz for back-to-back reads/writes under proper timing margins and load conditions.
Does the 70T631S10BCI8 support JTAG boundary scan testing?
Yes, the 70T631S10BCI8 supports IEEE 1149.1 JTAG boundary scan in its BGA-208 package (BF208). Pins TCK, TMS, TDI, TDO, and TRST are dedicated for this function, and JTAG operation remains functional even during sleep mode (ZZ asserted), though boundary scan is not recommended during sleep per datasheet Note 4.
How does the BUSY pin function in Master vs. Slave configuration on the 70T631S10BCI8?
When M/S = VIH, BUSYL/BUSYR act as totem-pole outputs indicating local port contention; when M/S = VIL, they become inputs accepting BUSY signals from a Master device. This bidirectional behavior enables daisy-chained arbitration in multi-device 36-bit+ memory systems without external logic, as confirmed in datasheet Note 2 and Truth Table I.
Can both ports of the 70T631S10BCI8 operate at different I/O voltages simultaneously?
Yes-the 70T631S10BCI8 allows independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VSS configures the left port for 2.5 V I/O, while OPTR = VDD configures the right port for 3.3 V I/O, with corresponding VDDQL/VDDQR supplies. This is explicitly documented in datasheet Note 3 on page 5.
What is the purpose of the RapidWrite Mode in the 70T631S10BCI8?
RapidWrite Mode allows consecutive write operations without pulsing R/W, CE, or byte enables between cycles-the ending address transition defines the write boundary. This reduces control timing complexity and improves sustained write throughput, provided tAAS ≤ 1 ns and tARF ≥ 1.5 V/ns per datasheet Table 14 and Figure 8.
70T631S10BCI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Asynchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70T631S10BCI8 FAQ
1.How can I place an order for 70T631S10BCI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T631S10BCI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T631S10BCI8 reliable?
The price and inventory of 70T631S10BCI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T631S10BCI8 is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T631S10BCI8?
For technical support, including 70T631S10BCI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T631S10BCI8 requirements.
6.How does Aetrix verify that 70T631S10BCI8 is sourced from the original manufacturer or authorized distributors?
All 70T631S10BCI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T631S10BCI8 meets industry standards.
7.What is the process for return or replacement of 70T631S10BCI8?
All 70T631S10BCI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T631S10BCI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T631S10BCI8 part is unused and in its original packaging.
Return procedure for 70T631S10BCI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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