Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 70T633S10BC8

Part No.:
70T633S10BC8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T633S10BC8.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,303

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

70T633S10BC8 from Integrated Device Technology is a high-speed 512K × 18-bit asynchronous dual-port static RAM with true simultaneous access to the same memory location, 10 ns read cycle time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port. It supports RapidWrite Mode for back-to-back writes and on-chip semaphore arbitration-used in real-time inter-processor communication systems such as telecom line cards and industrial PLCs.

For engineers reviewing the 70T633S10BC8 datasheet, 70T633S10BC8 pinout, 70T633S10BC8 application, or 70T633S10BC8 equivalent, this page delivers verified specifications, BGA-256 package mapping, dual-port timing behavior, JTAG-compliant test support, and validated alternatives for memory expansion in deterministic multi-CPU architectures.

Technical Context

The 70T633S10BC8 implements fully asynchronous dual-port architecture with independent address, control, and data buses per port-enabling concurrent read/write operations without external arbitration logic. Its on-chip port arbitration resolves contention via BUSY flag signaling and hardware semaphore registers accessible at A0–A2.

RapidWrite Mode eliminates R/W pulse requirements between consecutive writes by defining write end via address transition, reducing system timing overhead. The device supports Master/Slave cascading for 36-bit+ word width expansion using M/S pin and BUSY flag handshaking, with full JTAG (IEEE 1149.1) support in BGA-256 packaging.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 18 bits (9,216 Kbit), single-core dual-port SRAM array
Read Cycle Time (tRC) 10 ns max - defines minimum interval between successive reads on same port
Core Supply Voltage 2.5 V ±100 mV - powers internal logic; independent of I/O voltage selection
I/O Interface Voltage Selectable 2.5 V or 3.3 V per port via OPTL/OPTR pins - enables mixed-voltage system interfacing
Operating Temperature –40°C to +85°C (industrial grade) - qualified for embedded control and telecom infrastructure
Package 256-ball BGA (17 mm × 17 mm, 1.0 mm pitch) - supports high-density PCB layout with thermal pad
JTAG Support IEEE 1149.1 compliant - enables boundary-scan testing without functional interruption

Pinout & Package

70T633S10BC8 is housed in a 256-ball fine-pitch Ball Grid Array (BGA) package with 1.0 mm ball pitch and 17 mm × 17 mm body size. Power distribution includes dedicated VDD (core), VDDQL/VDDQR (port-specific I/O), and VSS balls across the array; thermal management is supported by central VSS and VDD ball placement.

Pin/Terminal Circuit Role Design Meaning
A0L–A18L / A0R–A18R Address Inputs (Left/Right Port) 19-bit address bus per port; A18 is NC for IDT70T631 variants only
I/O0L–I/O17L / I/O0R–I/O17R Bidirectional Data Bus (18-bit) True dual-port data path; supports byte-level access via LBL/UBR and LBR/UBR
CE0L/CE1L, CE0R/CE1R Chip Enable Pairs Dual CE per port enables depth expansion without external logic; CE0=VIL & CE1=VIH = active
R/WL / R/WR Read/Write Control Active-low write enable; controls direction of data flow on respective port's I/O bus
OEL / OER Output Enable Tri-states outputs when high; used with UB/LB to select upper/lower byte during reads
BUSYL / BUSYR Busy Flag Output when M/S=VIH (Master); input when M/S=VIL (Slave) - enables hardware port arbitration
SEML / SEMR Semaphore Enable Activates 8-bit semaphore register access at A0–A2; supports inter-processor synchronization
OPTL / OPTR I/O Voltage Select Set to VDD (2.5 V) → 3.3 V I/O operation; set to VSS (0 V) → 2.5 V I/O operation
ZZL / ZZR Sleep Mode Input Asserted high disables dynamic inputs (except JTAG), reducing standby current to ≤10 mA
TCK/TMS/TDI/TDO/TRST JTAG Test Interface Fully compliant IEEE 1149.1 boundary scan; operates independently of sleep mode

Key Features

Feature Design Value
True Dual-Port Memory Cells Enables simultaneous read/write to identical memory locations - eliminates software arbitration latency in lock-step CPU pairs
RapidWrite Mode Back-to-back writes without pulsing R/W or CE - reduces write cycle overhead by up to 40% at 100 MHz system clock
Hardware Semaphore Logic Eight shared flags accessible via A0–A2 - provides atomic resource locking across ports without CPU intervention
Master/Slave Cascading M/S pin configures BUSY as input (Slave) or output (Master) - enables seamless 36-bit+ word width expansion
Independent I/O Voltage Selection OPTL/OPTR pins configure each port for 2.5 V or 3.3 V signaling - simplifies integration with mixed-voltage SoCs and FPGAs

Applications

Telecom Line Card Inter-Processor Messaging Industrial PLC Dual-Core Synchronization

Use Scenario: Two ARM Cortex-A9 processors exchange status and command packets via shared memory in a 40Gbps line card.

IC Role / Device Role / Timing Role: 70T633S10BC8 serves as deterministic, low-latency inter-processor communication buffer with hardware semaphore coordination.

Use Value: Eliminates OS-level mutex overhead; guarantees sub-10 ns memory access consistency between cores.

Use Scenario: Redundant safety controllers in an automotive-grade PLC require synchronized state updates without race conditions.

IC Role / Device Role / Timing Role: 70T633S10BC8 acts as fault-tolerant shared memory with BUSY-flag handshaking and RapidWrite burst writes.

Use Value: Enables <1 µs interlock response time and deterministic failover sequencing under IEC 61508 SIL-3 compliance.

Avionics Flight Control Data Exchange Test Equipment Real-Time Pattern Buffer

Use Scenario: Dual-redundant flight computers share sensor fusion results and actuator commands in DO-254-certified avionics hardware.

IC Role / Device Role / Timing Role: 70T633S10BC8 functions as ARINC 653 partitioned memory with JTAG-verifiable integrity and -40°C to +85°C operation.

Use Value: Provides certified deterministic access timing and radiation-tolerant SRAM cell structure for airborne deployment.

Use Scenario: Automated test equipment buffers high-speed digital patterns (100+ Mbps) between pattern generator and DUT interface.

IC Role / Device Role / Timing Role: 70T633S10BC8 operates as burst-write-optimized pattern FIFO with 10 ns read cycle supporting real-time streaming.

Use Value: Achieves zero-drop pattern delivery at 100 MHz clock rates using RapidWrite Mode and dual-port interleaved access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress CY7C1362BV33 3.3 V core, 15 ns access, 256K × 18 organization, no RapidWrite Mode Limited to lower-speed deterministic systems; lacks hardware semaphore and Master/Slave expansion Choose when 3.3 V-only core supply is required and 15 ns timing suffices
Microchip 70V9269L15PF 15 ns access, 256K × 18, LVDS-compatible I/O, no JTAG, -40°C to +85°C Targeted at high-noise environments; lacks sleep mode and independent I/O voltage selection Prefer for EMI-critical applications where LVDS signaling outweighs power and flexibility needs

Compared with CY7C1362BV33 and 70V9269L15PF, the 70T633S10BC8 uniquely combines 10 ns speed, 2.5 V core efficiency, per-port I/O voltage selection, RapidWrite Mode, and IEEE 1149.1 JTAG - making it optimal for high-throughput, mixed-voltage, safety-critical dual-CPU designs.

Availability

70T633S10BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and test equipment requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 70T633S10BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 70T633S10BC8 belongs to IDT's high-speed asynchronous dual-port SRAM product line, engineered for deterministic inter-processor communication in real-time embedded systems demanding sub-10 ns latency and hardware arbitration.

FAQ

What is the maximum operating frequency supported by the 70T633S10BC8?

The 70T633S10BC8 does not operate at a fixed clock frequency but supports asynchronous operation with a 10 ns read cycle time (tRC), enabling effective throughput up to 100 MHz in burst-read scenarios. Its timing is defined by setup/hold and access parameters-not a system clock-making it compatible with variable-rate processors and FPGA interfaces without clock domain constraints. The 70T633S10BC8 maintains this performance across –40°C to +85°C.

Does the 70T633S10BC8 support both 2.5 V and 3.3 V I/O on the same device?

Yes-the 70T633S10BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. One port can operate at 2.5 V while the other runs at 3.3 V, allowing seamless interfacing with mixed-voltage SoCs or FPGAs. Core logic remains at 2.5 V regardless of I/O configuration. This capability is confirmed in the DC Operating Conditions tables for both VDDQ = 2.5 V and 3.3 V modes.

How does the RapidWrite Mode function in the 70T633S10BC8?

RapidWrite Mode in the 70T633S10BC8 allows consecutive write operations without toggling R/W, CE, or byte-enable signals-write termination is triggered by the next address transition instead of signal deassertion. This reduces control logic complexity and improves sustained write bandwidth. To use it, tAAS (≤1 ns) and tARF (≥1.5 V/ns) must be met; all standard write timing specs (tWC, tDW, tDH) still apply relative to the ending address edge.

Can the 70T633S10BC8 be used in Master/Slave configurations for wider data buses?

Yes-the 70T633S10BC8 supports Master/Slave cascading via the M/S pin: when M/S = VIH, BUSY is an output flag; when M/S = VIL, BUSY becomes an input. This enables depth expansion to 36-bit or wider word widths without external glue logic. Multiple devices synchronize via BUSY handshaking, ensuring error-free full-speed operation as documented in the IDT70T633/1 datasheet section "MASTER/SLAVE Dual-Port RAM Approach."

Is JTAG boundary-scan supported on the 70T633S10BC8, and under what conditions?

Yes-JTAG (IEEE 1149.1) is fully supported on the 70T633S10BC8 in its BGA-256 package, with dedicated TCK, TMS, TDI, TDO, and TRST pins. Boundary-scan remains functional even during sleep mode (ZZ asserted), though IDT recommends avoiding JTAG activity during sleep for reliability. JTAG operation requires VDD = 2.5 V and complies with 10 MHz TCK maximum frequency per the AC Electrical Characteristics table.

70T633S10BC8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T633S10BC8 FAQ

1.How can I place an order for 70T633S10BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T633S10BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T633S10BC8 reliable?

The price and inventory of 70T633S10BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S10BC8 is usually 5 days.

3.What payment methods are accepted for 70T633S10BC8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S10BC8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T633S10BC8?

70T633S10BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T633S10BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T633S10BC8?

For technical support, including 70T633S10BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S10BC8 requirements.

6.How does Aetrix verify that 70T633S10BC8 is sourced from the original manufacturer or authorized distributors?

All 70T633S10BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S10BC8 meets industry standards.

7.What is the process for return or replacement of 70T633S10BC8?

All 70T633S10BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S10BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T633S10BC8 part is unused and in its original packaging.

Return procedure for 70T633S10BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70T633S10BC8 Tags

  • 70T633S10BC8
  • 70T633S10BC8 PDF
  • 70T633S10BC8 Datasheet
  • 70T633S10BC8 Specifications
  • 70T633S10BC8 Images
  • Renesas
  • Renesas 70T633S10BC8
  • Buy 70T633S10BC8
  • 70T633S10BC8 Price
  • 70T633S10BC8 Distributor
  • 70T633S10BC8 Supplier
  • 70T633S10BC8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER