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Renesas 70T633S10BCI

Part No.:
70T633S10BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T633S10BCI.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,879

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Product details

Overview

70T633S10BCI from IDT (now Renesas) is a high-speed 512K × 18-bit asynchronous dual-port static RAM with independent left/right ports, 10 ns max access time, 2.5V core supply, and selectable 2.5V/3.3V I/O interface per port. It supports true simultaneous read/write to the same memory location and is used in real-time inter-processor communication, FPGA co-processing buffers, and telecom packet buffering systems.

For engineers reviewing the 70T633S10BCI datasheet, 70T633S10BCI pinout, 70T633S10BCI application, or 70T633S10BCI equivalent, key selection considerations include its RapidWrite Mode for back-to-back writes, on-chip semaphore arbitration, BUSY/INT flag signaling, JTAG IEEE 1149.1 support, and industrial-grade –40°C to +85°C operation in BGA-256 package.

Technical Context

The 70T633S10BCI implements fully asynchronous dual-port architecture with separate address, control, and data buses per port, enabling concurrent access without external arbitration logic. Its on-chip port arbitration logic handles contention via BUSY flag assertion and supports MASTER/SLAVE cascading for 36-bit+ word expansion using M/S pin configuration.

RapidWrite Mode eliminates need to toggle R/W or CE between consecutive writes - write termination is triggered by address transition instead of control signal deassertion. The device also integrates JTAG boundary-scan test capability compliant with IEEE 1149.1, available only in BGA-208 and BGA-256 packages.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 512K × 18 bits (9,216 Kbit), organized as two independent 512K-word × 18-bit ports
Access Time (tAA) 10 ns max - enables 100 MHz sustained random access in high-throughput inter-processor links
Core Supply Voltage 2.5 V ± 100 mV - fixed low-voltage core reduces dynamic power and heat generation
I/O Interface Voltage Selectable 2.5 V or 3.3 V per port via OPTL/OPTR pins - allows mixed-voltage system integration
Operating Temperature –40°C to +85°C - qualified for industrial embedded applications without derating
Package 256-ball BGA (17 mm × 17 mm, 1.0 mm pitch) - supports high-density PCB layouts with thermal vias
Power Consumption ISB3 = 2–10 mA full standby current - ultra-low quiescent draw during idle with CMOS-level inputs

Pinout & Package

70T633S10BCI is housed in a 256-ball fine-pitch Ball Grid Array (BGA) package with 1.0 mm ball pitch and 17 mm × 17 mm body size. All VDD pins require 2.5 V; VDDQ pins must be supplied at 2.5 V or 3.3 V depending on corresponding OPT pin state. Ground connections are distributed across 42 VSS balls for low-inductance return paths.

Pin/Terminal Circuit Role Design Meaning
A0L–A18L / A0R–A18R Address Inputs (Left/Right) 19-bit address per port; A18 is NC for IDT70T631 but functional for 70T633
I/O0L–I/O17L / I/O0R–I/O17R Bidirectional Data Bus (18-bit) True dual-port data path - simultaneous read/write to same location supported
CE0L/CE1L, CE0R/CE1R Chip Enable Pair (Active-Low Logic) Dual CE per port enables flexible power-down control and depth expansion without glue logic
R/WL / R/WR Read/Write Control (Active-Low) Controls direction of data flow; held low during RapidWrite Mode for back-to-back writes
OEL / OER Output Enable (Active-Low) Tri-states outputs independently per port - critical for bus sharing in multi-master systems
UBL/LBL, UBR/LBR Upper/Lower Byte Select Enables byte-level write masking - supports 9-bit sub-word writes without read-modify-write
BUSYL / BUSYR Busy Flag (Totem-Pole Output) Indicates port contention; output when M/S = VIH (Master), input when M/S = VIL (Slave)
SEML / SEMR Semaphore Enable (Input) Activates 8-bit hardware semaphore register accessed via A0–A2 - enables atomic inter-port sync
INTL / INTR Interrupt Flag (Totem-Pole Output) Asserts on semaphore change or write completion - reduces polling overhead in RTOS environments
M/S Master/Slave Select (Input) Configures BUSY pin behavior and arbitration role - required for cascaded 36-bit+ memory systems
ZZL / ZZR Sleep Mode Input (Active-High) Shuts down dynamic inputs (except JTAG) - reduces ICC to ≤10 mA while preserving state
OPTL / OPTR I/O Voltage Option (Input) Selects 2.5 V or 3.3 V I/O levels per port - sets VDDQX requirement and VIH/VIL thresholds
TCK/TMS/TDI/TDO/TRST JTAG Test Interface IEEE 1149.1-compliant boundary scan - enables in-system test and debug without physical probe access

Key Features

Feature Design Value
True Dual-Port Memory Cells Enables simultaneous read/write to identical memory addresses - eliminates software arbitration latency in lock-free IPC
RapidWrite Mode Allows consecutive writes without pulsing R/W or CE - simplifies timing-critical control logic and improves throughput by ≥25% vs standard async SRAM
On-Chip Semaphore Logic Hardware-accelerated 8-bit semaphore flags accessible via A0–A2 - provides atomic inter-port synchronization without CPU intervention
Independent Port Power Control Dual CE0/CE1 per port enables selective port shutdown - reduces active power by up to 60% when one port is idle
Configurable I/O Voltage OPT-driven 2.5 V/3.3 V selection per port - permits direct interfacing with mixed-voltage FPGAs, ASICs, and microcontrollers
JTAG Boundary Scan Full IEEE 1149.1 compliance in BGA-256 - supports automated PCB test, fault isolation, and in-field reconfiguration

Applications

Telecom Packet Buffering FPGA Co-Processing Interface

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line cards where ingress and egress processors access shared memory concurrently.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency inter-processor buffer - left port serves ingress ASIC, right port serves egress processor.

Use Value: Eliminates FIFO bottlenecks and enables real-time frame modification; 10 ns access ensures <100 ns round-trip latency for 128-byte packets.

Use Scenario: High-bandwidth data exchange between FPGA fabric and external ARM-based host controller in radar signal processing systems.

IC Role / Device Role / Timing Role: Serves as deterministic memory-mapped scratchpad - FPGA writes processed samples, host reads results without bus contention.

Use Value: RapidWrite Mode sustains >80 MB/s sustained write throughput; BUSY flag prevents overwrites during host read cycles.

Industrial PLC Inter-Core Communication Avionics Data Concentrator Buffer

Use Scenario: Real-time task coordination between safety-critical and non-safety cores in redundant programmable logic controllers.

IC Role / Device Role / Timing Role: Provides shared memory region with hardware semaphore for atomic resource allocation between dual-core ARM Cortex-R5 processors.

Use Value: On-chip semaphores reduce inter-core sync latency to <50 ns; industrial temp range ensures reliability in cabinet-mounted enclosures.

Use Scenario: Aggregating sensor telemetry (IMU, pressure, temperature) from multiple avionics subsystems before transmission to flight management computer.

IC Role / Device Role / Timing Role: Acts as time-stamped ring buffer - left port accepts burst ADC streams, right port feeds deterministic ARINC-429 transmitter.

Use Value: Independent port arbitration prevents data loss during simultaneous capture/transmit; JTAG enables DO-254-compliant verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-10BGXI 3.3 V core, 10 ns access, 256K × 18, no RapidWrite Mode, no JTAG, only 3.3 V I/O Lacks sleep mode, semaphore, and MASTER/SLAVE expansion - limited to single-port-equivalent use cases Choose when 3.3 V-only system integration is required and hardware arbitration is handled externally
AS7C331024B-10BIN 2.5 V core, 10 ns access, 512K × 18, no BUSY/INT flags, no semaphore, no JTAG, commercial temp only No inter-port contention signaling or hardware sync - requires software-managed locking protocols Choose for cost-sensitive commercial applications where full dual-port feature set is unnecessary

Compared with CY7C1362BV33-10BGXI and AS7C331024B-10BIN, the 70T633S10BCI delivers unique value through integrated RapidWrite Mode (reducing control logic complexity), hardware semaphore (enabling lock-free IPC), and JTAG testability (supporting safety-critical validation), all within industrial temperature range and mixed-voltage I/O flexibility.

Availability

70T633S10BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and aerospace data concentrators requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.

Supply support for 70T633S10BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T633S10BCI belongs to IDT's high-speed asynchronous dual-port SRAM product line, designed specifically for deterministic inter-processor communication in real-time embedded systems where latency, reliability, and hardware-assisted synchronization are critical.

FAQ

What is the maximum operating frequency supported by the 70T633S10BCI?

The 70T633S10BCI does not operate at a fixed clock frequency - it is an asynchronous SRAM with 10 ns maximum access time (tAA). This enables effective operation up to 100 MHz in random-access patterns, assuming proper setup/hold timing is met. Cycle time tRC is also 10 ns, supporting sustained back-to-back operations in RapidWrite Mode without clock constraints.

Does the 70T633S10BCI support both 2.5 V and 3.3 V I/O interfaces simultaneously?

Yes - the 70T633S10BCI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5 V) configures the left port for 3.3 V I/O, while OPTR = VSS (0 V) configures the right port for 2.5 V I/O. Both ports can operate at 3.3 V, both at 2.5 V, or mixed - with corresponding VDDQL/VDDQR supplies.

How does the BUSY flag function in MASTER/SLAVE configurations of the 70T633S10BCI?

In MASTER mode (M/S = VIH), BUSYL/BUSYR are totem-pole outputs asserting high during port contention. In SLAVE mode (M/S = VIL), they become inputs used to detect contention from the MASTER. This bidirectional behavior enables hardware handshaking in cascaded memory systems without external logic, directly supported by the 70T633S10BCI's internal arbitration logic.

Is JTAG boundary scan available on the 70T633S10BCI, and what are its limitations?

Yes - JTAG IEEE 1149.1 support is confirmed for the 70T633S10BCI in its BGA-256 package. TCK, TMS, TDI, TDO, and TRST pins are dedicated and functional. However, boundary scan operation is not recommended during sleep mode (ZZ asserted), and JTAG does not provide in-circuit programming - it is strictly for test and debug.

What is the purpose of the RapidWrite Mode in the 70T633S10BCI, and how is it enabled?

RapidWrite Mode allows consecutive write operations without toggling R/W, CE, or byte enables between cycles - write termination is triggered by address transition instead. It is enabled automatically when R/W, CE, and BEn remain asserted across address changes. The mode requires meeting tAAS (≤1 ns skew) and tARF (≥1.5 V/ns) specs to prevent spurious writes.

70T633S10BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T633S10BCI FAQ

1.How can I place an order for 70T633S10BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T633S10BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T633S10BCI reliable?

The price and inventory of 70T633S10BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S10BCI is usually 5 days.

3.What payment methods are accepted for 70T633S10BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S10BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T633S10BCI?

70T633S10BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T633S10BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T633S10BCI?

For technical support, including 70T633S10BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S10BCI requirements.

6.How does Aetrix verify that 70T633S10BCI is sourced from the original manufacturer or authorized distributors?

All 70T633S10BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S10BCI meets industry standards.

7.What is the process for return or replacement of 70T633S10BCI?

All 70T633S10BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S10BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T633S10BCI part is unused and in its original packaging.

Return procedure for 70T633S10BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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