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Renesas 70T633S10BF

Part No.:
70T633S10BF
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T633S10BF.pdf
Description:
IC SRAM 9MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,197

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Product details

Overview

70T633S10BF from Integrated Device Technology is a high-speed 512K × 18-bit asynchronous dual-port static RAM with true simultaneous access on independent left/right ports, 10 ns max read cycle time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port-used in real-time inter-processor communication, FPGA co-processor buffering, and telecom packet switching systems.

For engineers reviewing the 70T633S10BF datasheet, 70T633S10BF pinout, 70T633S10BF application, or 70T633S10BF equivalent, key selection criteria include dual-port arbitration logic, RapidWrite Mode timing compliance, BUSY/INT flag behavior in MASTER/SLAVE cascading, and BGA-208 package thermal/mechanical constraints for high-density PCB layout.

Technical Context

This device implements fully asynchronous operation with separate address, control, and data buses per port, enabling concurrent read/write to identical memory locations without external arbitration. On-chip semaphore logic supports eight hardware flags addressed via A0–A2, with dedicated SEM/INT/BUSY signaling.

RapidWrite Mode eliminates R/W pulse requirement between back-to-back writes by defining write end via address transition-subject to strict tAAS ≤ 1 ns skew and tARF ≥ 1.5 V/ns slew rate. JTAG IEEE 1149.1 support is implemented only in BGA-208 and BGA-256 packages.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 18 bits (9,216 Kbit), two independent ports
Max Read Cycle Time10 ns - defines minimum clock period for synchronous controllers interfacing via async bus
Core Supply Voltage2.5 V ±100 mV - fixed core rail; decoupling must meet 2.5 V noise margin
I/O Interface VoltageSelectable 2.5 V or 3.3 V per port via OPTL/OPTR - enables mixed-voltage system integration
Operating Temperature–40°C to +85°C industrial grade - validated for extended thermal cycling in base station equipment
Package208-ball fine-pitch BGA (BF208), 0.8 mm pitch, 15 mm × 15 mm body - requires controlled-depth reflow profile
Standby Current (ISB3)2 mA typical / 10 mA max (both ports full CMOS standby) - critical for low-power sleep-mode sequencing

Pinout & Package

208-ball fine-pitch Ball Grid Array (BF208) package, 0.8 mm ball pitch, 15 mm × 15 mm footprint, 1.4 mm height. All VDD pins require 2.5 V supply; VDDQ pins routed per port's OPT setting (2.5 V or 3.3 V); all VSS pins grounded.

Pin/TerminalCircuit RoleDesign Meaning
A0L–A18L, A0R–A18RAddress Inputs (Left/Right)19-bit addressing per port; A18 is NC for IDT70T631 variant only
I/O0L–I/O17L, I/O0R–I/O17RBidirectional Data Bus (18-bit)Upper/lower byte control via UBL/LBL and UBR/LBR; tri-state when OE inactive
CE0L/CE1L, CE0R/CE1RChip Enable Pair (Active-Low Logic)CE = L when CE0 = VIL & CE1 = VIH; CE = H when CE0 = VIH or CE1 = VIL - enables depth expansion
R/WL, R/WRRead/Write ControlLow = write; high = read; held low during RapidWrite Mode for consecutive writes
OEL, OEROutput EnableActive-low; controls output drivers independently per port - essential for bus sharing
BUSYL, BUSYRBusy FlagOutput when M/S = VIH (Master); input when M/S = VIL (Slave) - used for port arbitration
SEML, SEMRSemaphore EnableEnables access to 8-bit semaphore register at A0–A2; required for inter-port synchronization
INTL, INTRInterrupt FlagPush-pull output; asserts on semaphore event or write completion - no external pull-up needed
ZZL, ZZRSleep Mode InputAssert high to disable dynamic inputs (except JTAG); reduces current to ≤10 mA
M/SMaster/Slave SelectVIH = Master (BUSY output); VIL = Slave (BUSY input) - configures cascaded 36-bit+ memory systems
OPTL, OPTRI/O Voltage OptionVDD (2.5 V) → 3.3 V I/O; VSS (0 V) → 2.5 V I/O - sets VDDQX supply requirement
TCK, TMS, TDI, TDO, TRSTJTAG Boundary ScanIEEE 1149.1 compliant; functional only in BF208/BFG208 and BC256/BCG256 packages

Key Features

FeatureDesign Value
True Dual-Port ArchitectureSimultaneous read/write to same memory location without collision - eliminates software arbitration overhead in real-time IPC
RapidWrite ModeBack-to-back writes without toggling R/W/CE between cycles - reduces controller timing burden at 100 MHz+ bus rates
Per-Port I/O Voltage SelectionIndependent 2.5 V/3.3 V interface on left/right ports - allows seamless integration with mixed-voltage FPGAs and ASICs
Hardware Semaphore LogicEight dedicated flags accessible via A0–A2 - enables deterministic, lock-free synchronization between heterogeneous processors
On-Chip Port ArbitrationAutomatic resolution of concurrent access conflicts using BUSY/INT flags - removes need for external glue logic

Applications

Telecom Packet BufferingFPGA Co-Processor Interface

Use Scenario: Storing incoming/outgoing Ethernet frames in carrier-grade switches where ingress and egress paths operate concurrently.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between MAC-layer hardware engines.

Use Value: 10 ns read cycle enables line-rate 10 GbE frame buffering; BUSY flag prevents overwrites during simultaneous access.

Use Scenario: Real-time data exchange between FPGA fabric and external DSP in radar signal processing systems.

IC Role / Device Role / Timing Role: Memory-mapped interface providing deterministic latency for DMA transfers between programmable logic and fixed-function accelerators.

Use Value: RapidWrite Mode sustains >90% write bandwidth efficiency across burst transfers; M/S cascade supports 36-bit wide data paths.

Industrial PLC Inter-Processor LinkAvionics Display Controller Buffer

Use Scenario: Synchronizing motion control and safety monitoring CPUs in redundant PLC architectures operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: Shared memory node implementing semaphore-based task coordination and status mirroring.

Use Value: Industrial temperature rating ensures reliability; hardware semaphores eliminate race conditions in SIL-3 certified firmware.

Use Scenario: Frame buffering between graphics processor and display driver in cockpit multifunction displays.

IC Role / Device Role / Timing Role: High-bandwidth pixel storage with independent read (display scanout) and write (GPU render) ports.

Use Value: 512K × 18 organization supports 1280×1024@60 Hz RGB888 with 2× overscan; low ISB3 current extends battery runtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-10BGXI3.3 V core; 10 ns access; 256K × 18; supports QDR-II interface modeLacks RapidWrite Mode and per-port voltage selection; requires external arbitration for semaphore usePrefer when system uses 3.3 V core supply and needs QDR compatibility over dual-port concurrency
AS7C331024B-10BIN2.5 V core; 10 ns access; 512K × 18; single-port architecture with burst modeNo true dual-port capability; no BUSY/SEM/INT signals; no JTAG supportConsider only if application does not require simultaneous access or hardware synchronization primitives

Compared with CY7C1362BV33-10BGXI and AS7C331024B-10BIN, the 70T633S10BF uniquely delivers per-port I/O voltage flexibility, on-chip arbitration, and RapidWrite Mode - making it the sole choice for deterministic, low-latency inter-processor communication in mixed-voltage embedded systems.

Availability

70T633S10BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics display systems, and FPGA-based prototyping requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T633S10BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T633S10BF belongs to IDT's high-speed asynchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency inter-processor communication in real-time embedded systems.

FAQ

What is the maximum operating frequency supported by the 70T633S10BF?

The 70T633S10BF does not operate from a clock signal-it is an asynchronous device. Its performance is defined by timing parameters: maximum read cycle time (tRC) is 10 ns, corresponding to an effective 100 MHz sustained throughput under ideal conditions. Actual system bandwidth depends on address/data setup/hold times and bus protocol overhead-not a fixed clock frequency.

Can the left and right ports of the 70T633S10BF operate at different I/O voltages simultaneously?

Yes. The 70T633S10BF supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5 V) and OPTR = VSS (0 V) configures the left port for 3.3 V I/O levels and the right port for 2.5 V I/O levels-enabling direct interfacing with mixed-voltage FPGAs or ASICs without level shifters.

How does the BUSY signal function in MASTER versus SLAVE configuration for the 70T633S10BF?

In MASTER mode (M/S = VIH), BUSYL/BUSYR are push-pull outputs indicating port contention; in SLAVE mode (M/S = VIL), they become inputs accepting BUSY assertion from the MASTER. This bidirectional behavior enables hierarchical arbitration in cascaded configurations-critical for building 36-bit+ memory systems using multiple 70T633S10BF devices.

Is JTAG boundary scan supported on the 70T633S10BF in the BF208 package?

Yes. The 70T633S10BF in the BF208 (and BFG208) package fully supports IEEE 1149.1 JTAG boundary scan, including TCK, TMS, TDI, TDO, and TRST pins. JTAG functionality is explicitly confirmed for BF208 in the official datasheet (DSC-5670/11, page 5), enabling in-system test and debug without requiring external test fixtures.

What are the power supply requirements for VDD and VDDQ on the 70T633S10BF?

The 70T633S10BF requires a 2.5 V ±100 mV supply on all VDD pins for the core logic. VDDQ pins must be supplied at either 2.5 V or 3.3 V depending on the OPT pin setting per port: OPT = VDD → 3.3 V VDDQ; OPT = VSS → 2.5 V VDDQ. Both supplies must be stable before applying any input signals to avoid latch-up or excessive leakage.

70T633S10BF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70T633S10BF FAQ

1.How can I place an order for 70T633S10BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T633S10BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T633S10BF reliable?

The price and inventory of 70T633S10BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S10BF is usually 5 days.

3.What payment methods are accepted for 70T633S10BF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S10BF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T633S10BF?

70T633S10BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T633S10BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T633S10BF?

For technical support, including 70T633S10BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S10BF requirements.

6.How does Aetrix verify that 70T633S10BF is sourced from the original manufacturer or authorized distributors?

All 70T633S10BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S10BF meets industry standards.

7.What is the process for return or replacement of 70T633S10BF?

All 70T633S10BF units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S10BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T633S10BF part is unused and in its original packaging.

Return procedure for 70T633S10BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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