Renesas 70T633S10BFG
- Part No.:
- 70T633S10BFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70T633S10BFG.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 208CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,897
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70T633S10BFG from IDT (now Renesas) is a high-speed 512K × 18-bit asynchronous dual-port static RAM with independent left/right ports, 10 ns read cycle time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port. It enables simultaneous access to the same memory location and supports MASTER/SLAVE cascading for 36-bit+ bus expansion in real-time inter-processor communication systems.
For engineers reviewing the 70T633S10BFG datasheet, 70T633S10BFG pinout, 70T633S10BFG application, or 70T633S10BFG equivalent, key selection criteria include true dual-port arbitration logic, RapidWrite Mode for back-to-back writes, JTAG IEEE 1149.1 compliance in BGA-256, industrial temperature support (–40°C to +85°C), and sleep mode current as low as 2 mA.
Technical Context
This device implements fully asynchronous operation from either port with on-chip port arbitration, semaphore signaling, and BUSY/INT flag generation. Its dual chip enable architecture allows depth expansion without external logic, while Master/Slave select (M/S) configures BUSY as input (Slave) or output (Master).
The RapidWrite Mode eliminates R/W pulse requirements between consecutive writes by defining write end via address transition-reducing timing complexity at 10 ns cycle times. Each port supports independent I/O voltage selection (2.5 V or 3.3 V) via OPT pins, with dedicated VDDQ supplies and separate byte controls (UB/LB) for bus matching.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512K × 18 bits (9,216 Kbit); supports 256K × 18 variant via A18 pin configuration |
| Read Cycle Time | 10 ns max - enables direct interfacing with high-speed DSPs and FPGAs without wait states |
| Core Supply | 2.5 V ± 100 mV - fixed low-voltage core reduces dynamic power and thermal load |
| I/O Voltage | Selectable 2.5 V or 3.3 V per port via OPT pins - eliminates level-shifting components in mixed-voltage systems |
| Operating Temp | –40°C to +85°C - qualified for industrial embedded control and telecom infrastructure |
| Sleep Current | 2 mA max (IZZ) - enables ultra-low-power standby during host processor idle periods |
| JTAG Support | IEEE 1149.1 compliant in BGA-256 package only - enables boundary-scan testing without external debug hardware |
Pinout & Package
70T633S10BFG is packaged in a 256-ball fine-pitch Ball Grid Array (BGA) with 1.0 mm ball pitch and 17 mm × 17 mm body size. All VDD pins require 2.5 V; VDDQ pins must match OPT pin state (3.3 V if OPT = VDD, 2.5 V if OPT = VSS). VSS pins are ground-connected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A18L / A0R–A18R | Address Inputs (Left/Right) | 19-bit address bus per port; A18 is no-connect for 256K×18 configuration |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional Data Bus | 18-bit parallel data path per port; supports byte-wide (LB/UB) or full-word access |
| CE0L/CE1L / CE0R/CE1R | Chip Enable Pair | Dual CE per port enables flexible power-down control and depth expansion without glue logic |
| R/WL / R/WR | Read/Write Control | Active-low signal controlling direction of data flow; held low during RapidWrite Mode sequences |
| OEL / OER | Output Enable | Tri-states I/O drivers independently per port; required for bus sharing in multi-device systems |
| BUSYL / BUSYR | Busy Flag | Output when M/S = VIH (Master), input when M/S = VIL (Slave); resolves port contention during concurrent access |
| SEML / SEMR | Semaphore Enable | Enables 8-bit semaphore register access via I/O0–I/O7; used for inter-processor synchronization |
| ZZL / ZZR | Sleep Mode Input | Asserting high disables dynamic inputs (except JTAG), reducing current to ≤2 mA per port |
| M/S | Master/Slave Select | Configures BUSY behavior and arbitration priority; required for cascaded 36-bit+ memory systems |
| TCK/TMS/TDI/TDO/TRST | JTAG Test Interface | IEEE 1149.1 boundary scan support - available only in BGA-256 package |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Simultaneous read/write to identical memory locations from independent ports - eliminates software arbitration overhead in real-time IPC |
| RapidWrite Mode | Back-to-back writes without pulsing R/W or CE - simplifies timing-critical FPGA/DSP interfaces and cuts PCB routing complexity |
| Independent I/O Voltage Selection | OPTL/OPTR pins configure each port for 2.5 V or 3.3 V operation - avoids external level shifters in heterogeneous bus systems |
| On-Chip Semaphore Logic | Eight hardware semaphore flags accessible via A0–A2 and I/O0–I/O7 - enables lock-free synchronization between processors or cores |
| Full Standby Power Management | ISB3 ≤ 10 mA (both ports CMOS-idle) and IZZ ≤ 10 mA (sleep mode) - extends uptime in battery-backed industrial controllers |
Applications
| Telecom Line Card Buffering | Real-Time Industrial PLC Memory |
|---|---|
|
Use Scenario: High-throughput packet buffering between line interface ASIC and traffic management processor in 10Gbps optical transport equipment. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory buffer with independent read/write ports handling ingress/egress data streams. Use Value: 10 ns access time ensures deterministic latency under full line-rate traffic; RapidWrite Mode sustains burst writes without pipeline stalls. |
Use Scenario: Shared memory between safety-critical motion controller CPU and real-time I/O co-processor in CNC machine tools. IC Role / Device Role / Timing Role: Asynchronous dual-port RAM provides atomic semaphore-controlled data exchange and status sharing across isolated processing domains. Use Value: On-chip semaphore logic and BUSY arbitration eliminate race conditions; industrial temp rating guarantees reliability in factory-floor environments. |
| FPGA-Based Video Frame Buffer | Avionics Data Concentrator |
|
Use Scenario: Frame storage between image sensor interface and video processing pipeline in broadcast-grade camera systems. IC Role / Device Role / Timing Role: Dual-port SRAM serves as ping-pong frame buffer - one port writes incoming sensor data while the other reads processed frames. Use Value: 512K × 18 capacity supports HD/4K frame buffers; independent 2.5 V/3.3 V I/O allows seamless integration with both sensor and FPGA I/O banks. |
Use Scenario: Centralized data aggregation between multiple ARINC 429 receivers and flight management system in commercial aircraft. IC Role / Device Role / Timing Role: Dual-port RAM stores timestamped sensor data and status flags, accessed concurrently by acquisition and validation subsystems. Use Value: JTAG IEEE 1149.1 support enables in-system testability; –40°C to +85°C operation meets DO-160 environmental requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-10BGXI | 3.3 V core (not 2.5 V); no RapidWrite Mode; 10 ns access but higher IDD (450 mA vs 405 mA) | Lacks sleep mode and JTAG; requires external level shifters for 2.5 V systems | Choose when legacy 3.3 V-only design exists and low-power sleep is not required |
| AS7C331024B-10BIN | Single-port only; 10 ns access; 2.5 V core; no semaphore or BUSY logic | No inter-processor arbitration capability; cannot replace true dual-port functionality | Consider only for cost-sensitive non-concurrent-access applications where dual-port features are unused |
Compared with CY7C1362BV33-10BGXI and AS7C331024B-10BIN, the 70T633S10BFG uniquely delivers 2.5 V core efficiency, hardware semaphore support, and RapidWrite Mode - making it irreplaceable for deterministic real-time inter-processor communication where latency, power, and synchronization integrity are critical.
Availability
70T633S10BFG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial PLCs, broadcast video systems, and avionics data concentrators requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for 70T633S10BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, is a leader in high-performance memory and interface solutions for communications, computing, and industrial markets.
The 70T633S10BFG belongs to IDT's high-speed asynchronous dual-port SRAM product line, designed specifically for real-time inter-processor communication, FPGA co-processing, and deterministic data buffering in mission-critical embedded systems.
FAQ
What is the maximum operating frequency supported by the 70T633S10BFG?
The 70T633S10BFG does not operate on a clock signal-it is an asynchronous device. Its performance is defined by timing parameters: 10 ns maximum read cycle time (tRC), 10 ns maximum address access time (tAA), and 10 ns maximum write cycle time (tWC). These values enable reliable operation with processors and FPGAs running at effective throughputs up to 100 MHz in burst mode, assuming proper board layout and signal integrity.
Does the 70T633S10BFG support both 2.5 V and 3.3 V I/O on the same device?
Yes-the 70T633S10BFG supports mixed-voltage operation: OPTL and OPTR pins independently configure the left and right ports for either 2.5 V or 3.3 V I/O levels. When OPTL = VSS, left-port I/Os run at 2.5 V (VDDQL = 2.5 V); when OPTL = VDD, they run at 3.3 V (VDDQL = 3.3 V). The same applies to the right port. Core supply (VDD) remains fixed at 2.5 V.
How does the RapidWrite Mode function in the 70T633S10BFG?
RapidWrite Mode in the 70T633S10BFG allows consecutive write operations without toggling R/W, CE, or byte-enable signals between cycles. The write cycle ends on the *address transition*, not the R/W deassertion. This eliminates narrow pulse generation challenges at 10 ns timing, simplifies FPGA logic, and maintains full bandwidth during burst writes-provided tAAS ≤ 1 ns and tARF ≥ 1.5 V/ns are met.
Is JTAG boundary scan available on all 70T633S10BFG packages?
No-JTAG IEEE 1149.1 support is available only in the BGA-256 package (e.g., 70T633S10BFG). It is not implemented in the BGA-208 variant. Pins TCK, TMS, TDI, TDO, and TRST are present and functional only in the 256-ball version, enabling in-system testability and debug without additional hardware.
What is the role of the M/S pin in 70T633S10BFG system design?
The M/S (Master/Slave Select) pin configures BUSY behavior and arbitration priority: when M/S = VIH, BUSY is an output indicating port contention; when M/S = VIL, BUSY is an input accepting arbitration signals from a master device. This enables cascaded configurations-for example, two 70T633S10BFG devices can be combined into a 36-bit-wide memory with one acting as Master and the other as Slave.
70T633S10BFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Asynchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 512K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70T633S10BFG FAQ
1.How can I place an order for 70T633S10BFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T633S10BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T633S10BFG reliable?
The price and inventory of 70T633S10BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S10BFG is usually 5 days.
3.What payment methods are accepted for 70T633S10BFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S10BFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T633S10BFG?
70T633S10BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T633S10BFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T633S10BFG?
For technical support, including 70T633S10BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S10BFG requirements.
6.How does Aetrix verify that 70T633S10BFG is sourced from the original manufacturer or authorized distributors?
All 70T633S10BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S10BFG meets industry standards.
7.What is the process for return or replacement of 70T633S10BFG?
All 70T633S10BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S10BFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T633S10BFG part is unused and in its original packaging.
Return procedure for 70T633S10BFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70T633S10BFG Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

