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Renesas 70T633S10BFI

Part No.:
70T633S10BFI
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T633S10BFI.pdf
Description:
IC SRAM 9MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,024

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Product details

Overview

70T633S10BFI from IDT (now Renesas) is a high-speed 512K × 18-bit asynchronous dual-port static RAM with independent left/right ports, 10 ns read cycle time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port. It enables simultaneous access to the same memory location in real-time inter-processor communication systems.

For engineers reviewing the 70T633S10BFI datasheet, 70T633S10BFI pinout, 70T633S10BFI application, or 70T633S10BFI equivalent, key selection criteria include true dual-port arbitration logic, RapidWrite Mode for back-to-back writes, JTAG IEEE 1149.1 support, industrial temperature range (–40°C to +85°C), and BGA-256 package compatibility.

Technical Context

This device implements fully asynchronous operation from either port with on-chip port arbitration, semaphore signaling, and BUSY flag handshake for conflict resolution. It supports MASTER/SLAVE cascading for 36-bit+ word systems using M/S pin control and dual chip enables (CE0/CE1) for depth expansion without external logic.

RapidWrite Mode eliminates R/W pulse requirement between consecutive writes by defining write end via address transition-reducing timing complexity at 10 ns cycle times. Each port independently selects I/O voltage (2.5 V or 3.3 V) via OPTL/OPTR pins, while core VDD remains fixed at 2.5 V ±100 mV.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512K × 18 bits (9,216 Kbit); supports 256K × 18 configuration via A18 pin handling
Read Cycle Time10 ns max - enables direct interfacing with high-speed DSPs and FPGAs without wait states
Core Supply2.5 V ±100 mV - fixed low-voltage core reduces dynamic power vs. 3.3 V SRAMs
I/O VoltageSelectable 2.5 V or 3.3 V per port via OPTL/OPTR - allows mixed-voltage system integration
Operating Temp–40°C to +85°C - qualified for industrial embedded control and telecom infrastructure
Package256-ball BGA (17 mm × 17 mm, 1.0 mm pitch) - standard footprint for high-density PCB layouts
JTAG SupportIEEE 1149.1 compliant - enables boundary-scan testing and in-system debug without additional hardware

Pinout & Package

256-ball fine-pitch Ball Grid Array (BGA) package, body size 17 mm × 17 mm × 1.4 mm, 1.0 mm ball pitch. All VDD pins require 2.5 V supply; VDDQ pins must match selected I/O voltage (2.5 V or 3.3 V) per port based on OPTL/OPTR state.

Pin/TerminalCircuit RoleDesign Meaning
A0L–A18L / A0R–A18RAddress Inputs (Left/Right)19-bit address bus per port; A18 is NC for 256K configuration
I/O0L–I/O17L / I/O0R–I/O17RData I/O Bidirectional Bus18-bit parallel data path per port; tri-state controlled by OE/UB/LB
CE0L/CE1L / CE0R/CE1RChip Enable PairsDual CE per port enables depth expansion and power-down control without glue logic
R/WL / R/WRRead/Write ControlActive-low signal controlling direction of data flow on respective port
OEL / OEROutput EnableControls output drivers; when high, places I/O pins in high-impedance state
UBL/LBL / UBR/LBRByte Select ControlsEnable upper (I/O9–I/O17) or lower (I/O0–I/O8) byte during read/write
BUSYL / BUSYRBusy FlagOutput when M/S = VIH (Master); input when M/S = VIL (Slave) - enables hardware arbitration
SEML / SEMRSemaphore EnableActivates 8-bit semaphore register accessed via A0–A2 for inter-port synchronization
INTL / INTRInterrupt FlagPush-pull output indicating semaphore or arbitration event; non-tri-state
OPTL / OPTRI/O Voltage SelectInput selecting 2.5 V (VSS) or 3.3 V (VDD) I/O levels per port - sets VDDQ requirement
ZZL / ZZRSleep Mode InputAsserting high disables dynamic inputs (except JTAG), reducing standby current to ≤10 mA
M/SMaster/Slave SelectDetermines BUSY pin direction and enables cascaded 36-bit+ memory configurations
TCK/TMS/TDI/TDO/TRSTJTAG Test InterfaceIEEE 1149.1 boundary-scan controller signals - functional in all operating modes except sleep

Key Features

FeatureDesign Value
True Dual-Port ArchitectureSimultaneous read/write to identical memory locations enables real-time co-processing without software locks
RapidWrite ModeEliminates R/W pulsing between back-to-back writes - simplifies timing closure at 10 ns cycle rates
On-Chip Arbitration LogicHardware-resolved port contention via BUSY handshake - removes need for external arbitration circuitry
Configurable I/O VoltageIndependent 2.5 V/3.3 V selection per port via OPT pins - supports heterogeneous processor interfaces
Industrial Temperature Range–40°C to +85°C operation with validated DC/AC specs - suitable for base station and motor control environments
JTAG Boundary-ScanFull IEEE 1149.1 compliance in BGA-256 package - enables production test and field diagnostics

Applications

Telecom Line Card BufferingReal-Time Industrial PLC Memory

Use Scenario: High-throughput packet buffering between line interface ASIC and control processor in carrier-grade Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared memory buffer with hardware semaphore for packet descriptor exchange.

Use Value: 10 ns read cycle and RapidWrite Mode enable full-line-rate packet processing without CPU stalls or external FIFOs.

Use Scenario: Deterministic data exchange between safety-critical motion controller and HMI processor in CNC machinery.

IC Role / Device Role / Timing Role: Asynchronous dual-port RAM provides atomic read/write access to shared status registers and command queues.

Use Value: On-chip BUSY arbitration and –40°C to +85°C rating ensure reliable operation in uncontrolled factory environments.

Avionics Sensor Fusion HubFPGA-Based Radar Signal Processing

Use Scenario: Time-critical fusion of inertial, GPS, and barometric sensor data in flight control computers.

IC Role / Device Role / Timing Role: Dual-port SRAM serves as synchronized scratchpad memory between sensor acquisition FPGA and flight management MCU.

Use Value: JTAG testability and industrial temp grade meet DO-254/DO-178C verification requirements for airborne systems.

Use Scenario: Real-time buffering of ADC samples and FFT results between radar front-end and beamforming engine.

IC Role / Device Role / Timing Role: 512K × 18 memory provides ping-pong buffers for continuous streaming with no DMA overhead.

Use Value: 2.5 V core + selectable I/O voltage allows direct interface to both 2.5 V ADCs and 3.3 V FPGA I/O banks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-10ZXC3.3 V core; no selectable I/O voltage; 10 ns cycle; TQFP-100 packageLacks RapidWrite Mode and JTAG; limited to 3.3 V systems; smaller density (256K × 18)Choose for cost-sensitive 3.3 V-only designs where BGA assembly is unavailable
AS7C331024B-10BINSingle-port architecture; 10 ns; 3.3 V only; 1M × 18 density; TSOP-II-54No hardware arbitration or semaphore; requires external logic for multi-processor syncChoose when dual-port functionality is unnecessary and board space permits larger TSOP package

Compared with CY7C1362BV33-10ZXC and AS7C331024B-10BIN, the 70T633S10BFI uniquely delivers true dual-port operation with on-chip arbitration, RapidWrite Mode, and per-port I/O voltage flexibility - critical for deterministic real-time inter-processor communication.

Availability

70T633S10BFI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and radar signal processing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T633S10BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation (formerly IDT) is a global semiconductor leader specializing in microcontrollers, analog, power management, and memory solutions for industrial, automotive, and communications markets.

The 70T633S10BFI belongs to IDT's high-speed asynchronous dual-port SRAM product line, engineered for deterministic real-time data exchange between heterogeneous processors in mission-critical embedded systems.

FAQ

What is the maximum operating frequency supported by the 70T633S10BFI?

The 70T633S10BFI does not operate on a clock signal-it is an asynchronous SRAM. Its performance is specified by access timing: 10 ns maximum read cycle time (tRC), 10 ns address access time (tAA), and 10 ns write cycle time (tWC). These parameters define the minimum interval between successive memory operations under worst-case conditions.

Does the 70T633S10BFI support both 2.5 V and 3.3 V I/O interfaces simultaneously?

Yes-the 70T633S10BFI supports independent I/O voltage selection per port. OPTL configures the left port for 2.5 V or 3.3 V operation, and OPTR does the same for the right port. This allows one port to interface with a 2.5 V FPGA while the other connects to a 3.3 V microcontroller, provided corresponding VDDQL/VDDQR supplies are applied.

How does the RapidWrite Mode function in the 70T633S10BFI?

RapidWrite Mode in the 70T633S10BFI allows consecutive write operations without toggling R/W, CE, or byte-enable signals between cycles. The write cycle ends on the address transition rather than signal deassertion. This reduces timing constraints and simplifies high-speed controller design-especially valuable at the 10 ns cycle specification of the 70T633S10BFI.

What is the role of the M/S pin in the 70T633S10BFI?

The M/S (Master/Slave) pin determines BUSY pin behavior and enables cascaded memory configurations. When M/S = VIH, BUSY is an output indicating port contention; when M/S = VIL, BUSY is an input for slave-side arbitration. Cascading multiple 70T633S10BFI devices using M/S allows building 36-bit or wider memory systems without external logic.

Is JTAG boundary-scan supported on the 70T633S10BFI, and under what conditions?

Yes-JTAG boundary-scan per IEEE 1149.1 is supported on the 70T633S10BFI in both BGA-208 and BGA-256 packages. It remains functional during normal operation and standby modes but is not recommended during sleep mode (ZZ asserted), as dynamic inputs-including JTAG-are disabled except for initialization reset (TRST).

70T633S10BFI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70T633S10BFI FAQ

1.How can I place an order for 70T633S10BFI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T633S10BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T633S10BFI reliable?

The price and inventory of 70T633S10BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S10BFI is usually 5 days.

3.What payment methods are accepted for 70T633S10BFI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S10BFI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T633S10BFI?

70T633S10BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T633S10BFI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T633S10BFI?

For technical support, including 70T633S10BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S10BFI requirements.

6.How does Aetrix verify that 70T633S10BFI is sourced from the original manufacturer or authorized distributors?

All 70T633S10BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S10BFI meets industry standards.

7.What is the process for return or replacement of 70T633S10BFI?

All 70T633S10BFI units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S10BFI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T633S10BFI part is unused and in its original packaging.

Return procedure for 70T633S10BFI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70T633S10BFI Tags

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