Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 70T633S12BC8

Part No.:
70T633S12BC8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T633S12BC8.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,452

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

IDT70T633S12BC8 from Integrated Device Technology is a high-speed 512K × 18-bit asynchronous dual-port static RAM with independent left/right ports, 12 ns max access time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port. It supports true simultaneous read/write to the same memory location and is used in real-time inter-processor communication systems requiring deterministic latency and hardware semaphore arbitration.

For engineers reviewing the 70T633S12BC8 datasheet, 70T633S12BC8 pinout, 70T633S12BC8 application, or 70T633S12BC8 equivalent, key selection criteria include dual-port timing compatibility, BUSY/INT flag behavior in MASTER/SLAVE cascading, RapidWrite Mode support for back-to-back writes, and BGA-256 package thermal/mechanical constraints in high-density PCB layouts.

Technical Context

The 70T633S12BC8 implements fully asynchronous operation with separate address, control, and data buses per port, enabling independent read/write cycles without clock synchronization. Its on-chip arbitration logic handles port contention via hardware semaphore signaling and BUSY flag handshaking between MASTER and SLAVE configurations.

RapidWrite Mode eliminates the need to toggle R/W or CE between consecutive writes-address transition defines cycle boundary-reducing system timing overhead at 12 ns cycle times. JTAG IEEE 1149.1 compliance is supported only in BGA-256 and BGA-208 packages, with TCK up to 10 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 18 bits (9,216 Kbit total); supports 36-bit+ word expansion via MASTER/SLAVE cascading
Access Time (tAA)12 ns max - guarantees deterministic read latency under worst-case voltage/temperature conditions
Core Supply (VDD)2.5 V ±100 mV - fixed low-voltage core enables reduced power and noise margin vs. 3.3 V-only SRAMs
I/O Voltage SupportSelectable 2.5 V or 3.3 V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing without level shifters
Operating Temperature–40°C to +85°C industrial grade - validated for continuous operation in embedded control and telecom infrastructure
Package256-ball BGA (17 mm × 17 mm, 1.0 mm pitch) - requires controlled-depth reflow and X-ray inspection for void-free solder joints
Standby Current (ISB3)2 mA typical / 10 mA max (both ports in full CMOS standby) - enables ultra-low-power sleep mode during idle periods

Pinout & Package

70T633S12BC8 is housed in a 256-ball fine-pitch Ball Grid Array (BGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and 1.4 mm height. Thermal pad is not present; thermal management relies on PCB copper area and via stitching beneath the package.

Pin/TerminalCircuit RoleDesign Meaning
A0L–A18L, A0R–A18RAddress Inputs (Left/Right)19-bit address bus per port; A18 is NC for IDT70T631 but functional for 70T633
I/O0L–I/O17L, I/O0R–I/O17RBidirectional Data I/O (18-bit)True dual-port data path; no external bus transceivers needed for port-to-port transfer
CE0L/CE1L, CE0R/CE1RChip Enable Pair (Active-Low Logic)Dual CE architecture enables depth expansion without external decode logic; CE = L when CE0=L & CE1=H
R/WL, R/WRRead/Write ControlAsynchronous edge-independent control; enables RapidWrite Mode when held low across address transitions
BUSYL, BUSYRBusy Flag (Totem-Pole Output)Open-drain not supported; BUSY is output in MASTER (M/S=VIH), input in SLAVE (M/S=VIL)
M/SMaster/Slave SelectConfigures device role in cascaded 36-bit+ systems; determines BUSY direction and arbitration priority
ZZL, ZZRSleep Mode InputAsserted high disables dynamic inputs (except JTAG); reduces current to ≤10 mA while preserving JTAG accessibility
TCK, TMS, TDI, TDO, TRSTJTAG Boundary Scan InterfaceIEEE 1149.1 compliant; requires dedicated 10 MHz clock and proper TAP controller initialization sequence

Key Features

FeatureDesign Value
True Dual-Port Memory CellsEnables concurrent read/write to identical addresses without arbitration delay or data corruption
RapidWrite ModeEliminates R/W pulse requirement between writes-reduces FPGA/CPLD control logic and simplifies timing closure at 12 ns cycles
Hardware Semaphore SignalingEight dedicated flags accessible via A0–A2; resolves resource contention without software polling or OS intervention
Independent I/O Voltage SelectionOPTL/OPTR pins configure each port for 2.5 V or 3.3 V operation-supports heterogeneous processor interfaces on single device
On-Chip Port Arbitration LogicAutomatically manages BUSY/INT flag assertion and semaphore grant-removes need for external arbitration ICs or glue logic

Applications

Telecom Line Card BufferingReal-Time Industrial PLC Interlocking

Use Scenario: High-throughput packet buffering between line interface ASIC and traffic manager in 10Gbps Ethernet line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency FIFO between asymmetric data paths; left port connects to framer, right port to scheduler.

Use Value: 12 ns access time ensures sub-microsecond round-trip latency; BUSY flag prevents overwrites during concurrent access by two ASICs.

Use Scenario: Synchronized I/O state exchange between redundant CPU modules in safety-critical programmable logic controllers.

IC Role / Device Role / Timing Role: Shared memory hub with hardware semaphores coordinates motion control commands and sensor feedback between master/slave CPUs.

Use Value: Deterministic semaphore resolution avoids race conditions; industrial temp range ensures reliability in cabinet-mounted enclosures.

Avionics Flight Control Data ExchangeMedical Imaging Real-Time Frame Buffering

Use Scenario: Cross-channel data sharing between flight control computers (FCCs) in triple-modular-redundant (TMR) architectures.

IC Role / Device Role / Timing Role: Dual-port RAM provides atomic read-modify-write capability for shared actuator command registers using semaphore flags.

Use Value: JTAG testability enables in-system verification of memory integrity; 2.5 V core reduces EMI in sensitive analog signal zones.

Use Scenario: Concurrent acquisition and display rendering in digital radiography systems where detector data must be written while previous frame is read for display.

IC Role / Device Role / Timing Role: Asynchronous buffer decouples image sensor interface (left port) from GPU framebuffer engine (right port).

Use Value: RapidWrite Mode sustains >80 MB/s write throughput without CPU/FPGA intervention; 512K × 18 capacity holds full 16-bit grayscale frame.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-12BGXI3.3 V core; no selectable I/O voltage; 12 ns access but higher ISB1 (150 mA vs. 105 mA)Lacks RapidWrite Mode and hardware semaphore; requires external arbitration logic for MASTER/SLAVEChoose when legacy 3.3 V-only design exists and JTAG is not required
AS7C331024B-12BINSingle-port architecture; 12 ns access; 2.5 V core; no BUSY/INT or semaphore signalsCannot support true concurrent port access; unsuitable for inter-processor communication or real-time arbitrationUse only for cost-sensitive, non-concurrent buffer applications where dual-port functionality is unnecessary

Compared with CY7C1362BV33-12BGXI and AS7C331024B-12BIN, the 70T633S12BC8 uniquely delivers hardware semaphore arbitration, RapidWrite Mode, and per-port I/O voltage selection-enabling lower system BOM cost, reduced FPGA logic, and deterministic real-time performance in MASTER/SLAVE topologies.

Availability

70T633S12BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and traceable green-part sourcing.

Supply support for 70T633S12BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The IDT70T633 family targets deterministic real-time systems requiring hardware-managed memory coherency between independent processors or ASICs-optimized for low-latency inter-processor communication with minimal external logic.

FAQ

What is the maximum operating frequency supported by the 70T633S12BC8?

The 70T633S12BC8 does not operate on a clock; it is an asynchronous dual-port SRAM. Its timing is defined by access and cycle parameters-not frequency. The 12 ns access time (tAA) and 12 ns cycle time (tRC) enable effective operation at up to ~83 MHz in tightly controlled systems, but actual throughput depends on system-level timing margins, bus loading, and control signal setup/hold compliance. No internal PLL or clock multiplier is present.

Can the left and right ports of the 70T633S12BC8 operate at different I/O voltages simultaneously?

Yes. The 70T633S12BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VDD (2.5 V) configures the left port for 3.3 V I/O levels with VDDQL = 3.3 V, while OPTR = VSS (0 V) configures the right port for 2.5 V I/O with VDDQR = 2.5 V. This enables direct interfacing with mixed-voltage SoCs or FPGAs without external level shifters.

How does the BUSY flag function in MASTER versus SLAVE configuration for the 70T633S12BC8?

In MASTER configuration (M/S = VIH), BUSYL and BUSYR are totem-pole outputs that assert active-high when the opposite port initiates a write to an address currently being read. In SLAVE configuration (M/S = VIL), BUSYL and BUSYR become inputs-used to receive BUSY signals from the MASTER device in cascaded systems. Both modes are non-tri-state; pull-ups are not required.

Does the 70T633S12BC8 support JTAG boundary scan, and what are the requirements?

Yes, the 70T633S12BC8 supports IEEE 1149.1 JTAG boundary scan-but only in BGA-256 and BGA-208 packages (not in smaller variants). Required signals are TCK (≤10 MHz), TMS, TDI, TDO, and TRST. JTAG remains functional during sleep mode (ZZ asserted), but boundary scan operations are not recommended while ZZ is active due to potential I/O state instability.

What is the purpose of RapidWrite Mode in the 70T633S12BC8, and how is it enabled?

RapidWrite Mode in the 70T633S12BC8 allows consecutive write operations without toggling R/W, CE, or byte enables between cycles-address transition defines the end of each write. It is enabled automatically when R/W is held low across address changes. Designers must meet tAAS (≤1 ns address skew) and tARF (≥1.5 V/ns rise/fall) to prevent spurious writes; no register setting or command sequence is required.

70T633S12BC8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T633S12BC8 FAQ

1.How can I place an order for 70T633S12BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T633S12BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T633S12BC8 reliable?

The price and inventory of 70T633S12BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S12BC8 is usually 5 days.

3.What payment methods are accepted for 70T633S12BC8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S12BC8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T633S12BC8?

70T633S12BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T633S12BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T633S12BC8?

For technical support, including 70T633S12BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S12BC8 requirements.

6.How does Aetrix verify that 70T633S12BC8 is sourced from the original manufacturer or authorized distributors?

All 70T633S12BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S12BC8 meets industry standards.

7.What is the process for return or replacement of 70T633S12BC8?

All 70T633S12BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S12BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T633S12BC8 part is unused and in its original packaging.

Return procedure for 70T633S12BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70T633S12BC8 Tags

  • 70T633S12BC8
  • 70T633S12BC8 PDF
  • 70T633S12BC8 Datasheet
  • 70T633S12BC8 Specifications
  • 70T633S12BC8 Images
  • Renesas
  • Renesas 70T633S12BC8
  • Buy 70T633S12BC8
  • 70T633S12BC8 Price
  • 70T633S12BC8 Distributor
  • 70T633S12BC8 Supplier
  • 70T633S12BC8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER