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Renesas 70T633S12BCI

Part No.:
70T633S12BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T633S12BCI.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,383

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Product details

Overview

70T633S12BCI from IDT (now Renesas) is a high-speed 512K × 18-bit asynchronous dual-port static RAM with independent left/right ports, 12 ns max access time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port-used in real-time inter-processor communication, FPGA co-processing, and telecom packet buffering.

For engineers reviewing the 70T633S12BCI datasheet, 70T633S12BCI pinout, 70T633S12BCI application, or 70T633S12BCI equivalent, key selection criteria include true simultaneous dual-port access, on-chip semaphore arbitration, RapidWrite Mode for back-to-back writes, industrial temperature support (–40°C to +85°C), and BGA-256 package compatibility with JTAG IEEE 1149.1 testability.

Technical Context

This device implements fully asynchronous operation: each port has independent address, control (CE0/CE1, R/W, OE, UB/LB), and 18-bit bidirectional I/O buses. Port arbitration is handled internally via hardware semaphore logic supporting eight shared flags accessed via A0–A2.

It supports three power states: active (IDD ≤ 445 mA), standby (ISB2 ≤ 290 mA), and sleep mode (IZZ ≤ 20 mA) activated by ZZL/ZZR inputs. Core voltage is fixed at 2.5 V ±100 mV; I/O voltage per port is selected independently via OPTL/OPTR pins (2.5 V or 3.3 V).

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density512K × 18 bits (9,216 Kbit); enables 36-bit+ word systems via Master/Slave cascading
Access Time12 ns max (industrial grade); guarantees deterministic latency for real-time inter-processor handshaking
Supply VoltageVDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V per port (selectable via OPT pins)
Operating Temp–40°C to +85°C; qualified for industrial embedded and telecom infrastructure applications
Package256-ball BGA (17 mm × 17 mm, 1.0 mm pitch); supports high-density PCB layouts with thermal vias
Interface LogicLVTTL-compatible I/Os; supports mixed-voltage system integration without level shifters
RapidWrite ModeEnables consecutive write cycles without pulsing R/W or CE; reduces controller timing overhead at 12 ns cycle rates

Pinout & Package

70T633S12BCI is housed in a 256-ball fine-pitch Ball Grid Array (BC256/BCG256) with 17 mm × 17 mm body and 1.0 mm ball pitch. All VDD pins require 2.5 V; VDDQ pins must match OPT pin configuration (2.5 V if OPT = VSS, 3.3 V if OPT = VDD).

Pin/TerminalCircuit RoleDesign Meaning
A0L–A18L / A0R–A18RAddress Inputs (Left/Right)19-bit address bus per port; A18 is NC for 256K variants but functional for 512K configuration
I/O0L–I/O17L / I/O0R–I/O17RBidirectional Data I/O (18-bit)True dual-port data path; supports simultaneous read/write to same location with arbitration
CE0L/CE1L, CE0R/CE1RChip Enable PairsDual CE per port enables depth expansion without external logic; CE0=VIL & CE1=VIH activates memory
R/WL, R/WRRead/Write ControlActive-low write enable; controls direction of I/O bus per port independently
OEL, OEROutput EnableTri-states outputs when high; used with UB/LB for byte-select reads
UBL/LBL, UBR/LBRUpper/Lower Byte SelectEnables 9-bit granularity access; allows partial-word operations without full-bus contention
BUSYL, BUSYRBusy FlagOutput when M/S=VIH (Master); input when M/S=VIL (Slave); signals port contention during concurrent access
SEML, SEMRSemaphore EnableActivates 8-flag semaphore register (addressed by A0–A2); enables inter-port synchronization without software polling
INTL, INTRInterrupt FlagPush-pull output asserted on semaphore event or arbitration result; drives interrupt lines directly
OPTL, OPTRI/O Voltage SelectConfigures per-port I/O voltage: VSS → 2.5 V I/O, VDD → 3.3 V I/O; independent control per port
ZZL, ZZRSleep Mode InputAsserted high disables dynamic inputs (except JTAG); reduces current to ≤20 mA; retains data
M/SMaster/Slave SelectDefines BUSY role: VIH = BUSY output (Master), VIL = BUSY input (Slave); enables daisy-chained arbitration
TCK, TMS, TDI, TDO, TRSTJTAG Boundary ScanFully compliant with IEEE 1149.1; enables in-system test and debug without additional probes

Key Features

FeatureDesign Value
True Dual-Port ArchitectureSimultaneous independent access to same memory location by both ports-eliminates external arbitration logic
RapidWrite ModeBack-to-back writes without toggling R/W or CE; simplifies controller design and improves sustained write throughput
Hardware Semaphore LogicOn-chip 8-flag semaphore register with atomic read/write; enables lock-free inter-processor coordination
Per-Port I/O Voltage SelectionOPTL/OPTR pins allow mixed-voltage interfacing (e.g., 3.3 V FPGA ↔ 2.5 V DSP) without external level shifters
Industrial Temperature SupportRated for –40°C to +85°C operation with full AC/DC specs-suitable for base station, motor control, and avionics
JTAG IEEE 1149.1 ComplianceFull boundary-scan testability in BGA-256 package; reduces production test cost and improves yield analysis

Applications

Telecom Packet BufferingFPGA-CPU Co-Processing

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets between line cards and switching fabric in carrier-grade routers.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer-left port handles ingress DMA, right port serves egress scheduler.

Use Value: 12 ns access ensures sub-microsecond packet header lookup and modification; BUSY flag prevents corruption during concurrent read/write.

Use Scenario: Real-time data exchange between Xilinx Kintex FPGA and ARM Cortex-A9 processor in radar signal processing subsystem.

IC Role / Device Role / Timing Role: Shared memory interface enabling deterministic data transfer; semaphore flags coordinate FFT buffer ownership.

Use Value: Hardware semaphore eliminates software mutex overhead; RapidWrite Mode sustains 83 MHz write bursts to FFT output buffers.

Industrial PLC InterlockingMedical Imaging Data Pipeline

Use Scenario: Synchronizing safety-critical I/O states across redundant CPU modules in SIL-3 programmable logic controllers.

IC Role / Device Role / Timing Role: Dual-port RAM stores mirrored process variables; BUSY/INT signals enforce strict write-ordering and fault detection.

Use Value: Industrial temp rating (–40°C to +85°C) ensures reliability in uncooled cabinets; sleep mode reduces power during idle cycles.

Use Scenario: Buffering raw sensor data from CT detector array before GPU-accelerated reconstruction in diagnostic imaging systems.

IC Role / Device Role / Timing Role: High-bandwidth memory bridge between analog front-end ASIC and PCIe Gen3 host interface.

Use Value: 512K × 18 capacity accommodates multi-slice projection data; 2.5 V core minimizes heat near radiation-sensitive components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-12BGXI3.3 V core; no sleep mode; 12 ns access; 512K × 18; BGA-256Lacks RapidWrite Mode and hardware semaphore; requires external arbitration logic for inter-processor syncChoose when system uses only 3.3 V rails and software-managed semaphores suffice
AS7C35128P-12JINSingle-port SRAM; 512K × 18; 12 ns; 3.3 V; TQFP-100No dual-port capability; no BUSY/INT/SEM signals; incompatible pinout and architectureSelect only for non-concurrent access use cases where cost and package size outweigh performance needs

Compared with CY7C1362BV33-12BGXI, 70T633S12BCI delivers lower power via sleep mode and eliminates external logic with integrated semaphore and arbitration. Against AS7C35128P-12JIN, it provides true dual-port concurrency essential for real-time inter-processor communication.

Availability

70T633S12BCI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 70T633S12BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T633S12BCI belongs to IDT's high-speed asynchronous dual-port SRAM product line, designed specifically for deterministic, low-latency inter-processor communication in real-time embedded systems where concurrent access and hardware synchronization are critical.

FAQ

What is the maximum operating temperature range for the 70T633S12BCI?

The 70T633S12BCI is rated for industrial temperature operation from –40°C to +85°C. This specification applies across all DC and AC electrical parameters-including 12 ns access time, sleep mode current (≤20 mA), and JTAG functionality-ensuring reliable performance in harsh environments like base stations and factory controllers.

Does the 70T633S12BCI support both 2.5 V and 3.3 V I/O interfaces simultaneously?

Yes, the 70T633S12BCI supports mixed-voltage operation: OPTL and OPTR pins configure I/O voltage independently per port. Setting OPTL = VSS and OPTR = VDD configures left port for 2.5 V I/O and right port for 3.3 V I/O-enabling direct interfacing with heterogeneous SoCs without level shifters.

How does the RapidWrite Mode function in the 70T633S12BCI?

RapidWrite Mode in the 70T633S12BCI allows consecutive write cycles without toggling R/W or CE between addresses. The write cycle ends on the address transition-not R/W deassertion-reducing controller timing burden. It requires meeting tAAS ≤ 1 ns and tARF ≥ 1.5 V/ns to prevent spurious writes.

What is the role of the BUSY pin in master/slave configurations of the 70T633S12BCI?

In the 70T633S12BCI, the BUSY pin functions as an output when M/S = VIH (Master mode), signaling contention during concurrent access. When M/S = VIL (Slave mode), BUSY becomes an input-allowing daisy-chained arbitration where the Master asserts BUSY to stall Slave writes until completion.

Is JTAG boundary scan supported on the 70T633S12BCI, and what standard does it comply with?

Yes, the 70T633S12BCI supports full IEEE 1149.1-compliant JTAG boundary scan in its BGA-256 package. Pins TCK, TMS, TDI, TDO, and TRST are dedicated for test access; functionality remains active even during sleep mode (though not recommended for boundary scan execution in that state).

70T633S12BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T633S12BCI FAQ

1.How can I place an order for 70T633S12BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T633S12BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T633S12BCI reliable?

The price and inventory of 70T633S12BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S12BCI is usually 5 days.

3.What payment methods are accepted for 70T633S12BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S12BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T633S12BCI?

70T633S12BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T633S12BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T633S12BCI?

For technical support, including 70T633S12BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S12BCI requirements.

6.How does Aetrix verify that 70T633S12BCI is sourced from the original manufacturer or authorized distributors?

All 70T633S12BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S12BCI meets industry standards.

7.What is the process for return or replacement of 70T633S12BCI?

All 70T633S12BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S12BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T633S12BCI part is unused and in its original packaging.

Return procedure for 70T633S12BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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