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Renesas 70T633S12BFGI

Part No.:
70T633S12BFGI
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70T633S12BFGI.pdf
Description:
IC SRAM 9MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,647

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Product details

Overview

70T633S12BFGI from IDT (now Renesas) is a high-speed 512K × 18-bit asynchronous dual-port static RAM with independent left/right ports, 12 ns max access time, single 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port. It supports RapidWrite Mode, on-chip semaphore arbitration, and JTAG IEEE 1149.1 compliance in BGA-208 packaging - used in real-time interprocessor communication, FPGA co-processing, and legacy bus bridging systems.

For engineers reviewing the 70T633S12BFGI datasheet, 70T633S12BFGI pinout, 70T633S12BFGI application, or 70T633S12BFGI equivalent, key selection criteria include dual-port timing independence, BUSY/INT flag behavior in MASTER/SLAVE cascading, sleep-mode current (≤10 mA), VDDQ voltage configuration via OPT pins, and BGA-208 mechanical compatibility with industrial temperature operation (–40°C to +85°C).

Technical Context

This device implements true dual-port SRAM architecture with fully asynchronous read/write operations on each port, enabling simultaneous access to the same memory location without external arbitration logic. Port arbitration is handled internally via dedicated BUSY/INT/SEM signals and M/S-selectable master/slave mode for depth expansion.

RapidWrite Mode eliminates R/W pulse toggling between consecutive writes by defining write termination on address transition - requiring strict control of address skew (tAAS ≤ 1 ns) and rise/fall rate (tARF ≥ 1.5 V/ns). JTAG boundary scan operates independently of sleep mode but must be disabled during ZZ assertion.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization512K × 18 bits (9,216 Kbit); supports 36-bit+ word systems via MASTER/SLAVE cascading
Access Time (max)12 ns - guarantees full-speed operation in industrial temperature range (–40°C to +85°C)
Core Supply2.5 V ±100 mV - fixed VDD; no sequencing required with I/O supplies
I/O Voltage SupportSelectable 2.5 V or 3.3 V per port via OPTL/OPTR pins - enables mixed-voltage system interfacing
Operating TemperatureIndustrial grade: –40°C to +85°C - validated for embedded control and telecom infrastructure
Sleep Current≤10 mA (IZZ) - reduces power during idle cycles without disabling JTAG debug capability
JTAG ComplianceIEEE 1149.1 - supported only in BGA-208 and BGA-256 packages; TCK up to 10 MHz

Pinout & Package

70T633S12BFGI is packaged in a 208-ball fine-pitch Ball Grid Array (BGA), 15 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch. Pin functions are asymmetrically distributed across left (L) and right (R) ports with dedicated control, address, data, and arbitration signals.

Pin/TerminalCircuit RoleDesign Meaning
CE0L / CE0RChip Enable 0 (Port L/R)Primary enable for memory access; CE0 = VIL & CE1 = VIH selects active chip enable state
R/WL / R/WRRead/Write Control (Port L/R)Active-low signal determining direction; held low during RapidWrite Mode back-to-back writes
BUSYL / BUSYRBusy Flag (Port L/R)Output when M/S = VIH (Master); input when M/S = VIL (Slave) - enables hardware flow control
SEML / SEMRSemaphore Enable (Port L/R)Activates 8-bit semaphore register at A0–A2; allows atomic resource locking between ports
OPTL / OPTRI/O Voltage Select (Port L/R)VSS = 2.5 V I/O mode; VDD = 3.3 V I/O mode - sets VDDQL/VDDQR and VIH/VIL thresholds
ZZL / ZZRSleep Mode Input (Port L/R)Asserted high disables dynamic inputs (except JTAG); retains semaphore and interrupt states

Key Features

FeatureDesign Value
True Dual-Port ArchitectureEnables concurrent read/write to identical addresses - eliminates software arbitration overhead in multi-CPU systems
RapidWrite ModeRemoves need for R/W pulsing between writes - simplifies timing-critical back-to-back write sequences at 12 ns cycle
On-Chip Port ArbitrationHardware-resolved BUSY/INT/SEM signaling - avoids external logic for inter-port synchronization
Configurable I/O VoltageIndependent 2.5 V/3.3 V support per port - bridges legacy 3.3 V peripherals with modern 2.5 V cores
Master/Slave CascadingM/S pin configures BUSY as output (Master) or input (Slave) - enables seamless 36-bit+ data bus expansion

Applications

Real-Time Interprocessor CommunicationFPGA Co-Processing Buffer

Use Scenario: Two microcontrollers exchange sensor fusion data and control commands with deterministic latency and no shared-bus contention.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory buffer; left port connects to MCU-A, right port to MCU-B.

Use Value: Eliminates polling or interrupt-driven handshaking; BUSY flag ensures atomic access during concurrent reads/writes at 12 ns timing.

Use Scenario: An FPGA offloads compute-intensive filtering tasks while a host processor manages I/O and scheduling.

IC Role / Device Role / Timing Role: 70T633S12BFGI serves as high-bandwidth, low-latency data staging buffer between ARM host and FPGA fabric.

Use Value: RapidWrite Mode sustains sustained write throughput to FPGA; 512K × 18 capacity accommodates multi-frame buffers without DMA stalls.

Legacy Bus BridgingTelecom Line Card Control Memory

Use Scenario: Integrating a new 2.5 V DSP into an existing 3.3 V PCI-based control plane without level-shifter redesign.

IC Role / Device Role / Timing Role: Left port interfaces 3.3 V PCI controller (OPTL = VDD); right port connects 2.5 V DSP (OPTR = VSS).

Use Value: Single-component voltage translation preserves signal integrity and timing margins; eliminates discrete level-shifters and associated layout complexity.

Use Scenario: Storing configuration tables and real-time status registers in carrier-grade line cards operating continuously at +75°C ambient.

IC Role / Device Role / Timing Role: Nonvolatile shadow memory replacement; stores firmware parameters and alarm logs accessible by both control CPU and monitoring ASIC.

Use Value: Industrial temperature rating (–40°C to +85°C) and <10 mA sleep current ensure reliability and thermal stability in sealed chassis environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-12BGXI3.3 V core; no 2.5 V option; 12 ns access; 512K × 18; BGA-208 packageRequires 3.3 V system-wide; lacks RapidWrite Mode and JTAG supportChoose when legacy 3.3 V-only design prohibits mixed-voltage I/O configuration
70V9279L12PFGI2.5 V core; 12 ns; 512K × 18; BGA-208; no JTAG; no RapidWrite ModeLacks semaphore logic and sleep mode; lower standby current (ISB3 = 2 mA typical)Choose when JTAG debug and hardware semaphore are unnecessary and ultra-low standby is critical

Compared with CY7C1362BV33-12BGXI and 70V9279L12PFGI, the 70T633S12BFGI uniquely combines 2.5 V core + configurable I/O voltage, RapidWrite Mode, IEEE 1149.1 JTAG, and integrated semaphore arbitration - making it optimal for heterogeneous, real-time, and debug-aware embedded systems.

Availability

70T633S12BFGI is available at Aetrix Electronics and suitable for real-time interprocessor communication, FPGA co-processing buffers, and legacy bus bridging applications requiring stable component supply, long-term industrial temperature support, and verified dual-port timing performance.

Supply support for 70T633S12BFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70T633S12BFGI belongs to IDT's high-speed asynchronous dual-port SRAM product line, designed specifically for deterministic, low-latency inter-processor data exchange in mission-critical embedded systems where software arbitration introduces unacceptable jitter or overhead.

FAQ

What is the maximum operating temperature range supported by the 70T633S12BFGI?

The 70T633S12BFGI is rated for industrial temperature operation from –40°C to +85°C. This specification is validated across all electrical parameters including 12 ns access time, standby current (ISB1 ≤ 145 mA), and sleep mode current (IZZ ≤ 20 mA), ensuring reliable performance in enclosed or thermally stressed environments such as base station line cards and motor control cabinets.

How does the RapidWrite Mode function in the 70T633S12BFGI, and what timing constraints apply?

RapidWrite Mode in the 70T633S12BFGI allows consecutive write operations without toggling R/W, CE, or byte-enable signals - write termination is defined by address transition instead of control signal deassertion. To use this mode, address skew (tAAS) must not exceed 1 ns and address rise/fall rate (tARF) must be ≥1.5 V/ns. These constraints prevent spurious writes during transitions and are mandatory for guaranteed operation at 12 ns cycle time.

Can the left and right ports of the 70T633S12BFGI operate at different I/O voltages simultaneously?

Yes - the 70T633S12BFGI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL = VSS configures the left port for 2.5 V operation (VDDQL = 2.5 V), while OPTR = VDD configures the right port for 3.3 V (VDDQR = 3.3 V). This enables direct interfacing between mixed-voltage subsystems without external level shifters, provided VDD remains at 2.5 V for the core.

What is the role of the M/S pin in 70T633S12BFGI cascaded configurations?

In cascaded configurations, the M/S pin determines BUSY signal direction: when M/S = VIH, the device acts as Master and asserts BUSYR/BUSYL as outputs to indicate port contention; when M/S = VIL, it acts as Slave and accepts BUSY as an input. This enables automatic hardware flow control across multiple devices in 36-bit-or-wider memory systems without external logic or software intervention.

Does the 70T633S12BFGI support JTAG boundary scan, and under what conditions?

Yes - the 70T633S12BFGI supports IEEE 1149.1 JTAG boundary scan in its BGA-208 package (70T633S12BFGI), with dedicated TCK, TMS, TDI, TDO, and TRST pins. JTAG remains functional during normal operation but is not recommended during sleep mode (ZZ asserted), as boundary-scan logic may behave unpredictably. JTAG operates at up to 10 MHz and is independent of memory access timing.

70T633S12BFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70T633S12BFGI FAQ

1.How can I place an order for 70T633S12BFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T633S12BFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T633S12BFGI reliable?

The price and inventory of 70T633S12BFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T633S12BFGI is usually 5 days.

3.What payment methods are accepted for 70T633S12BFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T633S12BFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T633S12BFGI?

70T633S12BFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T633S12BFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T633S12BFGI?

For technical support, including 70T633S12BFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T633S12BFGI requirements.

6.How does Aetrix verify that 70T633S12BFGI is sourced from the original manufacturer or authorized distributors?

All 70T633S12BFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T633S12BFGI meets industry standards.

7.What is the process for return or replacement of 70T633S12BFGI?

All 70T633S12BFGI units undergo pre-shipment inspection (PSI). If there is an issue with 70T633S12BFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T633S12BFGI part is unused and in its original packaging.

Return procedure for 70T633S12BFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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