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Renesas 70T651S10BCI

Part No.:
70T651S10BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70T651S10BCI.pdf
Description:
IC SRAM 9MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,333

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Product details

Overview

70T651S10BCI from IDT (now Renesas) is a high-speed, asynchronous dual-port static RAM with 256K × 36-bit organization (9,216 Kbit), 2.5V core supply, and independently configurable 2.5V/3.3V I/O interfaces per port. It supports simultaneous read/write access to the same memory location, features on-chip semaphore logic and port arbitration, and targets real-time inter-processor communication in telecom switching fabric and military avionics systems.

For engineers reviewing the 70T651S10BCI datasheet, 70T651S10BCI pinout, 70T651S10BCI application, or 70T651S10BCI equivalent, this page delivers verified timing specs (10 ns max read cycle), true dual-port architecture details, industrial-grade thermal performance (–40°C to +85°C), and validated alternatives for bus-width expansion or voltage interface migration.

Technical Context

The 70T651S10BCI implements fully asynchronous operation on both left and right ports, with independent CE0/CE1, R/W, OE, and BE0–BE3 controls per port. Its on-chip arbitration logic resolves contention without external logic, and semaphore signaling uses dedicated SEM pins and I/O0–I/O35 for eight flag bits addressed by A0–A2.

RapidWrite Mode enables back-to-back writes without pulsing R/W between cycles-address transition defines write end, reducing control timing complexity. Sleep mode (via ZZL/ZZR) disables dynamic inputs while preserving JTAG and semaphore functionality, supporting low-power system states.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36-bit (9,216 Kbit); supports 72-bit+ expansion via Master/Slave cascading
Access Time (tAA) 10 ns max (commercial grade); enables 100 MHz sustained throughput per port
Core Supply Voltage 2.5 V ±100 mV; fixed VDD; separates logic power from I/O voltage domains
I/O Interface Voltage Selectable 2.5 V or 3.3 V per port via OPTL/OPTR; VDDQL/VDDQR must match selection
Operating Temperature –40°C to +85°C (industrial grade); validated across full range for reliability-critical systems
Package 256-ball BGA (BC256); 17 mm × 17 mm × 1.4 mm body; 1.0 mm ball pitch
Power Consumption ISB3 = 2–10 mA (full standby); IDD = 300–445 mA (both ports active, f = fMAX)

Pinout & Package

70T651S10BCI is housed in a 256-ball fine-pitch Ball Grid Array (BC256) package with 17 mm × 17 mm footprint and 1.0 mm ball pitch. Power and ground balls are distributed across the array for low-inductance decoupling; VDD (2.5 V) and VSS are assigned to multiple balls per quadrant.

Pin/Terminal Circuit Role Design Meaning
CE0L / CE1L
CE0R / CE1R
Chip Enable (dual per port) Active-low enables; CE0 = VIL & CE1 = VIH selects port; allows depth expansion without glue logic
R/WL / R/WR Read/Write Control Active-low; controls data direction; held low during RapidWrite Mode for consecutive writes
A0L–A17L / A0R–A17R Address Inputs 18-bit address per port; A17 is NC for IDT70T659 variant only; valid for 256K addressing
I/O0L–I/O35L / I/O0R–I/O35R Bidirectional Data Bus 36-bit parallel I/O per port; byte-enabled (BE0–BE3) for 9-bit granularity writes/reads
SEML / SEMR Semaphore Enable Activates semaphore register access; used with CE = VIH to read/write 8 flag bits via I/O0–I/O35
OPTL / OPTR I/O Voltage Select Input tied to VDD (2.5 V) → 3.3 V I/O; tied to VSS (0 V) → 2.5 V I/O; sets VDDQL/VDDQR requirement
ZZL / ZZR Sleep Mode Input Active-high; disables dynamic inputs (except JTAG); reduces ISB to ≤10 mA; preserves M/S, INT, BUSY states
M/S Master/Slave Select VIH = Master (BUSYR/BUSYL output); VIL = Slave (BUSYR/BUSYL input); enables multi-device synchronization

Key Features

Feature Design Value
True Dual-Port Architecture Independent control/address/I/O per port enables concurrent access to identical memory locations without arbitration delay
RapidWrite Mode Eliminates R/W pulse requirement between writes; address transition defines cycle end-reduces FPGA/CPLD timing burden
Configurable I/O Voltage Per-port 2.5 V/3.3 V selection via OPT pins; supports mixed-voltage system integration without level shifters
On-Chip Semaphore Logic Hardware-managed 8-bit semaphore flags accessible via A0–A2; eliminates software polling or external lock controllers
JTAG Boundary Scan IEEE 1149.1-compliant TAP controller (TCK/TMS/TDI/TDO/TRST); enables in-system test and debug without intrusive probing
Industrial Temperature Range –40°C to +85°C operation with validated AC/DC specs; suitable for deployed infrastructure and harsh-environment platforms

Applications

Telecom Switching Fabric Military Avionics Data Bus

Use Scenario: Real-time packet buffering and header translation between line cards in carrier-grade routers.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared memory buffer between ingress and egress processors; RapidWrite Mode accelerates burst packet writes.

Use Value: Eliminates external arbitration logic; 10 ns access ensures sub-microsecond latency for 10 Gbps packet processing pipelines.

Use Scenario: Synchronized sensor fusion and flight control command exchange across redundant mission computers.

IC Role / Device Role / Timing Role: Memory hub for time-critical inter-processor communication; semaphore flags coordinate deterministic task handoff.

Use Value: On-chip semaphore logic replaces discrete latches; industrial temp rating ensures reliability at altitude and under vibration.

Industrial PLC Backplane Medical Imaging Frame Buffer

Use Scenario: High-throughput I/O mapping and ladder logic execution across modular controller slots.

IC Role / Device Role / Timing Role: Dual-port RAM serves as shared configuration and status register bank; Master/Slave mode scales to 72-bit+ data paths.

Use Value: Depth expansion using dual chip enables simplifies board layout; 2.5 V core reduces power density in fanless enclosures.

Use Scenario: Real-time DICOM frame capture and display rendering in portable ultrasound systems.

IC Role / Device Role / Timing Role: Asynchronous buffer between ADC acquisition engine (left port) and GPU render pipeline (right port).

Use Value: Independent 3.3 V I/O on acquisition side and 2.5 V on display side avoids level-shifter components and signal integrity loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress CY7C1371D 256K × 36, 10 ns, 3.3 V core + I/O; no sleep mode; no RapidWrite; JTAG optional Lacks per-port voltage select and hardware semaphore; requires external arbitration for shared access Choose when 3.3 V-only system simplifies power design and JTAG is non-critical
Renesas 70V27L15PF8 128K × 36, 15 ns, 3.3 V core; integrated PLL; no OPT pins; supports QDR-II interface Lower density and slower speed; optimized for burst-mode QDR applications-not direct functional replacement Consider only for QDR-based systems requiring clocked interface; not drop-in for asynchronous designs

Compared with CY7C1371D and 70V27L15PF8, the 70T651S10BCI uniquely combines 10 ns asynchronous access, per-port I/O voltage flexibility, hardware semaphore, and RapidWrite-enabling simpler, lower-latency inter-processor communication in mixed-voltage industrial and defense platforms.

Availability

70T651S10BCI is available at Aetrix Electronics and suitable for telecom switching fabric, military avionics data bus, and industrial PLC backplane applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 70T651S10BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), acquired by Renesas Electronics in 2019, specializes in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70T651S10BCI belongs to IDT's high-speed asynchronous dual-port SRAM product line, engineered for deterministic, low-latency inter-processor communication in real-time embedded systems where bus contention and voltage interoperability are critical.

FAQ

What is the maximum operating frequency supported by the 70T651S10BCI?

The 70T651S10BCI does not operate on a clock signal-it is an asynchronous device. Its performance is defined by access times: tRC = 10 ns (max), enabling effective throughput up to 100 MHz per port in sustained read/write cycles. Timing compliance depends on meeting setup/hold windows (e.g., tAS = 0 ns, tDH = 0 ns) under specified load and voltage conditions.

Does the 70T651S10BCI support true simultaneous read/write to the same memory address?

Yes-the 70T651S10BCI uses true dual-port SRAM cells, allowing independent, concurrent read and write operations to the exact same memory location from left and right ports. This eliminates bus contention and eliminates the need for external arbitration logic in tightly coupled processor systems.

How does the RapidWrite Mode function in the 70T651S10BCI?

In RapidWrite Mode, the 70T651S10BCI treats the ending address transition-not R/W or CE deassertion-as the write cycle boundary. R/W, CE, and BE signals can remain asserted across consecutive writes, simplifying control timing in FPGA-based systems and eliminating narrow pulse generation requirements.

Can the left and right ports of the 70T651S10BCI operate at different I/O voltages?

Yes-OPTL and OPTR are independent inputs. Setting OPTL = VDD (2.5 V) configures the left port for 3.3 V I/O (requiring VDDQL = 3.3 V), while OPTR = VSS (0 V) configures the right port for 2.5 V I/O (requiring VDDQR = 2.5 V). This enables seamless integration into mixed-voltage subsystems.

Is JTAG boundary scan supported on the 70T651S10BCI, and what are its limitations?

Yes-the 70T651S10BCI implements IEEE 1149.1-compliant JTAG (TCK/TMS/TDI/TDO/TRST) for boundary scan testing. However, JTAG remains functional only when ZZL/ZZR = VIL; during sleep mode (ZZ = VIH), JTAG is preserved but other inputs are disabled-boundary scan should be performed before entering sleep.

70T651S10BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Asynchronous
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.4V ~ 2.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70T651S10BCI FAQ

1.How can I place an order for 70T651S10BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70T651S10BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70T651S10BCI reliable?

The price and inventory of 70T651S10BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T651S10BCI is usually 5 days.

3.What payment methods are accepted for 70T651S10BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T651S10BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70T651S10BCI?

70T651S10BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70T651S10BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70T651S10BCI?

For technical support, including 70T651S10BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T651S10BCI requirements.

6.How does Aetrix verify that 70T651S10BCI is sourced from the original manufacturer or authorized distributors?

All 70T651S10BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T651S10BCI meets industry standards.

7.What is the process for return or replacement of 70T651S10BCI?

All 70T651S10BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70T651S10BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70T651S10BCI part is unused and in its original packaging.

Return procedure for 70T651S10BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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