Renesas 70T651S12DR
- Part No.:
- 70T651S12DR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-BFQFP
- Datasheet:
-
70T651S12DR.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 208PQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70T651S12DR from Integrated Device Technology is a high-speed 256K × 36-bit asynchronous dual-port static RAM with independent left/right ports, 12 ns max read cycle time, 2.5 V core supply, and selectable 2.5 V/3.3 V I/O interface per port - used in real-time inter-processor communication, FPGA co-processing buffers, and legacy bus arbitration systems.
For engineers reviewing the 70T651S12DR datasheet, 70T651S12DR pinout, 70T651S12DR application, or 70T651S12DR equivalent, key selection criteria include dual-port arbitration logic, RapidWrite mode timing compliance, M/S master/slave cascading capability, and DR-208 PQFP package compatibility with industrial temperature support (–40°C to +85°C).
Technical Context
This device implements true dual-port SRAM architecture with fully asynchronous access on both ports, on-chip semaphore signaling for resource locking, and hardware-based port arbitration that prevents simultaneous write conflicts to the same memory location. It supports independent power domains: fixed 2.5 V VDD core and configurable VDDQ (2.5 V or 3.3 V) per port controlled by OPTL/OPTR pins.
RapidWrite Mode enables back-to-back writes without toggling R/W, CE, or BE signals between cycles - address transition defines write end, reducing control logic overhead. BUSY and INT flags are non-tri-state totem-pole outputs; JTAG IEEE 1149.1 support enables boundary-scan testing during system integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 36 bits (9,216 Kbit), organized as two independent 256K-word × 36-bit ports |
| Access Time | 12 ns max (commercial & industrial grades), enabling 83 MHz sustained read throughput per port |
| Supply Voltages | VDD = 2.5 V ±100 mV (core); VDDQ = 2.5 V or 3.3 V ±150/±100 mV per port, selected via OPTL/OPTR |
| Operating Temperature | –40°C to +85°C (industrial grade), validated for embedded control and telecom infrastructure |
| I/O Interface | LVTTL-compatible; separate byte enables (BE0–BE3) per port for 9-bit sub-word access and bus-matching |
| Package | 208-pin plastic quad flat pack (PQFP), 28 mm × 28 mm body, 0.5 mm lead pitch |
| Power Management | Four standby modes: ISB1–ISB4 (10–290 mA) and IZZ sleep mode (≤10 mA) with ZZL/ZZR control |
Pinout & Package
70T651S12DR is housed in a 208-pin PQFP (DR-208) package with 28 mm × 28 mm footprint and 0.5 mm lead pitch. Pin functions are symmetrically distributed across left (L) and right (R) ports, each with dedicated address, data, control, and power terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A17L / A0R–A17R | Address Inputs | 18-bit address per port; A17L/A17R are no-connect for IDT70T659 variants only - functional on 70T651S12DR |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional Data Bus | 36-bit parallel I/O per port; supports byte-wise reads/writes using BE0–BE3 |
| CE0L/CE1L, CE0R/CE1R | Chip Enables | Dual CE per port enables depth expansion without external logic; CE0=VIL & CE1=VIH selects active mode |
| R/WL/R/WR, OEL/OER | Control Inputs | Asynchronous read/write control; OE disables outputs independently of R/W state |
| BE0L–BE3L / BE0R–BE3R | Byte Enables | Four 9-bit byte masks per port - enables mixed-width bus interfacing (e.g., 16-bit CPU + 32-bit FPGA) |
| SEML/SEMR, BUSYL/BUSYR, INTL/INTR | Arbitration Signals | Semaphore enable and status flags for inter-processor synchronization; BUSY is output when M/S=VIH (Master), input when M/S=VIL (Slave) |
| OPTL/OPTR, VDDQL/VDDQR | I/O Voltage Select | OPT = VSS → 2.5 V I/O; OPT = VDD → 3.3 V I/O; VDDQ must match selected level |
| ZZL/ZZR, M/S, TCK–TDO | Power & Test | Sleep mode disables dynamic inputs (except JTAG); M/S configures master/slave role for cascaded 72+ bit systems |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Simultaneous independent read/write access to same memory location without external arbitration logic |
| RapidWrite Mode | Eliminates R/W pulse requirement between consecutive writes - simplifies timing-critical control FSM design |
| Configurable I/O Voltage | Independent 2.5 V/3.3 V operation per port via OPT pins - enables mixed-voltage system integration |
| Hardware Semaphore Logic | Eight shared semaphore flags accessible via A0–A2; eliminates software polling and reduces inter-processor latency |
| Master/Slave Cascading | Single M/S pin configures BUSY flag direction - supports error-free 72-bit+ word expansion using multiple devices |
Applications
| Real-Time Inter-Processor Communication | FPGA-CPU Co-Processing Buffer |
|---|---|
Use Scenario: Two microcontrollers exchange sensor fusion data and actuation commands with deterministic latency. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory with hardware semaphore for mutual exclusion. Use Value: Eliminates software locks and bus contention; BUSY/INT flags enable interrupt-driven synchronization at ≤12 ns resolution. | Use Scenario: An FPGA offloads image preprocessing while an ARM Cortex-A9 handles OS tasks - sharing frame buffers and metadata. IC Role / Device Role / Timing Role: Left port interfaces FPGA (3.3 V I/O, OPTL=VDD), right port interfaces CPU (2.5 V I/O, OPTR=VSS). Use Value: Independent voltage domains avoid level shifters; RapidWrite mode accelerates burst pixel writes from FPGA pipeline. |
| Legacy Bus Arbitration Bridge | Telecom Line Card Control Memory |
Use Scenario: Integrating a modern DSP into a VMEbus-based avionics subsystem requiring strict timing isolation. IC Role / Device Role / Timing Role: Acts as asynchronous bridge between VMEbus (left port) and DSP local bus (right port), with CE0L/CE1L mapped to VME address decode. Use Value: Dual chip enables allow seamless depth expansion; tAA ≤12 ns meets VME A24 timing requirements. | Use Scenario: Storing configuration tables and call-state records in carrier-grade line cards operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Industrial-grade 70T651S12DR provides non-blocking access for control processor and packet scheduler engines. Use Value: Full industrial temp range (–40°C to +85°C) and ISB3 ≤10 mA standby current ensure reliability under thermal stress and power cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-12BGXI | 3.3 V core (not 2.5 V), 12 ns access, 256K × 36, BGA package (no PQFP option) | Requires full 3.3 V system design; lacks RapidWrite mode and M/S cascading logic | Select when board uses BGA-only layout and 3.3 V core supply is already established |
| AS7C3256A-12JIN | Single-port SRAM, 12 ns, 32K × 8, SOJ package - not functionally equivalent | No dual-port, semaphore, or arbitration features; cannot replace 70T651S12DR in inter-processor use cases | Only consider for cost-sensitive, non-concurrent-access buffer applications where dual-port functionality is unnecessary |
Compared with CY7C1362BV33-12BGXI and AS7C3256A-12JIN, the 70T651S12DR uniquely delivers true dual-port concurrency, hardware semaphore, and RapidWrite mode in a through-hole-compatible PQFP package - making it irreplaceable for deterministic real-time inter-processor memory sharing.
Availability
70T651S12DR is available at Aetrix Electronics and suitable for real-time inter-processor communication, FPGA co-processing buffers, and telecom line card control memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 70T651S12DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
The 70T651S12DR belongs to IDT's high-speed asynchronous dual-port SRAM product line, engineered for deterministic low-latency memory sharing between heterogeneous processors in mission-critical embedded systems.
FAQ
What is the maximum operating temperature range supported by the 70T651S12DR?
The 70T651S12DR is rated for industrial temperature operation from –40°C to +85°C. This specification is validated across all electrical parameters including tRC ≤12 ns, ISB currents, and I/O voltage margins - ensuring reliable performance in base station radios, motor drives, and avionics control units without derating.
Does the 70T651S12DR support mixed-voltage operation between its left and right ports?
Yes, the 70T651S12DR supports independent I/O voltage selection per port: OPTL sets left-port VDDQL to 2.5 V or 3.3 V, and OPTR sets right-port VDDQR accordingly. Both ports share the same 2.5 V VDD core. This allows direct interfacing with 3.3 V FPGAs and 2.5 V microcontrollers without external level shifters.
How does RapidWrite Mode function in the 70T651S12DR, and what timing constraints apply?
RapidWrite Mode in the 70T651S12DR allows consecutive writes without pulsing R/W, CE, or BE between cycles - the ending address transition defines write completion. Designers must still meet tWC (12 ns), tDW (8 ns), and tDH (0 ns), but tAS and tWR apply only when switching from read to write. This reduces control logic complexity in high-throughput data acquisition systems.
Can the 70T651S12DR be used in master/slave configurations for wider data buses, and how is this implemented?
Yes, the 70T651S12DR supports master/slave cascading via the M/S pin: when M/S = VIH, BUSY is an output flag indicating port contention; when M/S = VIL, BUSY is an input for slave synchronization. Multiple devices can be stacked to build 72-bit or wider memory systems without external glue logic - verified in IDT reference designs for radar signal processors.
What JTAG capabilities does the 70T651S12DR provide, and are they compatible with standard IEEE 1149.1 tools?
The 70T651S12DR implements full IEEE 1149.1 JTAG boundary-scan with TCK, TMS, TDI, TDO, and TRST pins. It supports instruction register scan, device identification, and I/O pin visibility - validated with industry-standard tools like Xilinx Vivado and Teradyne J750. JTAG remains active during ZZ sleep mode, enabling in-system test without waking the core.
70T651S12DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Asynchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 2.4V ~ 2.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PQFP (28x28)
70T651S12DR FAQ
1.How can I place an order for 70T651S12DR through Aetrix?
Please submit a Request for Quotation (RFQ) for 70T651S12DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70T651S12DR reliable?
The price and inventory of 70T651S12DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70T651S12DR is usually 5 days.
3.What payment methods are accepted for 70T651S12DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70T651S12DR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70T651S12DR?
70T651S12DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70T651S12DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70T651S12DR?
For technical support, including 70T651S12DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70T651S12DR requirements.
6.How does Aetrix verify that 70T651S12DR is sourced from the original manufacturer or authorized distributors?
All 70T651S12DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70T651S12DR meets industry standards.
7.What is the process for return or replacement of 70T651S12DR?
All 70T651S12DR units undergo pre-shipment inspection (PSI). If there is an issue with 70T651S12DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70T651S12DR part is unused and in its original packaging.
Return procedure for 70T651S12DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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