My Inquiry
My Account
Renesas 70V3319S133BC
- Part No.:
- 70V3319S133BC
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
70V3319S133BC.pdf
- Description:
- IC SRAM 4.5MBIT PAR 256CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,549
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70V3319S133BC from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O voltage per port via OPT pins, and delivers pipelined output mode only in its 128-pin TQFP package for telecom packet buffering and real-time DSP co-processing.
For engineers reviewing the 70V3319S133BC datasheet, 70V3319S133BC pinout, 70V3319S133BC application, or 70V3319S133BC equivalent, key selection criteria include guaranteed 4.2ns clock-to-data-out timing at 133MHz, industrial temperature support (–40°C to +85°C), dual chip enable depth expansion capability, and LVTTL-compatible 3.3V core with independently configurable I/O supply per port.
Technical Context
This device implements full synchronous operation on both ports with registered address, data, and control inputs-enabling minimal 1.7ns setup and 0.5ns hold times at 166MHz. Its self-timed write architecture ensures fast cycle time without external wait-state generation.
The memory array uses true dual-port cells with separate byte enables (UBL/LBL and UBR/LBR) for multiplexed bus compatibility and supports Dual Cycle Deselect (DCD) in pipelined mode. JTAG IEEE 1149.1 compliance is omitted in the 128-pin TQFP variant due to pin count constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18 bits (4.6 Mbit total); supports independent concurrent access on left/right ports |
| Max Clock Frequency | 133 MHz (7.5 ns cycle time); validated for industrial temperature range (–40°C to +85°C) |
| Access Time | 4.2 ns (clock-to-data-out, pipelined mode); enables deterministic latency in real-time systems |
| I/O Voltage Support | Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins; allows mixed-voltage system interfacing |
| Core Supply | 3.3 V ±150 mV (VDD); fixed core voltage decoupled from I/O rail selection |
| Operating Temperature | –40°C to +85°C (industrial grade); qualified for embedded networking and industrial control |
| Power Management | Dual chip enables (CE0/CE1 per port) enable per-port standby; ISB2 = 220 mA max (one active port) |
Pinout & Package
70V3319S133BC is packaged in a 128-pin Thin Quad Flatpack (TQFP) with 0.5 mm pitch, body size 14 mm × 20 mm × 1.4 mm. The package supports pipelined output mode only-flow-through mode is not implemented due to pin count limitations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Registers all address/data/control signals on rising edge; enables fully synchronous dual-port operation |
| CE0L/CE1L, CE0R/CE1R | Dual chip enable per port | Allows depth expansion without external logic; CE0X = VIL & CE1X = VIH selects port X |
| UBL/LBL, UBR/LBR | Upper/lower byte enable | Enables 9-bit granularity writes (I/O0–I/O8 or I/O9–I/O17); supports 16-bit bus matching |
| OPTL / OPTR | I/O voltage select control | VIH = 3.3 V I/O interface; VIL = 2.5 V I/O interface; sets VDDQL/VDDQR and input thresholds |
| ADSL / ADSR | Address strobe enable | Latches current address into internal counter; enables burst address increment via CNTEN/REPEAT |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous read/write to identical addresses-critical for FIFOs, ping-pong buffers, and inter-processor communication |
| Pipelined output mode only (TQFP) | Guarantees 4.2 ns tCD2 at 133 MHz; eliminates flow-through timing variability in high-speed designs |
| Independent I/O voltage per port | Allows left port to interface with 3.3 V FPGA while right port connects to 2.5 V ASIC-no level-shifting required |
| Dual-cycle deselect (DCD) | Prevents bus contention during rapid port switching by delaying output disable by two clocks |
| Address counter with repeat | Reduces address bus overhead in sequential access patterns (e.g., video line buffers); REPEAT resets to last ADS-loaded address |
Applications
| Telecom Packet Buffering | DSP Co-Processor Interface |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in network switches/routers where ingress and egress paths require concurrent memory access. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared buffer between MAC controller (left port) and traffic manager (right port), synchronized to independent clocks. Use Value: Eliminates arbitration logic and guarantees zero-wait-state throughput at 133 MHz-supporting 2.4 Gbps aggregate bandwidth (133 MHz × 18 bits). | Use Scenario: Real-time audio/video processing where DSP core writes processed samples while host processor reads results for display or transmission. IC Role / Device Role / Timing Role: Serves as low-latency scratchpad memory between TI C6000 DSP (left port) and ARM Cortex-A9 host (right port), each operating at native voltage. Use Value: Independent 3.3 V/2.5 V I/O rails allow direct connection to both processors; pipelined outputs ensure deterministic 4.2 ns read latency. |
| Industrial Motion Control | Test Equipment Data Capture |
Use Scenario: Storing encoder position data and motion profile commands in CNC controllers requiring deterministic jitter-free memory access across PLC and servo drive interfaces. IC Role / Device Role / Timing Role: Provides synchronized dual-port access for real-time trajectory calculation (left port) and hardware PWM update (right port) at 133 MHz. Use Value: Industrial temperature rating (–40°C to +85°C) and 220 mA standby current (ISB2) ensure reliability in uncooled enclosures. | Use Scenario: High-speed digital pattern capture in ATE systems where one port receives parallel test vectors from FPGA while second port streams captured responses to host PC. IC Role / Device Role / Timing Role: Functions as 4.6 Mbit deep FIFO buffer between Xilinx Kintex-7 (left port, 3.3 V) and Intel Atom-based controller (right port, 2.5 V). Use Value: Dual chip enables permit seamless depth expansion across multiple 70V3319S133BC devices without glue logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 128K × 18 organization; 133 MHz max; 3.3 V only I/O (no 2.5 V option); 208-pin BGA package | Lacks per-port I/O voltage flexibility; requires PCB redesign for BGA footprint and thermal management | Choose when board space permits BGA and system uses uniform 3.3 V I/O rails |
| IDT70V9369S133BG | 128K × 18; 133 MHz; 3.3 V core + 3.3 V/2.5 V I/O; 256-pin BGA; supports both pipelined and flow-through modes | Offers flow-through mode and larger package-unsuitable for TQFP-limited layouts but better for multi-mode timing validation | Choose when design requires flow-through mode verification or higher pin-count routing margin |
Compared with CY7C1362BV33-133AXC and IDT70V9369S133BG, the 70V3319S133BC uniquely delivers 256K × 18 density in a 128-pin TQFP with guaranteed pipelined-only timing-reducing layout complexity for cost-sensitive industrial controls while maintaining industrial temperature operation.
Availability
70V3319S133BC is available at Aetrix Electronics and suitable for telecom packet buffering, DSP co-processor interfacing, and industrial motion control requiring stable component supply across extended product lifecycles.
Supply support for 70V3319S133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing infrastructure.
The 70V3319S133BC belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic latency and concurrent access in real-time embedded systems requiring industrial-grade reliability.
FAQ
What is the maximum guaranteed operating frequency of the 70V3319S133BC?
The 70V3319S133BC is rated for 133 MHz operation across the industrial temperature range (–40°C to +85°C), with a maximum clock cycle time of 7.5 ns in pipelined mode. This specification is validated per AC Electrical Characteristics Table 11 in the official datasheet and applies to both left and right ports under specified VDD and VDDQ conditions.
Does the 70V3319S133BC support flow-through output mode?
No, the 70V3319S133BC does not support flow-through output mode. As explicitly stated in the datasheet (page 4, Note 8), the PIPE/FT option is not supported in the PKG128 (128-pin TQFP) package due to pin count limitations-only pipelined output mode is implemented. Attempting to configure FT/PIPEL or FT/FTR pins for flow-through will have no functional effect.
Can the left and right ports of the 70V3319S133BC operate at different I/O voltages?
Yes, the 70V3319S133BC supports independent I/O voltage selection per port: OPTL sets the left port's I/O voltage (3.3 V or 2.5 V), and OPTR sets the right port's I/O voltage. This allows the left port to interface with a 3.3 V FPGA while the right port connects to a 2.5 V ASIC-without external level shifters-as confirmed in Pin Names table (page 5) and Recommended Operating Conditions (page 7).
What is the purpose of the ADSL and ADSR pins on the 70V3319S133BC?
The ADSL and ADSR pins (Address Strobe Enable Left/Right) latch the current address bus value into the internal address counter on the rising edge of CLK. When combined with CNTEN and REPEAT, they enable automatic address increment for burst transfers-reducing address bus overhead in applications like video line buffering or sequential data capture, as detailed in Truth Table II (page 6) and Timing Waveform descriptions (pages 12–16).
Is JTAG boundary scan supported on the 70V3319S133BC?
No, JTAG boundary scan (IEEE 1149.1) is not supported on the 70V3319S133BC. The datasheet explicitly states on page 4 (Note 9) and page 1 that "due to limited pin count, JTAG is not supported on the 128-pin TQFP package." Pins TDI, TDO, TCK, TMS, and TRST are present but non-functional in this variant.
70V3319S133BC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-CABGA (17x17)
70V3319S133BC FAQ
1.How can I place an order for 70V3319S133BC through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3319S133BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3319S133BC reliable?
The price and inventory of 70V3319S133BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S133BC is usually 5 days.
3.What payment methods are accepted for 70V3319S133BC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3319S133BC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3319S133BC?
70V3319S133BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3319S133BC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3319S133BC?
For technical support, including 70V3319S133BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S133BC requirements.
6.How does Aetrix verify that 70V3319S133BC is sourced from the original manufacturer or authorized distributors?
All 70V3319S133BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S133BC meets industry standards.
7.What is the process for return or replacement of 70V3319S133BC?
All 70V3319S133BC units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S133BC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3319S133BC part is unused and in its original packaging.
Return procedure for 70V3319S133BC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3319S133BC Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
