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Renesas 70V3319S133BCGI

Part No.:
70V3319S133BCGI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V3319S133BCGI.pdf
Description:
IC SRAM 4.5MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,853

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Product details

Overview

70V3319S133BCGI from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 4.2ns clock-to-data-out in pipelined mode. It is used in real-time packet buffering for telecom line cards requiring deterministic latency and concurrent data flow control.

For engineers reviewing the 70V3319S133BCGI datasheet, 70V3319S133BCGI pinout, 70V3319S133BCGI application, or 70V3319S133BCGI equivalent, key selection criteria include its 133MHz industrial-grade timing, dual-voltage I/O flexibility (2.5V/3.3V per port), pipelined output mode only (no flow-through on TQFP), JTAG omission in this package, and 128-pin TQFP footprint compatibility with depth-expansion logic.

Technical Context

This device implements full synchronous operation on both ports with registered address, data, and control inputs-enabling 1.7ns setup and 0.5ns hold times at 133MHz. Its dual chip enables (CE0/CE1 per port) support seamless depth expansion without external logic, while separate upper/lower byte enables (UB/LB) allow precise 9-bit sub-word writes aligned to multiplexed bus protocols.

The internal address counter-enabled by CNTEN and resettable via ADS and REPEAT signals-provides burst-addressing capability without host CPU intervention. All I/Os are LVTTL-compatible, with VDDQ voltage selected independently per port via OPTL/OPTR pins, and core powered by a fixed 3.3V VDD supply.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 18 bits (4.5 Mbit total); supports concurrent access to identical addresses from both ports
Max Clock Frequency133MHz (7.5ns cycle time); validated for industrial temperature range (–40°C to +85°C)
Access Time4.2ns clock-to-data-out (tCD2) in pipelined mode; no flow-through option available in this TQFP package
I/O Voltage SupportSelectable 2.5V or 3.3V per port via OPTL/OPTR pins; core VDD fixed at 3.3V ±150mV
Power ConsumptionTyp. 320mA dynamic current (both ports active); 15mA full standby current with CMOS-level inputs
Operating TemperatureIndustrial grade: –40°C to +85°C; specified performance guaranteed across full range
Package128-pin TQFP (14mm × 20mm); no JTAG or PL/FT mode support due to pin count limitation

Pinout & Package

70V3319S133BCGI is housed in a 128-pin Thin Quad Flatpack (TQFP) with 0.5mm pitch, body size 14mm × 20mm × 1.4mm. All VDD pins require connection to 3.3V; VDDQ pins must match OPT pin logic level (3.3V if OPT = VIH, 2.5V if OPT = VIL). JTAG and flow-through mode are omitted in this package variant.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputRegisters all address, data, and control inputs on rising edge; defines timing domain for each port independently
CE0L/CE1L, CE0R/CE1RDual chip enable inputs per portEnable depth expansion: CE0X = VIL & CE1X = VIH activates port; CE0X = VIH or CE1X = VIL places port in power-down
R/WL / R/WRRead/write direction controlSynchronous signal sampled on CLK rise; determines data flow direction for current cycle
OEL / OERAsynchronous output enableControls output buffer state independently of clock; high-Z when asserted (H)
UBL/LBL, UBR/LBRByte enable controlsEnable 9-bit upper (I/O9–I/O17) or lower (I/O0–I/O8) data lanes per port for sub-word writes
A0L–A17L, A0R–A17RAddress inputs18-bit address bus per port; A17 is no-connect (NC) for this variant per datasheet note
I/O0L–I/O17L, I/O0R–I/O17RBidirectional data I/O18-bit data interface per port; voltage level set by corresponding VDDQ and OPT pin
OPTL / OPTRI/O voltage selectDC input: VIH (3.3V) selects 3.3V I/O levels; VIL (0V) selects 2.5V I/O levels for respective port

Key Features

FeatureDesign Value
True Dual-Port Memory CellsEnables simultaneous, independent read/write operations to identical memory locations-critical for lock-free inter-processor communication
Dual Chip Enables per PortEliminates need for external decode logic during memory depth expansion; supports seamless multi-chip addressing
Separate Byte Controls (UB/LB)Allows 9-bit sub-word writes aligned to legacy 16-bit or multiplexed bus architectures without data corruption
Address Counter with ADS/REPEATReduces host processor overhead: auto-increments address on each access or repeats last ADS-loaded address for burst transfers
Self-Timed Write ArchitectureGuarantees fast write cycle completion independent of external timing margins-enables reliable operation at 133MHz

Applications

Telecom Line Card BufferingReal-Time Signal Processing

Use Scenario: Storing and forwarding ATM or Ethernet frames between ingress and egress ASICs in carrier-grade switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as a zero-latency, non-blocking FIFO-left port accepts incoming packets while right port services outgoing scheduler.

Use Value: Simultaneous access eliminates arbitration delay; 4.2ns tCD2 ensures deterministic frame handoff within strict 133MHz timing budget.

Use Scenario: Holding intermediate FFT coefficients between pipeline stages in radar DSP subsystems.

IC Role / Device Role / Timing Role: Provides synchronized data exchange between adjacent processing units operating on different clock domains.

Use Value: Pipelined output mode delivers coefficient data with fixed 1-cycle latency, enabling tight loop timing closure in multi-stage algorithms.

Industrial Motion ControllerMedical Imaging Data Pipeline

Use Scenario: Coordinating position feedback and command updates between FPGA-based motion sequencer and servo drive interface.

IC Role / Device Role / Timing Role: Serves as shared memory between control logic (left port) and real-time I/O engine (right port).

Use Value: Industrial temperature rating (–40°C to +85°C) and 133MHz operation ensure reliability in harsh factory environments with minimal thermal derating.

Use Scenario: Transferring raw sensor data from CT/MRI detector array to reconstruction engine under strict throughput requirements.

IC Role / Device Role / Timing Role: Buffers high-bandwidth pixel streams with concurrent read/write to decouple acquisition and processing pipelines.

Use Value: Selectable 2.5V/3.3V I/O per port allows direct interfacing to mixed-voltage ASICs without level shifters-reducing BOM count and signal integrity risk.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133AXC256K × 18, 133MHz, 3.3V-only I/O; no OPT-selectable 2.5V interface; 208-pin BGA packageLacks per-port voltage flexibility; requires redesign for 2.5V-connected peripheralsChoose when system uses uniform 3.3V signaling and board layout accommodates BGA
AS7C3256A-133JCIN256K × 18, 133MHz, 3.3V core/I/O; no dual-voltage I/O or address counter features; 128-pin TQFPMissing ADS/CNTEN/REPEAT functions; no byte-enable granularity beyond full-word accessChoose for cost-sensitive designs where burst addressing and sub-word writes are unnecessary

Compared with CY7C1362BV33-133AXC and AS7C3256A-133JCIN, the 70V3319S133BCGI uniquely supports independent 2.5V/3.3V I/O per port and integrated address counter-enabling mixed-voltage system integration and reduced host CPU load in burst-oriented applications.

Availability

70V3319S133BCGI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and real-time signal processing applications requiring stable component supply, long-term lifecycle support, and industrial temperature compliance.

Supply support for 70V3319S133BCGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70V3319S133BCGI belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency data exchange in real-time embedded systems with concurrent processing demands.

FAQ

What is the maximum operating frequency of the 70V3319S133BCGI?

The 70V3319S133BCGI is rated for 133MHz operation (7.5ns clock cycle time) across the full industrial temperature range (–40°C to +85°C). This frequency is guaranteed with pipelined output mode, which is the only supported mode in its 128-pin TQFP package. The device achieves 4.2ns clock-to-data-out timing under these conditions, enabling deterministic latency-critical designs.

Does the 70V3319S133BCGI support flow-through output mode?

No, the 70V3319S133BCGI does not support flow-through output mode. As explicitly stated in the datasheet (Note 8, Page 4), the PIPE/FT option is not supported in the PKG128 (128-pin TQFP) package due to pin count limitations. The device operates exclusively in pipelined output mode, delivering data with one-clock-cycle latency after the initiating clock edge.

Can the left and right ports of the 70V3319S133BCGI operate at different I/O voltages?

Yes, the 70V3319S133BCGI supports independent I/O voltage selection per port. OPTL sets the left port's I/O voltage (2.5V or 3.3V), while OPTR sets the right port's. Corresponding VDDQL and VDDQR supplies must match the selected level. This enables direct interfacing with mixed-voltage ASICs-for example, a 2.5V FPGA core and 3.3V peripheral bus-without external level shifters.

Is JTAG debugging supported on the 70V3319S133BCGI?

No, JTAG is not supported on the 70V3319S133BCGI. As confirmed in the datasheet (Note 9, Page 4), JTAG functionality (TCK, TMS, TDI, TDO, TRST) is omitted from the 128-pin TQFP package due to insufficient pin count. JTAG is only available on the 208-pin and 256-pin BGA variants of the 70V3319/99 family.

What is the function of the ADS and REPEAT pins on the 70V3319S133BCGI?

The ADS (Address Strobe) and REPEAT pins enable autonomous address generation. When CNTEN is asserted, ADS loads a new base address into the internal counter; subsequent accesses auto-increment. REPEAT resets the counter to the last ADS-loaded address-ideal for burst transfers to a fixed memory region. These signals reduce host CPU overhead in streaming applications like packet buffering or sensor data acquisition.

70V3319S133BCGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V3319S133BCGI FAQ

1.How can I place an order for 70V3319S133BCGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3319S133BCGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3319S133BCGI reliable?

The price and inventory of 70V3319S133BCGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S133BCGI is usually 5 days.

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70V3319S133BCGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3319S133BCGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3319S133BCGI?

For technical support, including 70V3319S133BCGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S133BCGI requirements.

6.How does Aetrix verify that 70V3319S133BCGI is sourced from the original manufacturer or authorized distributors?

All 70V3319S133BCGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S133BCGI meets industry standards.

7.What is the process for return or replacement of 70V3319S133BCGI?

All 70V3319S133BCGI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S133BCGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3319S133BCGI part is unused and in its original packaging.

Return procedure for 70V3319S133BCGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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