Renesas 70V3319S133BF
- Part No.:
- 70V3319S133BF
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3319S133BF.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,660
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70V3319S133BF from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 4.2ns clock-to-data-out in pipelined mode for real-time data buffering in telecom line cards and packet-switching engines.
For engineers reviewing the 70V3319S133BF datasheet, 70V3319S133BF pinout, 70V3319S133BF application, or 70V3319S133BF equivalent, key selection criteria include its 128-pin TQFP package with pipelined-only output mode, industrial temperature support (–40°C to +85°C), dual chip enable for depth expansion, and JTAG-unavailable configuration - all critical for deterministic latency in FPGA co-processor memory subsystems.
Technical Context
This device implements fully synchronous dual-port operation with independent clock domains (CLKL/CLKR), register-controlled address/data/control inputs, and self-timed write logic to achieve 6ns minimum cycle time at 166MHz. Each port features separate byte enables (UBL/LBL, UBR/LBR), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat functionality for burst-mode addressing.
The 70V3319S133BF uses LVTTL-compatible signaling with core VDD = 3.3V ±150mV and independently configurable I/O supply (VDDQL/VDDQR) at either 3.3V or 2.5V via OPTL/OPTR pins. Due to 128-pin TQFP pin count limitation, pipelined output mode is fixed - flow-through mode and JTAG are not supported.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 18 bits (4.5 Mbit total); supports 18-bit parallel data paths on both ports for high-bandwidth inter-processor communication. |
| Max Clock Frequency | 133MHz (7.5ns cycle time); validated for industrial temperature range (–40°C to +85°C), enabling use in base station control modules. |
| Access Time | 4.2ns clock-to-data-out (tCD2) in pipelined mode; guarantees deterministic read latency for real-time DSP buffer applications. |
| I/O Voltage Support | Selectable 3.3V or 2.5V per port via OPTL/OPTR pins; allows mixed-voltage system integration with legacy 3.3V FPGAs and modern 2.5V ASICs. |
| Power Supply | Core VDD = 3.3V ±150mV; I/O VDDQ = 3.3V ±150mV or 2.5V ±100mV; enables low-noise power domain partitioning. |
| Operating Temperature | Industrial grade (–40°C to +85°C); qualified for deployment in uncontrolled ambient environments like outdoor wireless infrastructure. |
| Package | 128-pin TQFP (14mm × 20mm); surface-mount compatible with standard reflow profiles and automated optical inspection. |
Pinout & Package
70V3319S133BF is housed in a 128-pin Thin Quad Flatpack (TQFP) with 0.5mm pitch, body size 14mm × 20mm × 1.4mm. Pin functions are asymmetrically distributed across left (L) and right (R) ports, with dedicated clock, address, data I/O, control, and power terminals per side.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronizes all register inputs (address, data, control) on respective port; rising-edge triggered with 2.1ns min high/low time at 133MHz. |
| A0L–A17L / A0R–A17R | Address inputs | 18-bit address bus per port; A17L/A17R are no-connect for this variant, limiting effective address space to 256K words. |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional data I/O | 18-bit multiplexed data path per port; supports simultaneous read/write between ports without arbitration logic. |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables | Independent port enable/disable; dual CE architecture allows seamless depth expansion using multiple devices without external logic. |
| R/WL / R/WR | Read/write control | Active-high write enable per port; combined with CE and byte enables to define precise memory transaction scope. |
| UBL/LBL / UBR/LBR | Byte enable controls | Independent upper (I/O9–I/O17) and lower (I/O0–I/O8) byte masking per port; enables 9-bit sub-word writes in mixed-data-width systems. |
| OPTL / OPTR | I/O voltage select | DC-level input selecting 3.3V (VIH) or 2.5V (VIL) I/O interface per port; configures VDDQL/VDDQR supply requirements pre-power-up. |
| VDD / VSS | Core power/ground | 3.3V core supply with multiple distributed VDD/VSS pins; requires local 0.1µF decoupling per power pair to meet AC noise specs. |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Enables concurrent read and write operations to identical memory locations from independent ports - eliminates arbitration overhead in real-time data exchange between CPUs or FPGA blocks. |
| Pipelined Output Mode Only | Fixed pipelined timing (4.2ns tCD2 at 133MHz) ensures predictable latency for pipeline-synchronized systems; avoids flow-through mode variability in high-speed control loops. |
| Dual Chip Enable Logic | CE0/CE1 per port allows hierarchical memory expansion: CE0 enables active operation while CE1 places port in ultra-low-power standby (ISB1 ≤ 160mA), reducing dynamic current by >50% during idle cycles. |
| Configurable I/O Voltage Per Port | OPTL/OPTR pins set VDDQL/VDDQR to 3.3V or 2.5V independently - permits direct interfacing with heterogeneous logic families (e.g., 3.3V FPGA fabric + 2.5V ASIC core) without level shifters. |
| Address Counter with Repeat | CNTENL/CNTENR and REPEATL/REPEATR enable auto-incrementing burst reads/writes; REPEAT resets counter to last ADS-loaded address, simplifying circular buffer management in packet processing engines. |
Applications
| Telecom Line Card Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: High-speed packet buffering between line interface units (LIUs) and switching fabric in OC-192 SONET/SDH equipment. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared memory between ingress and egress processing engines, synchronized via independent CLKL/CLKR domains. Use Value: 4.2ns pipelined access enables sub-10ns round-trip latency for header modification and CRC recalculation, meeting ITU-T G.707 jitter tolerance. | Use Scenario: Real-time data exchange between Xilinx Virtex FPGA fabric and ARM-based control processor in software-defined radio (SDR) platforms. IC Role / Device Role / Timing Role: Provides deterministic-latency scratchpad memory for FFT coefficient storage and IQ sample buffering, with left port connected to FPGA and right port to ARM AXI bus. Use Value: Independent 3.3V/2.5V I/O support eliminates level-shifter components, reducing BOM cost and PCB area by 12% versus discrete voltage translation solutions. |
| Industrial Motion Controller | Avionics Data Acquisition |
Use Scenario: Synchronized position/velocity data sharing between dual-redundant servo controllers in CNC machine tools operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Acts as fault-tolerant shared memory with lock-step read/write validation; CE0/CE1 enables hot-swappable controller failover without memory corruption. Use Value: Industrial temperature qualification and 160mA ISB1 standby current ensure reliable operation during extended thermal cycling, extending mean time between failures (MTBF) by 3.2× over commercial-grade alternatives. | Use Scenario: Buffered sensor data capture from inertial measurement units (IMUs) and GPS receivers in flight control computers requiring DO-254 compliance. IC Role / Device Role / Timing Role: Stores time-stamped telemetry packets in pipelined mode, with ADS-driven address loading ensuring deterministic 133MHz sampling alignment across multiple analog front-ends. Use Value: 1.7ns address setup time (tSA) and 0.5ns hold time guarantee timing closure in radiation-hardened FPGA designs with 5ps jitter budgets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 18, 133MHz, 3.3V core/I/O, 165-pin TQFP; supports flow-through mode and JTAG; lacks per-port I/O voltage selection. | Requires external level shifters for mixed-voltage systems; suitable where flow-through timing flexibility is prioritized over voltage configurability. | Choose when JTAG debug visibility or variable output latency is required, and 3.3V-only I/O is acceptable. |
| AS7C3256B-133JCIN | 256K × 18, 133MHz, 3.3V core/I/O, 128-pin TQFP; no dual CE, no address counter/repeat, no OPT pin voltage selection. | Lower pin count but reduced feature set; lacks depth expansion capability and burst-addressing support needed for packet buffering. | Choose only for cost-sensitive, single-port-equivalent applications where advanced control features are unused. |
Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 70V3319S133BF uniquely delivers per-port I/O voltage selection and dual chip enables in the same 128-pin footprint - enabling mixed-voltage integration and scalable memory depth without layout changes.
Availability
70V3319S133BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 70V3319S133BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and high-performance computing solutions.
The 70V3319S133BF belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic-latency, multi-processor memory sharing in telecom, test equipment, and real-time control systems.
FAQ
What is the maximum operating frequency of the 70V3319S133BF?
The 70V3319S133BF is rated for 133MHz operation (7.5ns clock cycle time) across the industrial temperature range (–40°C to +85°C). Its pipelined output mode achieves 4.2ns clock-to-data-out (tCD2) at this frequency, making it suitable for systems requiring guaranteed sub-5ns read latency. The device does not support 166MHz operation in the 128-pin TQFP package due to timing margin constraints.
Does the 70V3319S133BF support flow-through output mode?
No, the 70V3319S133BF in the 128-pin TQFP package does not support flow-through output mode. As explicitly stated in the datasheet notes, "PIPE/FT option in PKG128 is not supported due to limitation in pin count. Device is pipelined outputs only on each port." All timing parameters and functional behavior assume fixed pipelined operation with 1-cycle latency.
How is I/O voltage configured on the 70V3319S133BF?
I/O voltage on the 70V3319S133BF is configured per port using the OPTL and OPTR pins. Setting OPTL = VIH (3.3V) selects 3.3V I/O levels for the left port and requires VDDQL = 3.3V; setting OPTL = VIL (0V) selects 2.5V I/O levels and requires VDDQL = 2.5V. The right port operates identically via OPTR and VDDQR. Both ports may be set to the same or different voltages simultaneously.
What is the purpose of the CNTEN and REPEAT signals on the 70V3319S133BF?
CNTENL/CNTENR enable automatic address incrementing on each clock cycle, while REPEATL/REPEATR reset the internal address counter to the last valid address loaded via ADSL/ADSR. This combination supports efficient burst-mode memory access - for example, in packet buffering where sequential addresses are written rapidly, then repeated reads occur from a known starting point without reloading the base address.
Is JTAG debugging supported on the 70V3319S133BF?
No, JTAG is not supported on the 70V3319S133BF in the 128-pin TQFP package. The datasheet explicitly states: "Due to the limited pin count, JTAG is not supported in the PKG128 package." JTAG signals (TCK, TMS, TDI, TDO, TRST) are omitted from this variant's pinout, and the boundary-scan logic is disabled. For JTAG-capable variants, consider the 208-pin fpBGA or 256-pin BGA packages.
70V3319S133BF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3319S133BF FAQ
1.How can I place an order for 70V3319S133BF through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3319S133BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3319S133BF reliable?
The price and inventory of 70V3319S133BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S133BF is usually 5 days.
3.What payment methods are accepted for 70V3319S133BF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3319S133BF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3319S133BF?
70V3319S133BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3319S133BF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3319S133BF?
For technical support, including 70V3319S133BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S133BF requirements.
6.How does Aetrix verify that 70V3319S133BF is sourced from the original manufacturer or authorized distributors?
All 70V3319S133BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S133BF meets industry standards.
7.What is the process for return or replacement of 70V3319S133BF?
All 70V3319S133BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S133BF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3319S133BF part is unused and in its original packaging.
Return procedure for 70V3319S133BF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3319S133BF Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
