Renesas 70V3319S133BF8
- Part No.:
- 70V3319S133BF8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3319S133BF8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3319S133BF8 from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 4.2ns clock-to-data-out in pipelined mode. Designed for real-time inter-processor communication in telecom line cards and packet buffering systems.
For engineers reviewing the 70V3319S133BF8 datasheet, 70V3319S133BF8 pinout, 70V3319S133BF8 application, or 70V3319S133BF8 equivalent, this device requires attention to port-specific VDDQ/OPT configuration, pipelined-only operation in its 128-pin TQFP package, and dual chip enable depth expansion capability without external logic.
Technical Context
The 70V3319S133BF8 implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports-enabling 1.7ns setup and 0.5ns hold times at 133MHz. Its memory array uses true dual-port cells, not pseudo-dual-port or multiplexed architectures, allowing concurrent access without arbitration logic.
It features independent counter-enable and repeat functions per port for burst address generation, dual-cycle deselect (DCD) for pipelined outputs, and separate upper/lower byte enables (UB/LB) supporting 9-bit and 9-bit I/O partitioning. JTAG boundary scan (IEEE 1149.1) is omitted due to pin count constraints in the BF8 (128-pin TQFP) package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18 bits (4.6 Mbit total); supports 18-bit parallel data paths on both ports simultaneously |
| Max Clock Frequency | 133 MHz - enables 6.0 Gbps aggregate bandwidth (133 MHz × 18 bits × 2 ports) |
| Cycle Time (Pipelined) | 7.5 ns - defines minimum clock period for sustained burst reads/writes with 1-cycle latency |
| Access Time (tCD2) | 4.2 ns max - clock-to-valid-data delay in pipelined mode; critical for timing-critical inter-processor handshaking |
| I/O Voltage Support | Selectable 3.3V or 2.5V per port via OPTL/OPTR pins - allows mixed-voltage system interfacing without level shifters |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded networking and base station equipment |
| Power Supply | 3.3V ±150 mV core (VDD); separate VDDQL/VDDQR supplies - decouples I/O noise from core logic |
Pinout & Package
70V3319S133BF8 is housed in a 128-pin Thin Quad Flatpack (TQFP) package measuring 14 mm × 20 mm × 1.4 mm, with 0.5 mm lead pitch. The package supports surface-mount reflow assembly and provides full signal access for dual-port operation, though JTAG and PL/FT mode are disabled due to pin limitations.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock inputs | Edge-triggered clocks for left/right port register staging; all controls and data sampled on rising edge |
| CE0L/CE1L, CE0R/CE1R | Dual chip enables per port | Enable depth expansion: CE0X = active-low, CE1X = active-high; both must be asserted for port activation |
| R/WL / R/WR | Read/write direction control | Active-high write enable; determines data flow direction per port independently |
| OEL / OER | Asynchronous output enable | Tri-states I/O bus immediately (no clock dependency); used for bus sharing and hot-swap isolation |
| A0L–A17L / A0R–A17R | Address inputs | 18-bit address bus per port; A17 is no-connect for this variant - effective address space is 256K (A0–A17) |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional data I/O | 18-bit parallel data path per port; split into upper (I/O9–I/O17) and lower (I/O0–I/O8) bytes via UBL/UBR and LBL/LBR |
| UBL/UBR, LBL/LBR | Byte enable controls | Independent gating of upper/lower 9-bit byte lanes - enables 8-bit or 9-bit peripheral interfacing and bus matching |
| OPTL / OPTR | I/O voltage select | DC-level input: VIH = 3.3V I/O mode, VIL = 2.5V I/O mode; configures VDDQL/VDDQR supply requirement |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cell architecture | Enables zero-wait-state concurrent read/write to identical addresses - eliminates arbitration logic in shared-memory multiprocessing |
| Pipelined-only output mode (BF8 package) | Guarantees deterministic 1-cycle latency; removes flow-through timing variability for predictable pipeline scheduling |
| Dual-cycle deselect (DCD) | Prevents bus contention during rapid chip disable by delaying output disable by one clock cycle - essential for multi-device depth expansion |
| Independent port voltage selection | Allows left port to interface with 3.3V FPGA while right port connects to 2.5V ASIC - eliminates external level translators |
| Counter enable & repeat address function | Generates sequential burst addresses autonomously; REPEAT resets counter to last ADS-loaded address - reduces host CPU overhead in DMA transfers |
| Full synchronous operation with self-timed write | Registers all inputs (address, data, control); write completion is synchronized to clock edge - simplifies timing closure in high-speed PCB layouts |
Applications
| Telecom Line Card Buffering | Real-Time Inter-Processor Communication |
|---|---|
|
Use Scenario: High-throughput packet buffering between ingress and egress ASICs in 10G Ethernet line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acts as a non-blocking, low-latency FIFO buffer with independent read/write ports handling parallel traffic streams. Use Value: 133MHz operation and 4.2ns tCD2 enable sub-10ns inter-port data transfer - critical for maintaining line-rate throughput without packet loss. |
Use Scenario: Shared memory between DSP and ARM processor in radar signal processing subsystems. IC Role / Device Role / Timing Role: Provides coherent, lock-free memory space where DSP writes processed results and ARM reads for display/control. Use Value: True dual-port architecture eliminates software semaphores or hardware arbitration, reducing inter-processor latency to one clock cycle. |
| Industrial PLC Data Exchange | Medical Imaging Frame Buffering |
|
Use Scenario: Real-time I/O data exchange between safety controller and motion control module in Class 1 Div 2 hazardous environments. IC Role / Device Role / Timing Role: Serves as deterministic, jitter-free shared memory with independent clock domains for each controller. Use Value: –40°C to +85°C rating and 3.3V/2.5V I/O flexibility allow direct connection to legacy 2.5V fieldbus controllers and modern 3.3V safety MCUs. |
Use Scenario: Frame storage for ultrasound beamforming engines requiring simultaneous acquisition and rendering pipelines. IC Role / Device Role / Timing Role: Buffers full-resolution image frames (1024×768×16bpp) with concurrent write (acquisition) and read (rendering) access. Use Value: 256K × 18 organization supports 18-bit pixel depth; pipelined 133MHz operation sustains >2.4 GB/s bandwidth needed for real-time 60 fps imaging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 18, 133MHz, 3.3V core/I/O; supports flow-through *and* pipelined modes; 208-pin BGA only | Requires PCB redesign for BGA; offers mode flexibility but lacks OPT-pin voltage selection - fixed 3.3V I/O | Choose when board layout allows BGA and flow-through mode is required for legacy timing compatibility |
| IDT70V3519S133BG | Same family, 256K × 18, 133MHz, but in 208-pin fpBGA; includes JTAG support and PL/FT select | Enables boundary scan testability and configurable output mode; larger footprint and higher cost than TQFP | Choose when JTAG debug visibility or output-mode flexibility outweighs TQFP's cost and assembly advantages |
Compared with CY7C1362BV33-133AXC and IDT70V3519S133BG, the 70V3319S133BF8 uniquely combines industrial temperature range, 128-pin TQFP compactness, and per-port 2.5V/3.3V I/O selection - making it optimal for cost-sensitive, mixed-voltage embedded designs where JTAG and flow-through mode are unnecessary.
Availability
70V3319S133BF8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for 70V3319S133BF8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF power solutions for communications and computing markets.
The 70V33xx family was designed specifically for high-bandwidth, low-latency shared-memory applications in networking equipment, baseband processors, and real-time control systems - emphasizing deterministic timing, dual-port concurrency, and flexible I/O voltage operation.
FAQ
What is the maximum operating frequency of the 70V3319S133BF8?
The 70V3319S133BF8 is rated for 133MHz operation, corresponding to a 7.5ns clock cycle time in pipelined mode. This frequency is guaranteed across the full industrial temperature range (–40°C to +85°C) and applies to both left and right ports independently. The device does not support 166MHz operation - that speed grade is reserved for the 70V3319S166 variants.
Does the 70V3319S133BF8 support flow-through output mode?
No, the 70V3319S133BF8 does not support flow-through output mode. Due to pin count limitations in its 128-pin TQFP (BF8) package, the FT/PIPEL and FT/PIPER pins are unimplemented, and the device operates exclusively in pipelined output mode on both ports. This ensures deterministic 1-cycle latency but removes flow-through timing flexibility.
How is I/O voltage selected on each port of the 70V3319S133BF8?
I/O voltage is selected independently per port using the OPTL and OPTR pins. Driving OPTL to VIH (≥2.0V) configures the left port for 3.3V I/O operation and requires VDDQL = 3.3V; driving it to VIL (≤0.8V) configures 2.5V I/O and requires VDDQL = 2.5V. The same logic applies to OPTR and VDDQR. Both ports may operate at different voltages simultaneously.
What is the purpose of the CNTEN and REPEAT signals on the 70V3319S133BF8?
CNTEN enables the internal address counter on each port; when asserted (VIL), the counter advances on each clock edge regardless of other control signals. REPEAT resets the counter to the last valid address loaded via ADS (Address Strobe). Together, they enable autonomous burst addressing - reducing host processor load during sequential memory accesses such as DMA transfers or frame buffering.
Can the 70V3319S133BF8 be used in depth-expanded memory configurations?
Yes, the 70V3319S133BF8 supports depth expansion using its dual chip enable (CE0X/CE1X) architecture. Two or more devices can share address and data buses while using complementary CE pairs to select individual units - eliminating the need for external decode logic. The dual-cycle deselect (DCD) feature prevents bus contention during rapid switching between devices in pipelined mode.
70V3319S133BF8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3319S133BF8 FAQ
1.How can I place an order for 70V3319S133BF8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3319S133BF8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3319S133BF8 reliable?
The price and inventory of 70V3319S133BF8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S133BF8 is usually 5 days.
3.What payment methods are accepted for 70V3319S133BF8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3319S133BF8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3319S133BF8?
70V3319S133BF8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3319S133BF8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3319S133BF8?
For technical support, including 70V3319S133BF8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S133BF8 requirements.
6.How does Aetrix verify that 70V3319S133BF8 is sourced from the original manufacturer or authorized distributors?
All 70V3319S133BF8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S133BF8 meets industry standards.
7.What is the process for return or replacement of 70V3319S133BF8?
All 70V3319S133BF8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S133BF8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3319S133BF8 part is unused and in its original packaging.
Return procedure for 70V3319S133BF8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3319S133BF8 Tags

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M24C02-WMN6TP
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