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Renesas 70V3319S166BC

Part No.:
70V3319S166BC
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V3319S166BC.pdf
Description:
IC SRAM 4.5MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,971

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Product details

Overview

70V3319S166BC from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 6Gbps aggregate bandwidth, supports selectable 3.3V or 2.5V I/O interfaces per port, and features pipelined output mode only in its 128-pin TQFP package. It is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70V3319S166BC datasheet, 70V3319S166BC pinout, 70V3319S166BC application, or 70V3319S166BC equivalent, key selection criteria include guaranteed 3.6ns clock-to-data-out timing at 166MHz, dual chip enables for seamless depth expansion, LVTTL-compatible 3.3V core supply with independent 2.5V/3.3V I/O voltage selection per port, and industrial-grade operation up to +85°C.

Technical Context

This device implements full synchronous operation on both ports with registered address, data, and control inputs-enabling minimal 1.7ns setup and 0.5ns hold times at 166MHz. Its self-timed write architecture ensures fast cycle time without external wait-state generation.

The memory array uses true dual-port cells, allowing concurrent access without arbitration logic. The 128-pin TQFP variant omits JTAG and PL/FT select functionality due to pin count constraints, fixing pipelined output mode and disabling boundary-scan capability.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 18 bits (4.5 Mbit total); supports independent 18-bit bidirectional data flow per port
Max Clock Frequency166 MHz (6 ns cycle time); enables 6 Gbps aggregate bandwidth across both ports
Access Time3.6 ns clock-to-data-out (pipelined mode); meets tight timing budgets in high-speed packet processors
I/O Voltage SupportSelectable 3.3 V or 2.5 V per port via OPTL/OPTR pins; allows mixed-voltage system interfacing
Operating TemperatureCommercial grade: 0°C to +70°C; validated for stable operation in telecom and networking equipment
Power Supply3.3 V ±150 mV core (VDD); separate VDDQL/VDDQR rails for I/O domains with independent voltage selection
Package128-pin TQFP (14 mm × 20 mm); no JTAG or flow-through mode support due to pin limitation

Pinout & Package

70V3319S166BC is housed in a 128-pin Thin Quad Flatpack (TQFP) package with 0.5 mm pitch, body size 14 mm × 20 mm × 1.4 mm. All VDD pins require connection to 3.3 V; VDDQL and VDDQR must match OPTL/OPTR logic levels (3.3 V if VIH, 2.5 V if VIL). JTAG and FT/PIPE select are not implemented in this package variant.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort clock inputSynchronous edge-triggered timing reference for all registered inputs/outputs on respective port
CE0L/CE1L, CE0R/CE1RDual chip enable inputsEnable depth expansion without external logic; CE0X = VIL & CE1X = VIH activates port X
R/WL / R/WRRead/write controlActive-high synchronous signal determining direction of data transfer on each port
OEL / OEROutput enableAsynchronous control enabling/disabling output drivers; independent of clock edge
UBL/LBL, UBR/LBRByte enable controlsIndependent upper (I/O9–I/O17) and lower (I/O0–I/O8) byte masking per port
A0L–A17L, A0R–A17RAddress inputs18-bit address bus per port; A17 is no-connect for this variant per datasheet note
I/O0L–I/O17L, I/O0R–I/O17RBidirectional data bus18-bit multiplexed data path per port; supports unidirectional burst transfers
OPTL / OPTRI/O voltage selectDC-level input setting VDDQX rail voltage (VIH → 3.3 V, VIL → 2.5 V) for corresponding port

Key Features

FeatureDesign Value
True dual-port memory cellsEnables concurrent read/write access to identical addresses from left and right ports without arbitration delay
Dual chip enables (CE0/CE1)Allows stacking multiple devices for increased depth without external decode logic or glue components
Separate byte controls (UB/LB)Permits partial-word writes and bus-matching compatibility with 8-bit or 16-bit peripheral interfaces
Counter enable & repeat functionsSupports auto-incrementing address sequences and rapid re-access to last loaded address for burst transfers
Self-timed write architectureEliminates need for external write-strobe timing control; reduces system-level timing complexity

Applications

Telecom Line Card BufferingNetwork Packet Processor Cache

Use Scenario: Storing and forwarding variable-length Ethernet frames between ingress and egress ASICs in carrier-grade switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency shared buffer with left port accepting incoming packets and right port feeding outgoing scheduler.

Use Value: Simultaneous access eliminates arbitration stalls, enabling deterministic 166MHz throughput for 10Gbps+ line rates.

Use Scenario: Holding header lookup results and temporary packet metadata during deep-pipeline forwarding decisions.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory synchronized to packet processor clocks on both read and write sides.

Use Value: 3.6ns tCD2 timing ensures metadata availability within one clock cycle of address assertion, reducing pipeline bubbles.

Digital Signal Processing Co-ProcessorReal-Time Industrial Controller

Use Scenario: Exchanging coefficient tables and intermediate FFT results between DSP core and FPGA-based preprocessor.

IC Role / Device Role / Timing Role: Synchronous dual-port interface bridging heterogeneous processing elements with independent clock domains.

Use Value: Independent 2.5V/3.3V I/O rails allow direct connection to both 3.3V FPGA I/O banks and 2.5V DSP data buses.

Use Scenario: Storing motion control trajectory points and sensor fusion outputs in servo drive firmware with hard real-time deadlines.

IC Role / Device Role / Timing Role: Deterministic-access memory for time-critical PLC scan cycles requiring sub-10ns address-to-data latency.

Use Value: Guaranteed 6ns cycle time and 1.7ns setup time meet IEC 61131-3 cycle time requirements for 10kHz motion loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-166AXC256K × 18, 166MHz, 3.3V core, but requires 3.3V I/O only; no 2.5V option per portLacks independent I/O voltage selection-unsuitable for mixed-voltage systems with 2.5V peripheralsChoose when system uses uniform 3.3V signaling and JTAG debug capability is required (supported in 208-pin BGA)
AS7C3256B-166JC256K × 18, 166MHz, 3.3V core/I/O, but asynchronous OE and no counter/repeat featuresNo address counter or repeat function-requires external logic for burst addressingChoose for cost-sensitive designs where burst address generation is handled by controller, not memory

Compared with CY7C1362BV33-166AXC and AS7C3256B-166JC, the 70V3319S166BC uniquely supports per-port 2.5V/3.3V I/O selection and integrated address counter with repeat-reducing FPGA logic utilization and enabling mixed-voltage interoperability without level shifters.

Availability

70V3319S166BC is available at Aetrix Electronics and suitable for telecom infrastructure, network packet processing, digital signal co-processing, and real-time industrial control applications requiring stable component supply and long-term manufacturability.

Supply support for 70V3319S166BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70V33xx family was designed specifically for high-bandwidth, low-latency dual-access memory applications in telecom line cards, packet processors, and real-time control systems demanding deterministic timing and flexible I/O voltage support.

FAQ

What is the maximum operating frequency of the 70V3319S166BC?

The 70V3319S166BC is rated for 166 MHz operation, achieving a 6 ns clock cycle time. This specification applies to commercial temperature range (0°C to +70°C) operation and is validated with pipelined output mode, which is the only supported mode in its 128-pin TQFP package. The device delivers 6 Gbps aggregate bandwidth across both ports at this rate.

Does the 70V3319S166BC support JTAG boundary-scan testing?

No, the 70V3319S166BC does not support JTAG boundary-scan. As explicitly stated in the datasheet notes for the PKG128 (128-pin TQFP) package, JTAG functionality-including TDI, TDO, TCK, TMS, and TRST pins-is omitted due to insufficient pin count. JTAG is only available on the 208-pin and 256-pin BGA variants of the 70V3319/99 family.

Can the left and right ports of the 70V3319S166BC operate at different I/O voltages?

Yes, the 70V3319S166BC supports independent I/O voltage selection per port. OPTL and OPTR pins configure VDDQL and VDDQR independently: VIH (3.3 V) selects 3.3 V I/O levels, while VIL (0 V) selects 2.5 V I/O levels. This allows the left port to interface with 3.3 V logic while the right port connects to 2.5 V peripherals-enabling mixed-voltage system integration without external level shifters.

What is the purpose of the CNTEN and REPEAT signals on the 70V3319S166BC?

The CNTEN (counter enable) and REPEAT signals provide hardware-accelerated address sequencing. When CNTEN is asserted, the internal address counter advances on each clock edge, eliminating software overhead for burst transfers. REPEAT resets the counter to the last valid address loaded via ADS, enabling rapid re-access to a known location-critical for FIFO-like behavior or repeated table lookups in real-time systems using the 70V3319S166BC.

Is the 70V3319S166BC pin-compatible with other members of the 70V3319/99 family?

No, the 70V3319S166BC is not pin-compatible with other package variants of the 70V3319/99 family. Its 128-pin TQFP footprint differs electrically and physically from the 208-pin fpBGA and 256-pin BGA packages. Key differences include missing JTAG pins, absence of FT/PIPE select functionality, and NC status for A17 on both ports-making direct PCB replacement impossible without layout revision.

70V3319S166BC Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V3319S166BC FAQ

1.How can I place an order for 70V3319S166BC through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3319S166BC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3319S166BC reliable?

The price and inventory of 70V3319S166BC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S166BC is usually 5 days.

3.What payment methods are accepted for 70V3319S166BC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3319S166BC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3319S166BC?

70V3319S166BC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3319S166BC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3319S166BC?

For technical support, including 70V3319S166BC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S166BC requirements.

6.How does Aetrix verify that 70V3319S166BC is sourced from the original manufacturer or authorized distributors?

All 70V3319S166BC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S166BC meets industry standards.

7.What is the process for return or replacement of 70V3319S166BC?

All 70V3319S166BC units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S166BC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3319S166BC part is unused and in its original packaging.

Return procedure for 70V3319S166BC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70V3319S166BC Tags

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