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Renesas 70V3319S166BC8

Part No.:
70V3319S166BC8
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V3319S166BC8.pdf
Description:
IC SRAM 4.5MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,397

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Product details

Overview

70V3319S166BC8 from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 6Gbps aggregate bandwidth, supports selectable 3.3V or 2.5V I/O interfaces per port, and features pipelined output mode only (no flow-through option in TQFP package). It is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70V3319S166BC8 datasheet, 70V3319S166BC8 pinout, 70V3319S166BC8 application, or 70V3319S166BC8 equivalent, key selection criteria include guaranteed 166MHz operation in commercial grade, 128-pin TQFP packaging with no JTAG or PL/FT option, dual chip enables for depth expansion, and independent VDDQ voltage selection per port via OPT pins.

Technical Context

This device implements fully synchronous dual-port operation with clocked address, data, and control registers on both ports-enabling 1.7ns setup and 0.5ns hold times at 166MHz. It uses self-timed write logic to minimize cycle time and includes dedicated address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat (REPEATL/REPEATR) functions for burst address generation.

The 70V3319S166BC8 integrates separate upper/lower byte enables (UBL/LBL and UBR/LBR) for multiplexed bus compatibility, dual-cycle deselect (DCD) support in pipelined mode, and automatic power-down controlled independently per port via CE0/CE1. Its core runs at 3.3V ±150mV while I/O voltage per port is configurable to either 3.3V or 2.5V via OPTL/OPTR pins and corresponding VDDQL/VDDQR supplies.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256K × 18 bits (4.5 Mbit total); supports full parallel access on both ports without arbitration logic
Max Clock Frequency 166MHz (6ns cycle time); validated for commercial temperature range only (0°C to +70°C)
Access Time 3.6ns clock-to-data-out (tCD2) in pipelined mode; enables tight timing closure in high-speed FPGA interconnects
I/O Voltage Support Selectable 3.3V or 2.5V per port via OPTL/OPTR pins; allows mixed-voltage system integration without level shifters
Package 128-pin TQFP (PKG128); 14mm × 20mm body; no JTAG or flow-through mode due to pin count limitation
Power Supply Single 3.3V ±150mV core (VDD); independent 3.3V/2.5V I/O supplies (VDDQL/VDDQR) per port
Operating Temperature Commercial grade only: 0°C to +70°C; industrial-grade variant (133MHz) is 70V3319S133BC8, not this part

Pinout & Package

70V3319S166BC8 is housed in a 128-pin Thin Quad Flatpack (TQFP) package with 0.5mm pitch, 14mm × 20mm footprint, and exposed thermal pad (not electrically connected). All VDD pins require 3.3V supply; VDDQL/VDDQR must match OPTL/OPTR logic levels (3.3V if VIH, 2.5V if VIL).

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port clock inputs Synchronous edge-triggered clocks for left/right ports; all control/data/address registers sample on rising edge
CE0L/CE1L, CE0R/CE1R Dual chip enables per port Enable depth expansion without external logic: CE0X = VIL & CE1X = VIH activates port X
R/WL / R/WR Read/write direction control Active-high for write, active-low for read; controls internal data path direction per port
OEL / OER Output enable (asynchronous) Asynchronous control of output drivers; overrides clocked behavior to force high-Z state
UBL/LBL, UBR/LBR Upper/lower byte enables Independent 9-bit (I/O9–I/O17) and 9-bit (I/O0–I/O8) gating per port for bus matching
A0L–A17L, A0R–A17R Address inputs 18-bit address buses; A17L/A17R are no-connect (NC) per datasheet note for this family
I/O0L–I/O17L, I/O0R–I/O17R Bidirectional data I/O 18-bit parallel data interface per port; direction determined by R/WX and OE states
OPTL / OPTR I/O voltage select DC input: VIH selects 3.3V I/O levels (VDDQX = 3.3V), VIL selects 2.5V (VDDQX = 2.5V)

Key Features

Feature Design Value
True dual-port memory cells Enables concurrent, collision-free access to identical addresses from left and right ports-critical for producer-consumer FIFOs
Pipelined output mode only (TQFP) Eliminates flow-through timing path; guarantees deterministic 3.6ns tCD2 latency-simplifies timing analysis in synchronous systems
Dual-cycle deselect (DCD) Prevents metastability during rapid port disable; ensures clean high-Z transition after two clock cycles in pipelined mode
Independent per-port I/O voltage Allows one port to interface with 3.3V FPGAs while the other connects to 2.5V ASICs-no external level translation required
Address counter with REPEAT/CNTEN Reduces address bus overhead in burst transfers: CNTEN enables auto-increment; REPEAT reloads last ADS-loaded address

Applications

Telecom Line Card Buffering FPGA Co-Processor Memory

Use Scenario: Real-time packet buffering between line interface units and switching fabric in OC-192/STM-64 routers.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared memory between ingress and egress processing engines.

Use Value: 166MHz operation sustains 6Gbps bidirectional throughput; pipelined outputs ensure deterministic latency for jitter-sensitive traffic.

Use Scenario: High-bandwidth data exchange between Xilinx Virtex UltraScale+ FPGA and external DSP co-processor.

IC Role / Device Role / Timing Role: Serves as low-latency scratchpad memory with independent clock domains for FPGA and DSP subsystems.

Use Value: Separate 3.3V/2.5V I/O rails eliminate level shifters; dual chip enables simplify multi-chip memory expansion.

Industrial Motion Controller FIFO Medical Imaging Data Pipeline

Use Scenario: Interpolated position command buffering between real-time motion controller CPU and servo drive PWM modules.

IC Role / Device Role / Timing Role: Acts as synchronized dual-clock FIFO-left port accepts commands from CPU, right port feeds PWM sequencer.

Use Value: 1.7ns address setup time meets tight timing budgets; asynchronous OE allows dynamic output gating during fault conditions.

Use Scenario: Raw sensor data aggregation from parallel CT detector channels before GPU-based reconstruction.

IC Role / Device Role / Timing Role: Provides burst-mode write capture (left port) and streaming readout (right port) with no arbitration delay.

Use Value: True dual-port architecture eliminates read-modify-write bottlenecks; 256K × 18 capacity accommodates full frame buffers at 16-bit depth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV18 256K × 18, 166MHz, 3.3V core + 3.3V/2.5V I/O; supports both pipelined and flow-through modes in 208-pin BGA Requires PCB redesign (BGA vs TQFP); adds flow-through option but lacks REPEAT/CNTEN counter features Choose when board layout allows BGA and flow-through timing flexibility is needed
IDT70V3519S133BG Same family, 133MHz industrial-grade version in 208-pin fpBGA; supports JTAG and both output modes Lower max frequency (133MHz), wider temp range (−40°C to +85°C), incompatible package and pinout Choose for extended temperature operation where 133MHz bandwidth suffices and BGA is acceptable

Compared with CY7C1362BV18 and IDT70V3519S133BG, the 70V3319S166BC8 uniquely delivers 166MHz commercial-grade performance in a compact 128-pin TQFP with integrated address counter logic-making it optimal for space-constrained, high-throughput embedded designs where flow-through mode is unnecessary.

Availability

70V3319S166BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA acceleration, and industrial motion control applications requiring stable component supply and long-term production continuity.

Supply support for 70V3319S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions for communications and computing markets.

The 70V33xx family was designed specifically for ultra-low-latency, high-bandwidth dual-port memory applications in networking equipment, test instrumentation, and real-time control systems demanding deterministic access timing.

FAQ

What is the maximum operating frequency of the 70V3319S166BC8?

The 70V3319S166BC8 is rated for 166MHz operation (6ns clock cycle time) in the commercial temperature range (0°C to +70°C). This is confirmed by AC Electrical Characteristics Table 11 in the datasheet, which specifies tCYC2 = 6ns min for pipelined mode. Industrial-grade variants like 70V3319S133BC8 operate up to 133MHz across −40°C to +85°C.

Does the 70V3319S166BC8 support flow-through output mode?

No, the 70V3319S166BC8 does not support flow-through output mode. As explicitly stated in the datasheet (page 4, Note 8), "PIPE/FT option in PKG128 is not supported due to limitation in pin count. Device is pipelined outputs only on each port." The 128-pin TQFP package lacks sufficient pins to implement the FT/PIPE control signal routing required for mode selection.

Can the left and right ports of the 70V3319S166BC8 operate at different I/O voltages?

Yes, the 70V3319S166BC8 supports independent I/O voltage selection per port. OPTL sets VDDQL (left port I/O supply) to 3.3V (VIH) or 2.5V (VIL), and OPTR sets VDDQR (right port I/O supply) identically but independently. This allows mixed-voltage interfacing-for example, left port at 3.3V to an FPGA and right port at 2.5V to an ASIC-without external level shifters.

What is the function of the REPEAT and CNTEN pins on the 70V3319S166BC8?

REPEATL/REPEATR and CNTENL/CNTENR enable hardware-addressed burst operations. When CNTENX = VIL, the internal address counter increments on each CLKX rising edge. When REPEATX is asserted, the counter resets to the last valid address loaded via ADSX. This eliminates software overhead for sequential memory access in applications like video frame buffering or packet payload streaming.

Is JTAG debugging supported on the 70V3319S166BC8?

No, JTAG is not supported on the 70V3319S166BC8. As noted in the datasheet (page 4, Note 9): "Due to the limited pin count, JTAG is not supported in the PKG128 package." The 128-pin TQFP lacks dedicated TCK, TMS, TDI, TDO, and TRST pins required for IEEE 1149.1 compliance. JTAG is available only on larger packages like the 208-pin fpBGA (e.g., 70V3319S166BF) and 256-pin BGA variants.

70V3319S166BC8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V3319S166BC8 FAQ

1.How can I place an order for 70V3319S166BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3319S166BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3319S166BC8 reliable?

The price and inventory of 70V3319S166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S166BC8 is usually 5 days.

3.What payment methods are accepted for 70V3319S166BC8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3319S166BC8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3319S166BC8?

70V3319S166BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3319S166BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3319S166BC8?

For technical support, including 70V3319S166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S166BC8 requirements.

6.How does Aetrix verify that 70V3319S166BC8 is sourced from the original manufacturer or authorized distributors?

All 70V3319S166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S166BC8 meets industry standards.

7.What is the process for return or replacement of 70V3319S166BC8?

All 70V3319S166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S166BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3319S166BC8 part is unused and in its original packaging.

Return procedure for 70V3319S166BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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