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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70V3319S166BF

Name: 70V3319S166BF
Brand: Renesas
SKU: 70V3319S166BF
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70V3319S166BF

Manufacturer:: Renesas

Category:: Memory

Package:: 208-LFBGA

Datasheet:: 70V3319S166BF.pdf

Description:: IC SRAM 4.5MBIT PAR 208CABGA

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Product details

Overview

70V3319S166BF from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 3.6ns clock-to-data-out in pipelined mode, supports selectable 3.3V or 2.5V I/O interfaces per port, and targets real-time packet buffering in telecom line cards and FPGA co-processor memory subsystems.

For engineers reviewing the 70V3319S166BF datasheet, 70V3319S166BF pinout, 70V3319S166BF application, or 70V3319S166BF equivalent, this device requires attention to port-specific OPT/VDDQ configuration, pipelined-only operation in its 128-pin TQFP package, CE0/CE1 dual-chip-enable depth expansion capability, and industrial-grade timing validation for -40°C to +85°C operation at 133MHz.

Technical Context

The 70V3319S166BF implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports-enabling minimal 1.7ns setup and 0.5ns hold times at 166MHz. Its memory array uses true dual-port cells, not pseudo-dual-port or multiplexed architectures, allowing concurrent access without arbitration logic.

It features independent counter-enable and repeat functionality per port for burst address generation, dual-cycle deselect (DCD) support in pipelined mode, and JTAG boundary-scan compliance (IEEE 1149.1)-though JTAG is omitted in the 128-pin TQFP variant due to pin count constraints.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 18 bits (4.5 Mbit total); enables 18-bit parallel data paths per port without external width expansion
Max Clock Frequency	166 MHz (commercial grade only); defines 6 ns minimum clock cycle time for full-bandwidth operation
Access Time (tCD2)	3.6 ns max (pipelined mode); determines earliest valid data output after clock edge-critical for tight inter-port timing
I/O Voltage Support	Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins; allows mixed-voltage system interfacing without level shifters
Operating Temperature	-40°C to +85°C (industrial grade at 133 MHz); validated for deployment in carrier-grade networking equipment
Power Supply	Core: 3.3 V ±150 mV (VDD); I/O: independently configurable 3.3 V or 2.5 V (VDDQL/VDDQR); decoupling must match per-port rail
Package	128-pin TQFP (PKG128); 14 mm × 20 mm body; no JTAG or PL/FT mode support due to pin limitation

Pinout & Package

70V3319S166BF is housed in a 128-pin Thin Quad Flatpack (TQFP) package with 0.5 mm lead pitch and exposed thermal pad. All VDD pins require 3.3 V supply; VDDQL/VDDQR must match OPTL/OPTR logic levels (3.3 V if OPT = VIH, 2.5 V if OPT = VIL). Pin functions are strictly asymmetric: left-port signals (e.g., CLKL, A0L–A17L, I/O0L–I/O17L) and right-port signals (CLKR, A0R–A17R, I/O0R–I/O17R) occupy dedicated physical pins with no shared or bidirectional assignments.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port-synchronous clock input	Registers all address/data/control inputs on rising edge; defines timing domain for each port independently
A0L–A17L / A0R–A17R	Address inputs	18-bit address bus per port; A17L/A17R are no-connect (NC) per datasheet note-only 17 address bits used for 256K depth
I/O0L–I/O17L / I/O0R–I/O17R	Bidirectional data I/O	18-bit parallel data path per port; byte enables (UBL/LBL, UBR/LBR) allow 9-bit granularity writes without disturbing adjacent bytes
CE0L/CE1L / CE0R/CE1R	Dual chip enable inputs	Enable/disable port operation; CE0X = L and CE1X = H activates port X-supports depth expansion with no external logic
R/WL / R/WR	Read/write control	Active-high write enable; when low, port performs read; synchronous to respective clock and subject to tSW/tHW timing
OEL / OER	Output enable	Asynchronous control; drives I/O bus to high-impedance when high-enables bus sharing without timing dependency on clock
OPTL / OPTR	I/O voltage select	DC-level input: VIH selects 3.3 V I/O operation (VDDQ = 3.3 V), VIL selects 2.5 V (VDDQ = 2.5 V); sets interface voltage for entire port
UBL/LBL / UBR/LBR	Byte enable controls	Independent upper (I/O9–I/O17) and lower (I/O0–I/O8) byte masking; enables partial-word writes while preserving other bytes

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent, collision-free read/write access to identical addresses from left and right ports-eliminates arbitration overhead in real-time systems
Pipelined output mode only (PKG128)	Guarantees deterministic 3.6 ns tCD2 latency; removes flow-through mode variability but simplifies timing closure in 166 MHz designs
Dual chip enables (CE0/CE1)	Allows seamless depth expansion across multiple devices using only CE signals-no address decoding logic required for stacked memory configurations
Per-port I/O voltage selection (3.3 V / 2.5 V)	Enables direct interfacing with mixed-voltage FPGAs or ASICs (e.g., 3.3 V left port to legacy controller, 2.5 V right port to modern SerDes PHY)
Counter enable & repeat address generation	Reduces external address counter logic; REPEATL/REPEATR reload last ADS-loaded address-ideal for circular buffer or FIFO pointer management

Applications

Telecom Line Card Buffering	FPGA Co-Processor Memory
Use Scenario: Storing and forwarding variable-length Ethernet or SONET frames between ingress and egress MACs in carrier-class switches. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency, non-blocking frame buffer-left port accepts incoming packets synchronized to line-rate clock, right port services outgoing scheduler. Use Value: Simultaneous access eliminates pipeline stalls; 166 MHz bandwidth sustains >2.4 Gbps aggregate throughput across both ports.	Use Scenario: Providing low-latency, high-bandwidth scratchpad memory between a Xilinx Virtex FPGA fabric and an external DSP core in radar signal processing. IC Role / Device Role / Timing Role: Offloads FPGA block RAM congestion by serving as external, pipelined memory with deterministic 3.6 ns read latency per port. Use Value: Enables real-time FFT windowing and beamforming with sub-10 ns inter-port data handoff-critical for pulse-Doppler timing budgets.
Industrial Motion Controller	Medical Imaging Data Pipeline
Use Scenario: Holding interpolated position commands and encoder feedback in multi-axis CNC controllers requiring jitter-free servo loop execution. IC Role / Device Role / Timing Role: Left port receives motion profile updates from host CPU; right port feeds interpolated trajectory points to PWM generator at 100 kHz update rate. Use Value: Deterministic 6 ns cycle time ensures <100 ns command-to-output jitter-meeting SIL-3 functional safety timing constraints.	Use Scenario: Buffering raw CT or MRI sensor data between analog front-end ADCs and GPU-accelerated reconstruction engines. IC Role / Device Role / Timing Role: Acts as ping-pong buffer: left port captures streaming 16-bit pixel data at 80 MSPS; right port streams bursts to PCIe DMA engine. Use Value: 256K × 18 capacity holds >4.5 million pixels per buffer; 3.6 ns tCD2 enables pixel-rate readout without backpressure.

Telecom Line Card Buffering

FPGA Co-Processor Memory

Use Scenario: Storing and forwarding variable-length Ethernet or SONET frames between ingress and egress MACs in carrier-class switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency, non-blocking frame buffer-left port accepts incoming packets synchronized to line-rate clock, right port services outgoing scheduler.

Use Value: Simultaneous access eliminates pipeline stalls; 166 MHz bandwidth sustains >2.4 Gbps aggregate throughput across both ports.

Use Scenario: Providing low-latency, high-bandwidth scratchpad memory between a Xilinx Virtex FPGA fabric and an external DSP core in radar signal processing.

IC Role / Device Role / Timing Role: Offloads FPGA block RAM congestion by serving as external, pipelined memory with deterministic 3.6 ns read latency per port.

Use Value: Enables real-time FFT windowing and beamforming with sub-10 ns inter-port data handoff-critical for pulse-Doppler timing budgets.

Industrial Motion Controller

Medical Imaging Data Pipeline

Use Scenario: Holding interpolated position commands and encoder feedback in multi-axis CNC controllers requiring jitter-free servo loop execution.

IC Role / Device Role / Timing Role: Left port receives motion profile updates from host CPU; right port feeds interpolated trajectory points to PWM generator at 100 kHz update rate.

Use Value: Deterministic 6 ns cycle time ensures <100 ns command-to-output jitter-meeting SIL-3 functional safety timing constraints.

Use Scenario: Buffering raw CT or MRI sensor data between analog front-end ADCs and GPU-accelerated reconstruction engines.

IC Role / Device Role / Timing Role: Acts as ping-pong buffer: left port captures streaming 16-bit pixel data at 80 MSPS; right port streams bursts to PCIe DMA engine.

Use Value: 256K × 18 capacity holds >4.5 million pixels per buffer; 3.6 ns tCD2 enables pixel-rate readout without backpressure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166AXC	256K × 18, 166 MHz, 3.3 V core/I/O; supports both pipelined and flow-through modes; available in 208-pin BGA only	Requires PCB redesign for BGA footprint; lacks per-port voltage selection-both ports fixed at 3.3 V	Choose when flow-through mode is required or when BGA packaging is already standardized in the platform
IDT70V27L15PF8	128K × 18, 150 MHz, 3.3 V; supports JTAG in 128-pin TQFP; no OPT pin-fixed 3.3 V I/O	Lower density and speed; suitable for cost-sensitive designs where 128K is sufficient and JTAG debug is mandatory	Choose when JTAG boundary-scan visibility is required on the 128-pin footprint and 150 MHz timing meets system requirements

Compared with CY7C1362BV33-166AXC and IDT70V27L15PF8, the 70V3319S166BF uniquely combines 166 MHz performance in a 128-pin TQFP with per-port 2.5 V/3.3 V I/O flexibility-making it optimal for mixed-voltage upgrades of legacy TQFP-based systems without layout change.

Availability

70V3319S166BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial temperature compliance.

Supply support for 70V3319S166BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing markets.

The 70V3319S166BF belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic, low-latency memory access in real-time packet processing, digital signal co-processing, and industrial control applications.

FAQ

What is the maximum operating frequency of the 70V3319S166BF?

The 70V3319S166BF is rated for 166 MHz operation in commercial temperature range (0°C to +70°C), delivering a 6 ns clock cycle time. At industrial temperatures (-40°C to +85°C), its validated maximum frequency is 133 MHz (7.5 ns cycle time), as confirmed in the AC Electrical Characteristics table (Table 11) and Recommended Operating Conditions (Table 4).

Does the 70V3319S166BF support flow-through output mode?

No-the 70V3319S166BF in the 128-pin TQFP package (PKG128) supports pipelined output mode only. The datasheet explicitly states "Due to limited pin count PL/FT option is not supported on the 128-pin TQFP package. Device is pipelined outputs only on each port" (page 1, Features section) and reiterates this in Pin Configuration notes (page 4, Note 8).

How is I/O voltage selected for each port on the 70V3319S166BF?

I/O voltage is set per port using the OPTL and OPTR pins: applying VIH (≥2.0 V) to OPTL configures the left port for 3.3 V I/O operation (requiring VDDQL = 3.3 V), while VIL (≤0.8 V) configures it for 2.5 V (requiring VDDQL = 2.5 V). The right port follows the same rule via OPTR and VDDQR, and both ports may operate at different voltages simultaneously.

What is the purpose of the CNTENL and CNTENR pins on the 70V3319S166BF?

CNTENL and CNTENR enable the internal address counter for their respective ports. When asserted low on the rising edge of CLKL or CLKR, the counter advances to the next sequential address-allowing automatic burst addressing without external counter logic. This feature is used with ADSL/ADSR and REPEATL/REPEATR for circular buffer or FIFO implementations.

Is JTAG boundary-scan supported on the 70V3319S166BF in its 128-pin TQFP package?

No-JTAG is not supported on the 70V3319S166BF in the 128-pin TQFP package. The datasheet confirms this in two locations: under "Features" ("Due to limited pin count, JTAG is not supported on the 128-pin TQFP package") and in Pin Configuration notes (page 4, Note 9), citing insufficient pins to implement the IEEE 1149.1 TAP controller interface.

70V3319S166BF Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 208-LFBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 4.5Mbit

Memory Organization:: 256K x 18

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 3.15V ~ 3.45V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 208-CABGA (15x15)

70V3319S166BF FAQ

1.How can I place an order for 70V3319S166BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3319S166BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3319S166BF reliable?

The price and inventory of 70V3319S166BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S166BF is usually 5 days.

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70V3319S166BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3319S166BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3319S166BF?

For technical support, including 70V3319S166BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S166BF requirements.

6.How does Aetrix verify that 70V3319S166BF is sourced from the original manufacturer or authorized distributors?

All 70V3319S166BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S166BF meets industry standards.

7.What is the process for return or replacement of 70V3319S166BF?

All 70V3319S166BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S166BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3319S166BF part is unused and in its original packaging.

Return procedure for 70V3319S166BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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