My Inquiry
My Account
Renesas 70V3319S166BFG8
- Part No.:
- 70V3319S166BFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3319S166BFG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 208CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,596
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70V3319S166BFG8 from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 6Gbps aggregate bandwidth, supports selectable 3.3V or 2.5V I/O voltage per port, and is rated for commercial temperature range (0°C to +70°C) in a 128-pin TQFP package.
For engineers reviewing the 70V3319S166BFG8 datasheet, 70V3319S166BFG8 pinout, 70V3319S166BFG8 application, or 70V3319S166BFG8 equivalent, key selection criteria include pipelined output mode (fixed on this package), dual chip enable depth expansion capability, LVTTL-compatible 3.3V core supply with independent port-level I/O voltage control, and JTAG omission due to pin count constraints.
Technical Context
This device implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports-enabling minimal 1.7ns setup and 0.5ns hold times at 166MHz. Each port features independent clock (CLKL/CLKR), chip enables (CE0/CE1), byte enables (UBL/LBL and UBR/LBR), and read/write control (R/WL/R/WR), supporting concurrent memory transactions without arbitration logic.
The internal architecture includes dual address counters with CNTEN/REPEAT/ADSL controls per port, self-timed write cycles for fast access, and separate VDDQ power domains allowing mixed-voltage interfacing (e.g., 3.3V left port, 2.5V right port). Pipelined output mode is fixed-flow-through is not supported in the 128-pin TQFP variant per datasheet note.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256K × 18 bits (4.6 Mbit total); supports 18-bit parallel data paths on both ports simultaneously |
| Max Clock Frequency | 166 MHz; enables 6 ns minimum clock cycle time for high-throughput buffering applications |
| Access Time | 3.6 ns (max) clock-to-data-out in pipelined mode; critical for meeting tight timing budgets in real-time systems |
| I/O Voltage Support | Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins; allows direct interfacing with mixed-voltage ASIC/FPGA designs |
| Operating Temperature | Commercial grade: 0°C to +70°C; validated for stable operation in office and lab environments |
| Core Supply | 3.3 V ±150 mV (VDD); single-core rail simplifies power delivery while maintaining signal integrity |
| Package | 128-pin TQFP (PKG128); 14 mm × 20 mm body size with 0.5 mm lead pitch; compatible with standard SMT reflow |
Pinout & Package
128-pin Thin Quad Flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm lead pitch. Pinout conforms to IDT's PKG128 configuration with dedicated left/right port signals, dual VDD/VSS rails, and no JTAG support due to pin count limitation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-specific clock input | Synchronous edge-triggered timing reference for all registered inputs/outputs on respective port |
| CE0L/CE1L / CE0R/CE1R | Dual chip enables per port | Enable depth expansion without external logic; CE0X = active-low, CE1X = active-high decode |
| R/WL / R/WR | Read/write direction control | Active-high write enable; determines data flow direction during clocked cycle |
| OEL / OER | Asynchronous output enable | Tri-states I/O bus independently of clock; enables shared-bus contention management |
| UBL/LBL / UBR/LBR | Byte-level write enable | Independent 9-bit upper (I/O9–I/O17) and 9-bit lower (I/O0–I/O8) write masking per port |
| A0L–A17L / A0R–A17R | Address inputs | 18-bit address bus per port; A17 is no-connect for this variant per datasheet note |
| I/O0L–I/O17L / I/O0R–I/O17R | Bidirectional data bus | 18-bit multiplexed data path per port; supports burst transfers with byte-enable granularity |
| OPTL / OPTR | I/O voltage select | DC-level control: VIH = 3.3 V I/O, VIL = 2.5 V I/O; sets VDDQL/VDDQR operating voltage |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables zero-contention concurrent access to identical addresses-eliminates arbitration logic in FPGA co-processor buffers |
| Pipelined output mode (fixed) | Guarantees deterministic 3.6 ns tCD2 latency; essential for predictable pipeline stage alignment in telecom packet engines |
| Dual chip enables per port | Supports seamless depth expansion up to 512K×18 or wider data widths using multiple devices without glue logic |
| Separate VDDQ per port | Allows one port to interface with 3.3 V FPGA I/O while the other connects to 2.5 V ASIC-reducing level-shifter count |
| Counter enable & repeat functions | Enables auto-incrementing address sequences and rapid reload of last valid address-ideal for FIFO emulation and DMA controllers |
Applications
| Network Packet Buffering | FPGA Co-Processor Memory |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in high-speed routers with line-rate throughput requirements. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking buffer between ingress parser and egress scheduler, with left port accepting packets and right port servicing lookup engines. Use Value: 166 MHz operation and 6 Gbps bandwidth sustain OC-192 (10 Gbps) line rates; pipelined outputs ensure deterministic latency for QoS scheduling. | Use Scenario: Providing low-latency, high-bandwidth scratchpad memory between FPGA fabric and external processor subsystems. IC Role / Device Role / Timing Role: Shared memory resource enabling parallel read/write access by FPGA logic blocks and ARM-based soft processors without bus arbitration overhead. Use Value: True dual-port architecture eliminates wait states; 3.6 ns tCD2 enables sub-6 ns memory access-critical for real-time control loops. |
| Digital Signal Processing Buffer | Industrial Motion Controller Memory |
Use Scenario: Holding coefficient tables and intermediate results in multi-channel motor control algorithms running on DSP+FPGA platforms. IC Role / Device Role / Timing Role: Synchronous dual-port RAM serving as ping-pong buffer between DSP instruction fetch and FPGA PWM generation logic. Use Value: Independent 3.3 V/2.5 V I/O per port allows direct connection to 3.3 V DSP data bus and 2.5 V FPGA I/O banks-reducing BOM cost and board area. | Use Scenario: Storing real-time position feedback, trajectory profiles, and servo loop parameters in CNC machine controllers. IC Role / Device Role / Timing Role: Deterministic-access memory for closed-loop motion control firmware executing on industrial microcontrollers with external bus interfaces. Use Value: 1.7 ns address setup time and 0.5 ns hold time meet tight timing margins of 166 MHz bus cycles-ensuring jitter-free position updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166AXC | 166 MHz, 256K × 18, 3.3 V core/I/O, 128-pin TQFP-but lacks independent VDDQ per port and REPEAT/CNTEN counter features | Requires external level shifters for mixed-voltage systems; no hardware address auto-increment capability | Choose when only basic dual-port functionality is needed and system uses uniform 3.3 V I/O across all peripherals |
| AS7C3256B-166JCIN | 166 MHz, 256K × 18, 3.3 V core/I/O, 128-pin TQFP-but supports only flow-through output mode (no pipelined option) | Higher tCD1 (12 ns max) increases latency vs. 3.6 ns pipelined tCD2; no dual chip enable depth expansion | Choose if system design relies on asynchronous OE-controlled output timing rather than deterministic pipelined latency |
Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70V3319S166BFG8 provides unique value through per-port VDDQ selection, hardware address counters, and fixed pipelined output-making it optimal for mixed-voltage, low-jitter, and depth-expandable memory subsystems.
Availability
70V3319S166BFG8 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and digital signal processing applications requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for 70V3319S166BFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
The 70V3319S166BFG8 belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic-latency, high-bandwidth memory buffering in telecom infrastructure, test equipment, and real-time embedded systems.
FAQ
What is the maximum operating frequency of the 70V3319S166BFG8?
The 70V3319S166BFG8 is rated for 166 MHz operation, corresponding to a 6 ns minimum clock cycle time. This specification is guaranteed under commercial temperature conditions (0°C to +70°C) with 3.3 V ±150 mV core supply and appropriate I/O voltage levels. The device achieves 6 Gbps aggregate bandwidth across both ports when operating at this frequency.
Does the 70V3319S166BFG8 support flow-through output mode?
No, the 70V3319S166BFG8 in the 128-pin TQFP package does not support flow-through output mode. Per the datasheet, "Due to limited pin count PL/FT option is not supported on the 128-pin TQFP package. Device is pipelined outputs only on each port." All timing and operation must be designed around the fixed pipelined output behavior with 3.6 ns clock-to-data-out latency.
Can the left and right ports of the 70V3319S166BFG8 operate at different I/O voltages?
Yes, the 70V3319S166BFG8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH (3.3 V) configures the left port for 3.3 V I/O operation with VDDQL = 3.3 V, while setting OPTR to VIL (0 V) configures the right port for 2.5 V I/O operation with VDDQR = 2.5 V. This enables direct interfacing with mixed-voltage SoCs or FPGAs without external level shifters.
Is JTAG debugging supported on the 70V3319S166BFG8?
No, JTAG is not supported on the 70V3319S166BFG8 in the 128-pin TQFP package. The datasheet explicitly states: "Due to limited pin count, JTAG is not supported on the 128-pin TQFP package." Pins TDI, TDO, TCK, TMS, and TRST are present but functionally disabled in this variant; JTAG capability is only available in the 208-pin and 256-pin BGA packages.
What is the purpose of the CNTEN and REPEAT signals on the 70V3319S166BFG8?
The CNTEN (counter enable) and REPEAT signals provide hardware-assisted address sequencing. When CNTEN is asserted, the internal address counter advances on each clock edge regardless of memory access state. REPEAT resets the counter to the last valid address loaded via ADS, enabling rapid restart of sequential access patterns-valuable for FIFO emulation, DMA bursts, and circular buffer implementations without software overhead.
70V3319S166BFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.6 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3319S166BFG8 FAQ
1.How can I place an order for 70V3319S166BFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3319S166BFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3319S166BFG8 reliable?
The price and inventory of 70V3319S166BFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3319S166BFG8 is usually 5 days.
3.What payment methods are accepted for 70V3319S166BFG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3319S166BFG8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3319S166BFG8?
70V3319S166BFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3319S166BFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3319S166BFG8?
For technical support, including 70V3319S166BFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3319S166BFG8 requirements.
6.How does Aetrix verify that 70V3319S166BFG8 is sourced from the original manufacturer or authorized distributors?
All 70V3319S166BFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3319S166BFG8 meets industry standards.
7.What is the process for return or replacement of 70V3319S166BFG8?
All 70V3319S166BFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3319S166BFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3319S166BFG8 part is unused and in its original packaging.
Return procedure for 70V3319S166BFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3319S166BFG8 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
