Renesas 70V3379S4BCG

Overview

70V3379S4BCG from Integrated Device Technology is a high-speed 32K × 18-bit synchronous dual-port static RAM with pipelined output, 3.3V core supply, and selectable 3.3V/2.5V I/O interface per port. It supports simultaneous left/right port access to the same memory location, delivers 4.2ns clock-to-data (pipelined), and operates at 133MHz (7.5ns cycle time) across commercial temperature range (0°C to +70°C). Used in high-bandwidth packet buffering and real-time DSP co-processor interfaces.

For engineers reviewing the 70V3379S4BCG datasheet, 70V3379S4BCG pinout, 70V3379S4BCG application, or 70V3379S4BCG equivalent, key selection criteria include dual-port timing coordination, VDDQ voltage selectability per port via OPT pins, pipelined vs. flow-through latency trade-offs, and depth-expansion support using dual chip enables CE0/CE1 without external logic.

Technical Context

The 70V3379S4BCG implements fully synchronous operation on both ports with all registers clocked on the rising edge of CLKL/CLKR. Its self-timed write pulse decouples internal write timing from clock edge transitions, enabling minimal cycle time. The address counter-controlled by ADSL/ADSR, CNTENL/CNTENR, and CNTRSTL/CNTRSTR-operates independently of CE0/CE1 states and supports external address loading or internal incrementing.

Pipelined output mode introduces one-cycle data latency but guarantees deterministic tCD2 (max 4.2ns), while byte enable controls (UBL/LBL and UBR/LBR) allow 9-bit granularity for bus-matching in multiplexed systems. Each port's I/O voltage level (3.3V or 2.5V) is set independently by OPTL/OPTR and enforced by corresponding VDDQL/VDDQR supplies.

Key Specifications

Pinout & Package

70V3379S4BCG is packaged in a 256-pin Ball Grid Array (BCG256) with 1.0 mm ball pitch and 17 mm × 17 mm body size. All VDD pins require 3.3V; VDDQL/VDDQR must match OPTL/OPTR logic levels (3.3V if VIH, 2.5V if VIL); all VSS pins connect to ground.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1375BV33-167AXC and AS7C33256B-15JIN, the 70V3379S4BCG uniquely combines per-port I/O voltage selection, pipelined latency control, and integrated address counter - making it optimal for mixed-voltage, high-throughput, burst-oriented embedded systems requiring deterministic timing and minimal external components.

Availability

70V3379S4BCG is available at Aetrix Electronics and suitable for telecom packet buffering, DSP co-processor interfacing, industrial PLC data exchange, and FPGA-based protocol bridging requiring stable component supply and long-term production continuity.

Supply support for 70V3379S4BCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The IDT70V3379 product line delivers synchronous dual-port SRAMs optimized for real-time, low-latency data exchange between independent clock domains - targeting networking equipment, digital signal processing subsystems, and programmable logic-based control systems.

FAQ

What is the maximum operating frequency supported by the 70V3379S4BCG?

The 70V3379S4BCG supports a minimum clock cycle time of 7.5 ns, enabling operation at 133 MHz. This is verified under commercial temperature conditions (0°C to +70°C) with VDD = 3.3V ±150 mV and proper termination. The device achieves this performance using pipelined output architecture and registered inputs that reduce setup/hold timing constraints.

Does the 70V3379S4BCG support independent I/O voltage levels on its left and right ports?

Yes, the 70V3379S4BCG supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH configures VDDQL for 3.3V operation; setting it to VIL configures VDDQL for 2.5V. The same applies to OPTR and VDDQR. This allows the 70V3379S4BCG to interface directly with mixed-voltage systems - for example, a 3.3V microcontroller on the left port and a 2.5V FPGA on the right port - without external level shifters.

How does the address counter function in the 70V3379S4BCG, and what signals control it?

The 70V3379S4BCG includes an internal 15-bit address counter per port, controlled by ADSL/ADSR (address strobe), CNTENL/CNTENR (counter enable), and CNTRSTL/CNTRSTR (counter reset). When ADS = HIGH and CNTEN = LOW, the counter increments on each CLK rise. When ADS = LOW, the external address is loaded instead. Reset occurs asynchronously when CNTRST goes LOW. This feature enables burst-mode sequential access without host-provided address updates.

What package type and pin count does the 70V3379S4BCG use, and what are its mechanical dimensions?

The 70V3379S4BCG uses a 256-pin fine-pitch Ball Grid Array (BCG256) package with 1.0 mm ball pitch. The package body measures approximately 17 mm × 17 mm × 1.4 mm. This BGA variant provides high I/O density and improved thermal/electrical performance over TQFP alternatives, supporting high-speed signal integrity requirements in dense PCB layouts.

Can the 70V3379S4BCG be used in depth-expansion configurations, and how is this implemented?

Yes, the 70V3379S4BCG supports depth expansion using its dual chip enables CE0 and CE1. In a two-device stack, one device uses CE0L=LOW/CE1L=HIGH while the other uses CE0L=HIGH/CE1L=LOW - enabling independent activation without external decoding logic. This method scales to N devices using only CE signal combinations, preserving full 18-bit data width while increasing addressable depth linearly. The 70V3379S4BCG datasheet confirms this capability in Figure 4 (Depth and Width Expansion).