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Renesas 70V3379S5BFI

Part No.:
70V3379S5BFI
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V3379S5BFI.pdf
Description:
IC SRAM 576KBIT PAR 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,658

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Product details

Overview

70V3379S5BFI from Integrated Device Technology is a high-speed 32K × 18-bit synchronous dual-port static RAM with pipelined output, 3.3V core supply, and selectable 3.3V/2.5V I/O interface per port. It supports simultaneous left/right port access, 133 MHz operation (7.5 ns cycle time), and industrial temperature range (–40°C to +85°C). Used in real-time DSP inter-processor communication and packet buffering in telecom line cards.

For engineers reviewing the 70V3379S5BFI datasheet, 70V3379S5BFI pinout, 70V3379S5BFI application, or 70V3379S5BFI equivalent, key selection criteria include pipelined read latency (≤5 ns), dual-voltage I/O flexibility (OPTL/OPTR-controlled), counter-enabled burst addressing, and 256-pin BGA package compatibility with high-density PCB layouts.

Technical Context

The 70V3379S5BFI implements true dual-port SRAM cells with fully synchronous clocked registers on all address, data, and control inputs-enabling minimal setup (1.8 ns) and hold (0.7 ns) times at 133 MHz. Its self-timed write architecture decouples internal write pulse generation from clock edge timing, improving write reliability across voltage/temperature corners.

Each port features independent OPT pins (OPTL/OPTR) that configure VDDQL/VDDQR for 3.3V or 2.5V I/O signaling, allowing mixed-voltage system interfacing without level shifters. The integrated address counter (CNTENL/CNTRSTL and CNTENR/CNTRSTR) enables burst-mode sequential access without external address generation logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 32K × 18 bits (576 Kbit); supports independent concurrent reads/writes on left and right ports
Clock Cycle Time 7.5 ns min (133 MHz); enables 9.6 Gbps aggregate bandwidth across both ports
Access Time (tCD2) 5 ns max (pipelined mode); deterministic output valid delay after clock edge, critical for timing-critical pipeline stages
I/O Voltage Support Selectable 3.3V ±150 mV or 2.5V ±125 mV per port via OPTL/OPTR; eliminates need for external voltage translators
Operating Temperature –40°C to +85°C (industrial grade); validated for sustained operation in base station and industrial control environments
Power Supply VDD = 3.3V ±150 mV (core); VDDQL/VDDQR independently set per port; ISB3 full standby current ≤15 mA
Package 256-pin BGA (BC256/BCG256); 17 mm × 17 mm body, 1.0 mm ball pitch, compatible with standard reflow profiles

Pinout & Package

70V3379S5BFI is housed in a 256-pin fine-pitch Ball Grid Array (BC256/BCG256) with 17 mm × 17 mm footprint and 1.0 mm ball pitch. Power and ground balls are distributed across the array to minimize noise and support high-frequency signal integrity.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock inputs Rising-edge-triggered; clocks all input registers and initiates pipelined output stage per port
A0L–A14L / A0R–A14R Address inputs (15-bit each port) Directly select one of 32K locations; ADSL/ADSR enable address latching on rising clock edge
I/O0L–I/O17L / I/O0R–I/O17R Bidirectional data bus (18-bit each port) Separated into upper (I/O9–I/O17) and lower (I/O0–I/O8) bytes controlled by UBL/LBL and UBR/LBR
CE0L/CE1L / CE0R/CE1R Dual chip enables per port CE0L=LOW & CE1L=HIGH enables port; CE0L=HIGH or CE1L=LOW forces low-power standby mode
OPTL / OPTR I/O voltage selection inputs Tie to VDD (3.3V) for 3.3V I/O; tie to VSS (0V) for 2.5V I/O-configures VDDQL/VDDQR supply requirements
CNTENL/CNTRSTL / CNTENR/CNTRSTR Address counter control CNTENL=LOW increments internal address on CLKL rise; CNTRSTL=LOW resets counter to address 0

Key Features

Feature Design Value
True dual-port memory cell architecture Enables simultaneous read/write to same memory location from left and right ports-essential for lock-free inter-processor communication
Pipelined output mode with tCD2 ≤ 5 ns Guarantees deterministic 1-cycle output latency; simplifies timing closure in high-speed FPGA-to-RAM interfaces
Independent per-port I/O voltage selection (3.3V/2.5V) Allows direct connection to mixed-voltage SoCs (e.g., 2.5V FPGA I/O banks and 3.3V microcontroller buses) without level shifters
Dual chip enables (CE0/CE1) per port Supports seamless depth expansion of multiple devices using only two control signals-no external decode logic required
Integrated address counter with reset Eliminates need for external counter ICs in burst-access applications like FIFO emulation or DMA buffer management
Asynchronous output enable (OEL/OER) Permits dynamic tri-state control of outputs independent of clock-critical for shared-bus arbitration and hot-swap scenarios

Applications

Telecom Packet Buffering DSP Inter-Processor Communication

Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in line interface cards before classification or forwarding.

IC Role / Device Role / Timing Role: Dual-port RAM acts as zero-latency shared memory between ingress and egress processing engines running at different clock domains.

Use Value: Simultaneous access eliminates arbitration delays; 133 MHz throughput sustains 10 Gbps line rates with <1 µs frame buffering latency.

Use Scenario: Exchanging coefficient tables and intermediate results between two TMS320C6000-series DSPs in radar beamforming systems.

IC Role / Device Role / Timing Role: Serves as coherent shared memory with hardware-enforced coherency via synchronized clock domains and pipelined reads.

Use Value: Pipelined tCD2 ≤ 5 ns ensures deterministic data availability for next-stage MAC operations; counter mode accelerates FFT windowing.

Industrial PLC Data Logging Medical Imaging Frame Storage

Use Scenario: Capturing sensor timestamps and analog readings in programmable logic controllers during fault events.

IC Role / Device Role / Timing Role: Left port writes timestamped samples from ADC controller; right port reads logs via ARM-based HMI processor.

Use Value: Industrial temp rating (–40°C to +85°C) ensures reliability in uncontrolled cabinets; dual CE enables power-gating during idle periods.

Use Scenario: Holding raw CT or MRI scan lines during acquisition before GPU-based reconstruction.

IC Role / Device Role / Timing Role: Acts as ping-pong frame buffer: one port accepts real-time 16-bit pixel streams; other port feeds reconstructed slices to display engine.

Use Value: 32K × 18 capacity stores >500k 16-bit pixels per frame; 256-pin BGA fits compact imaging module PCBs with tight thermal constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1375BV33-5BC 32K × 18, 5 ns access, 3.3V-only I/O, 208-pin BGA; no OPT-selectable 2.5V mode or address counter Lacks per-port voltage flexibility and burst-addressing logic; requires external counter for sequential access Choose when system uses uniform 3.3V I/O and simpler control logic suffices; lower cost but less feature-rich
AS7C33256B-10BIN 32K × 18, 10 ns access, 3.3V core/I/O, 128-pin TQFP; no pipelined mode, no address counter, commercial temp only Slower timing (10 ns vs. 5 ns), no industrial temp support, and no mixed-voltage capability limit use in ruggedized systems Acceptable for cost-sensitive, non-real-time embedded control where 133 MHz operation and –40°C operation are not required

Compared with CY7C1375BV33-5BC and AS7C33256B-10BIN, the 70V3379S5BFI delivers superior timing performance (5 ns pipelined access), industrial temperature resilience, and design flexibility via per-port I/O voltage selection and integrated address counter-reducing BOM count and PCB area in high-reliability, high-throughput systems.

Availability

70V3379S5BFI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and defense electronics requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70V3379S5BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V3379 product line targets high-speed, low-latency inter-processor and packet-buffering applications demanding true dual-port concurrency, pipelined timing, and robust industrial-grade operation.

FAQ

What is the maximum operating frequency supported by the 70V3379S5BFI?

The 70V3379S5BFI supports a minimum clock cycle time of 7.5 ns, enabling reliable operation at 133 MHz across its full industrial temperature range (–40°C to +85°C). This frequency is guaranteed under specified VDD = 3.3V ±150 mV and appropriate VDDQ conditions, with all AC timing parameters-including tSA, tHA, and tCD2-meeting limits at this rate.

Does the 70V3379S5BFI support independent I/O voltage levels on left and right ports?

Yes, the 70V3379S5BFI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH (3.3V) configures VDDQL for 3.3V I/O signaling on the left port, while setting OPTR to VIL (0V) configures VDDQR for 2.5V signaling on the right port-enabling direct interfacing with mixed-voltage SoCs without external level shifters.

How does the address counter function in the 70V3379S5BFI, and what control signals manage it?

The 70V3379S5BFI integrates a 15-bit address counter per port, controlled by CNTENL/CNTENR (enable) and CNTRSTL/CNTRSTR (reset) inputs. When CNTENL = LOW, the left port counter advances on each CLKL rising edge; CNTRSTL = LOW resets it to address 0. This eliminates external counter logic in burst-access applications such as DMA transfers or FFT data streaming.

What package type and pin count does the 70V3379S5BFI use, and are thermal or mechanical drawings available?

The 70V3379S5BFI uses a 256-pin fine-pitch Ball Grid Array (BC256/BCG256) with 17 mm × 17 mm body size and 1.0 mm ball pitch. Official mechanical drawings-including land pattern, solder paste stencil, and thermal pad recommendations-are published in IDT document 4833 drw 02c and available through Renesas' product support portal.

Can the 70V3379S5BFI be used in depth-expansion configurations, and what signals enable this?

Yes, the 70V3379S5BFI supports depth expansion using its dual chip enables (CE0L/CE1L and CE0R/CE1R) per port. As shown in IDT Application Note 4833 drw 14, connecting CE0 and CE1 in complementary fashion across multiple devices allows stacking without external decoding logic-simplifying memory bank design in systems requiring >576 Kbit capacity.

70V3379S5BFI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
576Kbit
Memory Organization:
32K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V3379S5BFI FAQ

1.How can I place an order for 70V3379S5BFI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3379S5BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3379S5BFI reliable?

The price and inventory of 70V3379S5BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3379S5BFI is usually 5 days.

3.What payment methods are accepted for 70V3379S5BFI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3379S5BFI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3379S5BFI?

70V3379S5BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3379S5BFI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3379S5BFI?

For technical support, including 70V3379S5BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3379S5BFI requirements.

6.How does Aetrix verify that 70V3379S5BFI is sourced from the original manufacturer or authorized distributors?

All 70V3379S5BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3379S5BFI meets industry standards.

7.What is the process for return or replacement of 70V3379S5BFI?

All 70V3379S5BFI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3379S5BFI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3379S5BFI part is unused and in its original packaging.

Return procedure for 70V3379S5BFI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70V3379S5BFI Tags

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