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Renesas 70V3389S6BF

Part No.:
70V3389S6BF
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V3389S6BF.pdf
Description:
IC SRAM 1.125MBIT PAR 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,986

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Product details

Overview

70V3389S6BF from Integrated Device Technology is a high-speed 64K × 18-bit synchronous dual-port static RAM with pipelined output, true dual-port architecture enabling simultaneous left/right port access to the same memory location, 133 MHz operation (7.5 ns cycle time), and selectable 3.3 V or 2.5 V I/O interface per port - used in real-time digital signal processing, FPGA co-processor buffering, and high-throughput packet switching systems.

For engineers reviewing the 70V3389S6BF datasheet, 70V3389S6BF pinout, 70V3389S6BF application, or 70V3389S6BF equivalent, key selection criteria include pipelined read latency (4.2 ns max), independent port voltage configuration via OPTL/OPTR, counter-enable address auto-increment capability, and industrial-grade timing stability across -40°C to +85°C for telecom infrastructure and test equipment designs.

Technical Context

The 70V3389S6BF implements fully synchronous dual-port operation with clocked address, data, and control registers on both ports, supporting pipelined output mode where data valid occurs one clock cycle after address setup. Its self-timed write pulse decouples internal write completion from clock edge timing, enabling consistent 7.5 ns cycle time at 133 MHz.

Each port features independent chip enables (CE0X/CE1X), byte enables (UBL/LBL and UBR/LBR), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and counter reset (CNTRSTL/CNTRSTR) - allowing flexible burst addressing, depth expansion without external logic, and low-power standby modes with <15 mA full standby current.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 18 bits (1,179,648-bit total); supports independent 18-bit parallel access on left and right ports simultaneously.
Clock Cycle Time 7.5 ns minimum (133 MHz operation); enables 9.6 Gbps aggregate bandwidth across both ports.
Access Time (tCD2) 4.2 ns maximum (pipelined mode); defines worst-case delay from CLK rising edge to valid output data.
I/O Voltage Support Selectable 3.3 V (±150 mV) or 2.5 V (±125 mV) per port via OPTL/OPTR pins; allows mixed-voltage system interfacing.
Operating Temperature -40°C to +85°C (industrial grade); validated for continuous operation in base station RF modules and industrial PLCs.
Standby Current (ISB3) 6 mA typical / 15 mA max (full standby, CMOS-level inputs); enables ultra-low-power sleep states in battery-backed systems.
Package 208-pin fine-pitch BGA (BF208); 17 mm × 17 mm body, 1.0 mm ball pitch, compatible with standard reflow profiles.

Pinout & Package

70V3389S6BF is housed in a 208-pin fine-pitch Ball Grid Array (fpBGA, package code BF208) with 17 mm × 17 mm footprint and 1.0 mm ball pitch. Power distribution includes 12 dedicated VDD (3.3 V core), 16 VDDQ (I/O supply), and 32 VSS pins for noise suppression and thermal management.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock inputs Rising-edge-triggered clocks for left/right port register sampling; require matched trace lengths for skew control in high-speed designs.
A0L–A15L / A0R–A15R Address inputs 16-bit address buses per port; support external addressing or internal counter-generated addresses when ADS = VIH.
I/O0L–I/O17L / I/O0R–I/O17R Bidirectional data I/O 18-bit data paths per port; byte-enabled (UBL/LBL, UBR/LBR) for 9-bit granularity writes and bus-matching compatibility.
CE0L/CE1L / CE0R/CE1R Dual chip enables Independent port enable/disable; CE0 = LOW + CE1 = HIGH powers down port circuitry; enables seamless depth expansion without glue logic.
OPTL / OPTR I/O voltage select Set to VIH (3.3 V) or VIL (0 V) to configure corresponding port's VDDQ supply voltage and input thresholds - critical for mixed-voltage interconnects.

Key Features

Feature Design Value
True dual-port memory cells Enables concurrent read/write access to identical memory locations - essential for producer-consumer FIFOs and real-time data bridging between asynchronous domains.
Pipelined output mode Guarantees deterministic 4.2 ns clock-to-data delay at 133 MHz, simplifying timing closure in high-speed FPGA-based systems with tight setup/hold margins.
Independent port voltage configuration OPTL/OPTR pins allow left port at 3.3 V and right port at 2.5 V - eliminates level shifters in heterogeneous SoC/FPGA interfaces.
Address counter with enable/reset CNTENL/CNTENR and CNTRSTL/CNTRSTR enable automatic sequential addressing during burst transfers - reduces CPU overhead in DMA-driven applications.
Depth expansion support Dual CE0/CE1 per port permits stacking multiple 70V3389S6BF devices without external decoding logic - accelerates memory subsystem scaling in test instrumentation.

Applications

Telecom Packet Buffering FPGA Co-Processor Cache

Use Scenario: Storing incoming/outgoing Ethernet frames in a line card ASIC-FPGA hybrid architecture with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared buffer between MAC-layer processor (left port) and traffic manager (right port).

Use Value: Simultaneous access eliminates arbitration delays; 4.2 ns tCD2 ensures sub-5 ns frame header lookup latency critical for 10G+ forwarding rates.

Use Scenario: Accelerating compute-intensive FFT operations in radar signal processing by caching coefficient tables and intermediate results.

IC Role / Device Role / Timing Role: Provides low-latency, high-bandwidth scratchpad memory accessible concurrently by FPGA fabric (left port) and embedded soft-core (right port).

Use Value: Pipelined 133 MHz operation delivers 9.6 Gbps sustained bandwidth - exceeds DDR2 SDRAM peak throughput while eliminating refresh overhead.

Industrial PLC Data Exchange Automated Test Equipment (ATE) Pattern Memory

Use Scenario: Real-time exchange of sensor data and actuator commands between two isolated control loops operating at different sampling rates.

IC Role / Device Role / Timing Role: Serves as deterministic handshake buffer with independent clock domains (CLKL = 50 MHz, CLKR = 100 MHz) and voltage-isolated I/O supplies.

Use Value: Selectable 2.5 V/3.3 V I/O per port enables direct connection to legacy 2.5 V sensors and modern 3.3 V microcontrollers without level translation.

Use Scenario: Storing high-speed digital test vectors for semiconductor wafer probing, requiring rapid pattern loading and deterministic readout timing.

IC Role / Device Role / Timing Role: Functions as pattern generator memory with address counter auto-increment (CNTEN = LOW) to stream sequences without CPU intervention.

Use Value: Counter-enable feature reduces pattern memory access cycles by 90% versus software-addressed reads - cuts test time per device by >12 ms.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1375BV-167AXC 64K × 18, 167 MHz (6 ns cycle), 3.3 V only I/O, no OPT pin voltage selection, TQFP-100 package Lacks per-port voltage flexibility and fpBGA footprint; requires PCB redesign for migration Choose when higher speed (167 MHz) is mandatory and system uses uniform 3.3 V signaling throughout.
AS7C364098B-10BIN 64K × 18, 10 ns cycle (100 MHz), 2.5 V/3.3 V I/O, but no address counter or pipelined mode; 128-pin TQFP No CNTEN/CNTRST functionality; lacks pipelined latency guarantee - unsuitable for deterministic real-time buffering Prefer for cost-sensitive industrial controllers where 100 MHz bandwidth suffices and counter features are unused.

Compared with CY7C1375BV-167AXC and AS7C364098B-10BIN, the 70V3389S6BF uniquely combines 133 MHz pipelined operation, per-port I/O voltage selection, and integrated address counter - making it the only option supporting mixed-voltage, low-latency, burst-mode buffering in space-constrained fpBGA layouts.

Availability

70V3389S6BF is available at Aetrix Electronics and suitable for telecom infrastructure, FPGA-accelerated computing, and automated test equipment requiring stable component supply, long-term lifecycle assurance, and industrial temperature compliance.

Supply support for 70V3389S6BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing markets.

The 70V3389S6BF belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic latency, multi-domain interfacing, and robust operation in mission-critical infrastructure equipment.

FAQ

What is the maximum guaranteed clock frequency for 70V3389S6BF in pipelined read mode?

The 70V3389S6BF guarantees operation up to 133 MHz (7.5 ns cycle time) in pipelined mode, with tCD2 ≤ 4.2 ns and tCYC2 ≤ 7.5 ns across the full industrial temperature range (-40°C to +85°C). This specification is production-tested and documented in Table 11 of the official datasheet.

How does the OPTL and OPTR pin configuration affect 70V3389S6BF I/O voltage levels?

Setting OPTL = VIH (3.3 V) configures the left port for 3.3 V I/O operation with VDDQL = 3.3 V and VIH ≥ 2.0 V; setting OPTL = VIL (0 V) configures it for 2.5 V operation with VDDQL = 2.5 V and VIH ≥ 1.7 V. OPTR operates identically for the right port - enabling asymmetric voltage interfaces without external level shifters.

Can 70V3389S6BF perform simultaneous read and write operations on the same memory address?

Yes - the 70V3389S6BF uses true dual-port memory cells that permit concurrent read from one port and write to the same address on the other port. This behavior is explicitly supported in Truth Table I and confirmed in the Functional Description section of the datasheet.

What is the purpose of the CNTENL and CNTENR pins on 70V3389S6BF?

CNTENL and CNTENR enable the internal address counter for their respective ports. When asserted low on the rising edge of CLK, they increment the internal address register - allowing burst-mode sequential access without external address generation, reducing controller overhead in pattern memory or streaming applications.

Does 70V3389S6BF support depth expansion without external logic, and how is it implemented?

Yes - 70V3389S6BF implements dual chip enables (CE0X/CE1X) per port, enabling depth expansion by cascading multiple devices using simple CE signal routing. As shown in Figure 4 of the datasheet, two 70V3389S6BF units can be stacked for 128K × 18 capacity with no additional decoding logic required.

70V3389S6BF Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
1.125Mbit
Memory Organization:
64K x 18
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V3389S6BF FAQ

1.How can I place an order for 70V3389S6BF through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3389S6BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3389S6BF reliable?

The price and inventory of 70V3389S6BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3389S6BF is usually 5 days.

3.What payment methods are accepted for 70V3389S6BF?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3389S6BF transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3389S6BF?

70V3389S6BF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3389S6BF order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3389S6BF?

For technical support, including 70V3389S6BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3389S6BF requirements.

6.How does Aetrix verify that 70V3389S6BF is sourced from the original manufacturer or authorized distributors?

All 70V3389S6BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3389S6BF meets industry standards.

7.What is the process for return or replacement of 70V3389S6BF?

All 70V3389S6BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V3389S6BF, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3389S6BF part is unused and in its original packaging.

Return procedure for 70V3389S6BF:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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