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Renesas 70V3399S133BCI

Part No.:
70V3399S133BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V3399S133BCI.pdf
Description:
IC SRAM 2MBIT PARALLEL 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,313

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Product details

Overview

70V3399S133BCI from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 4.2ns clock-to-data-out in pipelined mode for real-time data buffering in telecom line cards and packet-switching engines.

For engineers reviewing the 70V3399S133BCI datasheet, 70V3399S133BCI pinout, 70V3399S133BCI application, or 70V3399S133BCI equivalent, this device is selected for deterministic latency-critical dual-processor interconnects, FPGA co-processor memory sharing, and burst-mode packet buffering where concurrent port access, sub-5ns timing, and industrial temperature operation (-40°C to +85°C) are mandatory.

Technical Context

The 70V3399S133BCI implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports-enabling 1.7ns setup and 0.5ns hold times at 133MHz. Its pipelined output mode (fixed on this 128-pin TQFP variant) provides deterministic 4.2ns tCD2 latency, while self-timed write logic maintains fast 7.5ns cycle time without external wait-state generation.

Each port features independent power domains: core VDD = 3.3V ±150mV, while I/O voltage (VDDQ) is configurable to 3.3V or 2.5V via dedicated OPTL/OPTR pins-allowing mixed-voltage system interfacing. Dual chip enables (CE0/CE1 per port) support depth expansion without external logic, and JTAG IEEE 1149.1 is omitted due to pin count constraints in the PKG128 package.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 18-bit (4.6 Mbit total); supports independent 18-bit data paths on left and right ports
Max Operating Frequency133MHz (7.5ns clock cycle); validated for industrial temperature range (-40°C to +85°C)
Access Time (tCD2)4.2ns max clock-to-data-out in pipelined mode; enables deterministic timing for real-time systems
I/O Voltage SupportSelectable 3.3V or 2.5V per port via OPTL/OPTR pins; allows interoperability with mixed-voltage FPGAs and ASICs
Power SupplyCore VDD = 3.3V ±150mV; separate VDDQL/VDDQR supplies required for I/O domains
Operating TemperatureIndustrial grade: -40°C to +85°C ambient; qualified for telecom infrastructure and industrial control
Package128-pin TQFP (PKG128); 14mm × 20mm body; no JTAG or PL/FT mode support due to pin limitations

Pinout & Package

70V3399S133BCI is housed in a 128-pin Thin Quad Flatpack (TQFP) package with 0.5mm pitch, 14mm × 20mm footprint, and 1.4mm height. All VDD pins require 3.3V supply; VDDQL/VDDQR must match OPTL/OPTR configuration (3.3V or 2.5V). A17 is No Connect on both ports.

Pin/TerminalCircuit RoleDesign Meaning
CLKL / CLKRPort-synchronous clock inputRegisters all address/data/control inputs on rising edge; defines timing domain for each port independently
CE0L/CE1L, CE0R/CE1RDual chip enable inputsEnable depth expansion: CE0X = active-low, CE1X = active-high; both must be asserted for port access
R/WL / R/WRRead/write direction controlActive-high for write, active-low for read; controls data flow direction per port
OEL / OERAsynchronous output enableTri-states outputs immediately (no clock dependency); used for bus sharing and hot-swap isolation
UBL/LBL, UBR/LBRByte enable controlsIndependent upper (I/O9–I/O17) and lower (I/O0–I/O8) byte masking per port
A0L–A16L, A0R–A16RAddress inputs17-bit address bus per port; A17 is NC per datasheet note
I/O0L–I/O17L, I/O0R–I/O17RBidirectional data bus18-bit parallel interface per port; supports unidirectional or bidirectional burst transfers
OPTL / OPTRI/O voltage selectVIH = 3.3V I/O operation, VIL = 2.5V I/O operation; sets VDDQX supply requirement

Key Features

FeatureDesign Value
True dual-port memory cellsEnables simultaneous read/write to identical addresses on left/right ports-critical for lock-free inter-processor communication
Pipelined output mode onlyFixed on PKG128; eliminates timing uncertainty by guaranteeing 1-cycle output latency (4.2ns @133MHz)
Dual-cycle deselect (DCD)Prevents bus contention during rapid chip-enable toggling; ensures clean transitions between active and standby states
Separate byte controls per portAllows independent 9-bit upper/9-bit lower byte writes-essential for protocol header/payload alignment in packet processing
Counter enable & repeat functionsHardware address counter with reset-on-REPEAT enables sequential burst reads without CPU address increment overhead

Applications

Telecom Line Card BufferingFPGA-ASIC Co-Processor Interface

Use Scenario: High-throughput packet buffering between line interface ASIC and traffic manager in 10G/40G optical transport equipment.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress processing pipelines, synchronized to independent clocks.

Use Value: Simultaneous access eliminates arbitration delays; 4.2ns tCD2 ensures deterministic forwarding latency under full load.

Use Scenario: Real-time data exchange between Xilinx Kintex FPGA and ARM-based application processor in industrial vision system.

IC Role / Device Role / Timing Role: Memory bridge providing coherent, low-jitter data transfer with independent clock domains for FPGA logic and CPU subsystem.

Use Value: 256K × 18 capacity accommodates multi-frame image buffers; 2.5V/3.3V I/O flexibility matches FPGA bank voltages.

Avionics Data ConcentratorMedical Imaging Pipeline Buffer

Use Scenario: ARINC 664/AFDX end-system aggregating sensor data from multiple LRUs into unified avionics network packets.

IC Role / Device Role / Timing Role: Time-deterministic dual-port RAM stores timestamped sensor samples and packet headers prior to serialization.

Use Value: Industrial temperature rating (-40°C to +85°C) ensures reliability in uncontrolled avionics bays; dual CE enables fault-isolated memory partitioning.

Use Scenario: CT/MRI scanner front-end acquiring raw detector data at >200 MSPS and feeding reconstruction engine.

IC Role / Device Role / Timing Role: Burst-mode frame buffer decoupling high-speed ADC interface from variable-rate GPU-based reconstruction pipeline.

Use Value: Pipelined output mode guarantees fixed 4.2ns read latency; separate byte enables allow partial-frame DMA transfers without full-word overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV18256K × 18, 166MHz max, 3.3V-only I/O, 208-pin BGA packageLacks 2.5V I/O option and industrial temp grade; requires PCB redesign for BGA layoutSelect when higher speed (166MHz) is needed and 2.5V interfacing is unnecessary
IDT70V9369S133BG128K × 18, same 133MHz speed, 256-pin BGA, supports JTAGHalf memory depth; larger BGA footprint; includes JTAG debug capability absent in 70V3399S133BCISelect when JTAG visibility is required and 128K depth suffices for system architecture

Compared with CY7C1362BV18 and IDT70V9369S133BG, the 70V3399S133BCI uniquely combines industrial temperature operation, mixed-voltage I/O per port, and compact 128-pin TQFP packaging-making it optimal for space-constrained, mixed-signal embedded systems requiring deterministic dual-port latency.

Availability

70V3399S133BCI is available at Aetrix Electronics and suitable for telecom infrastructure, avionics data concentrators, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for 70V3399S133BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.

The 70V33xx family targets deterministic, low-latency memory interfacing in dual-processor and FPGA-ASIC systems-emphasizing simultaneous access, mixed-voltage compatibility, and industrial-grade reliability.

FAQ

What is the maximum guaranteed operating frequency for 70V3399S133BCI?

The 70V3399S133BCI is rated for 133MHz operation across the industrial temperature range (-40°C to +85°C), with a maximum clock cycle time of 7.5ns. This is validated for both commercial and industrial grades, and the device achieves 4.2ns clock-to-data-out (tCD2) in pipelined mode at this frequency. The 166MHz speed grade (70V3399S166) is commercial-only and not applicable to this part number.

Does 70V3399S133BCI support flow-through output mode?

No, the 70V3399S133BCI in the 128-pin TQFP (PKG128) package supports pipelined output mode only. As explicitly stated in the datasheet notes, "PIPE/FT option in PKG128 is not supported due to limitation in pin count. Device is pipelined outputs only on each port." Flow-through mode requires additional pins unavailable in this package variant.

Can both ports of 70V3399S133BCI operate at different I/O voltages?

Yes, the 70V3399S133BCI supports independent I/O voltage selection per port: OPTL configures the left port's VDDQL supply (3.3V or 2.5V), and OPTR configures the right port's VDDQR supply. This allows one port to interface with a 3.3V FPGA bank while the other connects to a 2.5V ASIC-enabling flexible mixed-voltage system integration without level shifters.

Is JTAG debugging supported on 70V3399S133BCI?

No, JTAG is not supported on the 70V3399S133BCI in the 128-pin TQFP package. The datasheet explicitly states: "Due to limited pin count, JTAG is not supported on the 128-pin TQFP package." JTAG signals (TCK, TMS, TDI, TDO, TRST) are present only on the 208-pin and 256-pin BGA variants of the 70V3319/99 family.

What is the function of the REPEAT pin on 70V3399S133BCI?

The REPEAT pin on 70V3399S133BCI resets the internal address counter to the last valid address loaded via ADS (Address Strobe Enable). When asserted, it causes the counter to repeat the most recently latched address-enabling efficient burst reads of consecutive locations without continuous address bus updates. This reduces CPU overhead in streaming data applications like packet buffering or image acquisition.

70V3399S133BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
2Mbit
Memory Organization:
128K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V3399S133BCI FAQ

1.How can I place an order for 70V3399S133BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3399S133BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3399S133BCI reliable?

The price and inventory of 70V3399S133BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3399S133BCI is usually 5 days.

3.What payment methods are accepted for 70V3399S133BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3399S133BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3399S133BCI?

70V3399S133BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3399S133BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3399S133BCI?

For technical support, including 70V3399S133BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3399S133BCI requirements.

6.How does Aetrix verify that 70V3399S133BCI is sourced from the original manufacturer or authorized distributors?

All 70V3399S133BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3399S133BCI meets industry standards.

7.What is the process for return or replacement of 70V3399S133BCI?

All 70V3399S133BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3399S133BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3399S133BCI part is unused and in its original packaging.

Return procedure for 70V3399S133BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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