Renesas 70V3399S133BF
- Part No.:
- 70V3399S133BF
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3399S133BF.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 208CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3399S133BF from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 4.2ns clock-to-data-out in pipelined mode - ideal for real-time packet buffering in telecom line cards and FPGA co-processor data exchange.
For engineers reviewing the 70V3399S133BF datasheet, 70V3399S133BF pinout, 70V3399S133BF application, or 70V3399S133BF equivalent, key selection criteria include its 128-pin TQFP package with pipelined-only output mode, industrial temperature support (–40°C to +85°C), dual chip enable for depth expansion, and JTAG-compatibility exclusion due to pin count constraints.
Technical Context
This device implements full synchronous operation on both ports with registered address, data, and control inputs - enabling minimal 1.7ns setup and 0.5ns hold times at 133MHz. Its self-timed write architecture maintains fast cycle time without external wait-state logic.
The memory array uses true dual-port cells with separate byte enables (UBL/LBL and UBR/LBR) and dual-cycle deselect (DCD) for pipelined outputs. Counter enable (CNTENL/CNTENR) and repeat (REPEATL/REPEATR) features support burst-addressing modes without external address generators.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18 bits (4.5 Mbit total); supports independent 18-bit parallel access on left and right ports |
| Max Operating Frequency | 133MHz (7.5ns clock cycle); validated for industrial temperature range (–40°C to +85°C) |
| Access Time | 4.2ns clock-to-data-out (tCD2) in pipelined mode; no flow-through option in 128-pin TQFP |
| I/O Voltage Support | Selectable 3.3V (±150mV) or 2.5V (±100mV) per port via OPTL/OPTR pins; core VDD fixed at 3.3V |
| Power Consumption | Typ. 320mA dynamic current (both ports active); 15mA full standby current with CMOS-level inputs |
| Operating Temperature | Industrial grade: –40°C to +85°C; commercial grade also available but 70V3399S133BF is industrial-specified |
| Package | 128-pin TQFP (14mm × 20mm × 1.4mm); no JTAG or PL/FT mode support due to pin limitation |
Pinout & Package
70V3399S133BF is housed in a 128-pin Thin Quad Flatpack (TQFP) with 0.5mm pitch, body size 14mm × 20mm × 1.4mm. All VDD pins require 3.3V supply; VDDQL/VDDQR must match OPTL/OPTR voltage selection (3.3V or 2.5V). A17L and A17R are no-connects.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Registers all address, data, and control signals on rising edge; determines timing boundaries for both ports |
| CE0L/CE1L, CE0R/CE1R | Dual chip enables per port | Enable depth expansion without external logic; CE0X = VIL & CE1X = VIH activates port X |
| R/WL / R/WR | Read/write direction control | Synchronous signal sampled on CLK edge; controls data flow direction for each port independently |
| OEL / OER | Asynchronous output enable | Directly gates output drivers; high-Z state enabled regardless of clock or CE state |
| UBL/LBL, UBR/LBR | Byte enable controls | Independently mask upper (I/O9–I/O17) or lower (I/O0–I/O8) 9-bit bytes during read/write |
| A0L–A16L, A0R–A16R | Address inputs | 17-bit address bus per port; A17L/A17R are NC per datasheet note |
| I/O0L–I/O17L, I/O0R–I/O17R | Bidirectional data bus | 18-bit multiplexed data path per port; compatible with LVTTL signaling at selected VDDQ |
| OPTL / OPTR | I/O voltage select | Set to VIH (3.3V) or VIL (0V) to configure corresponding port's I/O voltage level and required VDDQ supply |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables concurrent read/write to identical addresses across ports - essential for inter-processor communication without arbitration overhead |
| Self-timed write architecture | Eliminates need for external write-strobe timing control; guarantees minimum cycle time compliance under all process/voltage/temperature corners |
| Dual-cycle deselect (DCD) | Prevents bus contention during rapid port switching by enforcing two-cycle deactivation of outputs in pipelined mode |
| Separate per-port I/O voltage control | Allows left port to interface with 3.3V FPGA while right port connects to 2.5V ASIC - no level-shifter required |
| Counter enable and repeat functions | Reduces address bus width and controller complexity in sequential-access applications like FIFO emulation or DMA buffer management |
Applications
| Telecom Packet Buffering | FPGA-CPU Co-Processing Interface |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet or SONET frames between line interface and switch fabric. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress processing engines. Use Value: Simultaneous 133MHz access on both ports enables full wire-speed buffering without pipeline stalls or external arbitration logic. | Use Scenario: Exchanging processed sensor data between FPGA-accelerated algorithm block and ARM-based host processor. IC Role / Device Role / Timing Role: Serves as low-latency scratchpad memory with deterministic 4.2ns read response for real-time control loops. Use Value: Pipelined output mode and 1.7ns address setup time allow tight coupling with 133MHz FPGA clock domains and ARM AXI interconnect. |
| Industrial Motion Controller Memory | Digital Signal Processor Data Exchange |
Use Scenario: Holding position trajectory tables and real-time PID coefficients for multi-axis servo drives operating in harsh environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM provides reliable storage for motion control firmware variables with –40°C to +85°C operation. Use Value: Dual chip enables permit seamless memory expansion to 512K×18 using identical parts; full standby current <30mA extends system uptime during idle cycles. | Use Scenario: Streaming FFT output vectors from DSP core to post-processing unit in radar signal chain. IC Role / Device Role / Timing Role: Acts as ping-pong buffer between DSP write port and analysis engine read port with no software intervention. Use Value: Byte-enable granularity (UBL/LBL) allows partial-word updates without disturbing adjacent coefficients; 18-bit width matches native DSP word size. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZI | 133MHz, 256K×18, 128-pin TQFP; supports flow-through mode; no counter/repeat features | Lacks address counter and repeat functionality; requires external logic for burst addressing | Choose when pipelined latency is not required and simpler control logic is preferred |
| AS7C3256B-133JCIN | 133MHz, 256K×18, 128-pin TQFP; single 3.3V I/O supply only; no OPT pin flexibility | Fixed 3.3V I/O interface; incompatible with mixed-voltage systems requiring 2.5V port interfacing | Choose for cost-sensitive designs where both ports operate at 3.3V and JTAG is unnecessary |
Compared with CY7C1362BV33-133BZI and AS7C3256B-133JCIN, the 70V3399S133BF uniquely combines industrial temperature rating, per-port I/O voltage selection, and integrated address counter - reducing BOM count and PCB area in mixed-signal embedded systems.
Availability
70V3399S133BF is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, FPGA co-processing, and radar signal processing applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 70V3399S133BF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.
The 70V33xx family was designed specifically for high-bandwidth, low-latency inter-processor and FPGA-ASIC data exchange - emphasizing true dual-port concurrency, flexible I/O voltage scaling, and industrial reliability.
FAQ
What is the maximum guaranteed operating frequency of the 70V3399S133BF?
The 70V3399S133BF is rated for guaranteed operation up to 133MHz across the industrial temperature range (–40°C to +85°C), with a 7.5ns clock cycle time and 4.2ns clock-to-data-out delay in pipelined mode. This specification is validated per datasheet Table 11 and applies to both ports simultaneously under worst-case voltage and temperature conditions.
Does the 70V3399S133BF support flow-through output mode?
No, the 70V3399S133BF does not support flow-through output mode. As explicitly stated in the datasheet (Note 8, Pin Configuration section), the 128-pin TQFP package lacks sufficient pins to implement the PIPE/FT selection function - the device operates exclusively in pipelined output mode on both left and right ports.
Can the left and right ports of the 70V3399S133BF operate at different I/O voltages?
Yes, the 70V3399S133BF supports independent I/O voltage selection per port: OPTL configures the left port's VDDQL supply (3.3V or 2.5V), and OPTR configures the right port's VDDQR supply. This allows one port to interface with a 3.3V FPGA while the other connects to a 2.5V ASIC without external level shifters.
Is JTAG boundary scan supported on the 70V3399S133BF?
No, JTAG is not supported on the 70V3399S133BF. Due to the pin-count limitation of the 128-pin TQFP package, the TDI, TDO, TCK, TMS, and TRST pins required for IEEE 1149.1 compliance are omitted - this is confirmed in multiple datasheet notes (Pin Configuration pages 2–4, Note 9).
What is the purpose of the CNTEN and REPEAT pins on the 70V3399S133BF?
The CNTENL/CNTENR and REPEATL/REPEATR pins enable autonomous address generation: when CNTENX is asserted, the internal counter advances on each CLKX edge; REPEATX resets the counter to the last valid address loaded via ADSX. This eliminates the need for external address sequencers in applications like DMA buffers or FIFO emulation.
70V3399S133BF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3399S133BF FAQ
1.How can I place an order for 70V3399S133BF through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3399S133BF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3399S133BF reliable?
The price and inventory of 70V3399S133BF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3399S133BF is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3399S133BF?
For technical support, including 70V3399S133BF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3399S133BF requirements.
6.How does Aetrix verify that 70V3399S133BF is sourced from the original manufacturer or authorized distributors?
All 70V3399S133BF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3399S133BF meets industry standards.
7.What is the process for return or replacement of 70V3399S133BF?
All 70V3399S133BF units undergo pre-shipment inspection (PSI). If there is an issue with 70V3399S133BF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3399S133BF part is unused and in its original packaging.
Return procedure for 70V3399S133BF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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