My Inquiry
My Account
Renesas 70V3399S133BFI
- Part No.:
- 70V3399S133BFI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3399S133BFI.pdf
- Description:
- IC SRAM 2MBIT PARALLEL 208CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,829
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
70V3399S133BFI from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O voltage per port via OPT pins, and delivers 4.2ns clock-to-data-out in pipelined mode - ideal for real-time packet buffering in telecom line cards and FPGA co-processor interfaces.
For engineers reviewing the 70V3399S133BFI datasheet, 70V3399S133BFI pinout, 70V3399S133BFI application, or 70V3399S133BFI equivalent, key selection criteria include its industrial temperature range (–40°C to +85°C), dual chip enable for depth expansion without external logic, JTAG-compliant test interface (on BGA packages), and support for counter-enabled burst addressing with repeat functionality.
Technical Context
This device implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports, enabling minimal setup/hold times (1.7ns setup, 0.5ns hold @133MHz). Its internal architecture includes separate byte enables (UBL/LBL, UBR/LBR), address strobe (ADSL/ADSR), and counter control (CNTENL/CNTENR, REPEATL/REPEATR) to support burst-mode sequential access without external address generation logic.
The 70V3399S133BFI uses pipelined output mode exclusively in its 128-pin TQFP package (PKG128), as flow-through mode is disabled due to pin count constraints. Core power is fixed at 3.3V (±150mV), while I/O voltage per port is independently configurable to 3.3V or 2.5V via OPTL/OPTR pins - allowing mixed-voltage system interfacing without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18 bits (4.5 Mbit total); supports independent 18-bit parallel access on left and right ports |
| Max Clock Frequency | 133 MHz (7.5 ns cycle time); validated for industrial temperature range (–40°C to +85°C) |
| Access Time | 4.2 ns clock-to-data-out (tCD2) in pipelined mode; enables tight timing closure in high-speed bus interfaces |
| I/O Voltage Support | Selectable 3.3 V or 2.5 V per port via OPTL/OPTR pins; eliminates need for external level translators |
| Operating Temperature | Industrial grade: –40°C to +85°C; suitable for base station, industrial control, and avionics applications |
| Power Supply | Core: 3.3 V ±150 mV (VDD); I/O: 3.3 V ±150 mV or 2.5 V ±100 mV (VDDQL/VDDQR) |
| Standby Current | ISB2 = 220 mA max (one port active, other in TTL-level standby); enables low-power idle states |
Pinout & Package
70V3399S133BFI is packaged in a 128-pin Thin Quad Flatpack (TQFP), body size 14 mm × 20 mm × 1.4 mm, with 0.5 mm lead pitch. Pin functions are asymmetrically distributed across left (L) and right (R) ports to support independent control and data routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLKL / CLKR | Port-synchronous clock input | Registers all address, data, and control signals on rising edge; enables full synchronization across both ports |
| CE0L/CE1L, CE0R/CE1R | Dual chip enables per port | Allow depth expansion (e.g., 512K×18) using two devices without external decode logic |
| UBL/LBL, UBR/LBR | Upper/lower byte enables | Enable 9-bit granularity writes (I/O0–I/O8 or I/O9–I/O17), supporting multiplexed bus compatibility |
| ADSL / ADSR | Address strobe enable | Latches current address into internal counter; enables burst-mode sequential access without external address increment logic |
| CNTENL/CNTENR, REPEATL/REPEATR | Counter control inputs | Configure auto-incrementing address counter; REPEAT resets counter to last ADS-loaded address - critical for circular buffer implementations |
| OPTL / OPTR | I/O voltage select | Set VIH (3.3 V) or VIL (0 V) to configure corresponding port's I/O voltage to 3.3 V or 2.5 V independently |
| VDDQL / VDDQR | I/O power supply | Must match OPTX setting: 3.3 V if OPTX = VIH, 2.5 V if OPTX = VIL; decoupling required per port |
| A0L–A16L, A0R–A16R | Address inputs | 17-bit address bus per port; A17 is no-connect (NC) for this variant per datasheet note |
| I/O0L–I/O17L, I/O0R–I/O17R | Bidirectional data I/O | 18-bit parallel data path per port; supports simultaneous read/write on same memory location |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Memory Cells | Enables concurrent read and write operations to identical memory locations - essential for producer-consumer FIFOs and shared-memory inter-processor communication |
| Dual Cycle Deselect (DCD) | Prevents bus contention during rapid chip enable toggling by enforcing two-cycle deactivation - improves reliability in burst-intensive applications |
| Self-Timed Write Operation | Eliminates need for external write pulse generation; internal timing ensures minimum cycle time compliance without external delay elements |
| Separate Byte Controls per Port | Allows independent 9-bit writes to upper or lower byte lanes - simplifies integration with 16-bit microcontrollers and legacy bus architectures |
| Automatic Power-Down Mode | CE0/CE1-controlled standby reduces dynamic current to ≤220 mA (ISB2) when one port is idle - lowers thermal load in dense PCB layouts |
Applications
| Telecom Packet Buffering | FPGA Co-Processor Interface |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in carrier-grade line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress ASICs, with left port accepting incoming packets and right port servicing transmit scheduler. Use Value: Simultaneous access eliminates arbitration delays; 4.2 ns tCD2 ensures packet header lookup completes within one 133 MHz clock cycle. | Use Scenario: Providing high-bandwidth scratchpad memory between Xilinx Kintex FPGA and ARM Cortex-A9 processor in embedded vision systems. IC Role / Device Role / Timing Role: Serves as synchronized data exchange buffer where FPGA writes processed image tiles and CPU reads them for display or storage. Use Value: Independent 3.3 V/2.5 V I/O per port matches FPGA bank voltage and CPU bus voltage - no level-shifter ICs required. |
| Industrial Motion Controller | Radar Signal Processing |
Use Scenario: Real-time interpolation of multi-axis motor trajectories in CNC machines requiring deterministic jitter-free memory access. IC Role / Device Role / Timing Role: Left port receives trajectory points from host controller; right port supplies interpolated position commands to servo drivers at 10 kHz update rate. Use Value: Counter-enable + repeat features implement circular buffer for continuous motion profiles without CPU intervention. | Use Scenario: Storing intermediate FFT results in phased-array radar front-ends where ADC sampling and DSP processing occur concurrently. IC Role / Device Role / Timing Role: Acts as ping-pong buffer: one port accepts ADC samples while the other feeds FFT engine, swapping roles every frame. Use Value: Pipelined output mode ensures consistent 4.2 ns data valid window - critical for meeting 10 ns timing slack in 133 MHz signal chain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 18, 133 MHz, 3.3 V core/I/O; no OPT pin - fixed 3.3 V I/O; no counter/repeat features | Lacks burst-address counter and repeat functionality; requires external logic for circular buffers | Choose when system uses uniform 3.3 V signaling and does not require hardware-accelerated address sequencing |
| AS7C3256B-133JCIN | 256K × 18, 133 MHz, 3.3 V core/I/O; no JTAG; no byte-selectable I/O voltage; commercial temp only (0°C to +70°C) | Not rated for industrial temperature; lacks OPT-driven 2.5 V I/O support and JTAG test capability | Choose for cost-sensitive commercial applications where extended temperature and mixed-voltage I/O are unnecessary |
Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 70V3399S133BFI uniquely combines industrial temperature rating, per-port I/O voltage selection, and integrated address counter with repeat - making it the only option among the three that supports autonomous burst-mode operation in harsh environments.
Availability
70V3399S133BFI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and radar signal processing applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 70V3399S133BFI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications, computing, and industrial markets.
The 70V3399S133BFI belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency memory sharing between heterogeneous processors, ASICs, and FPGAs in real-time embedded systems.
FAQ
What is the maximum operating frequency of the 70V3399S133BFI?
The 70V3399S133BFI is rated for 133 MHz operation (7.5 ns clock cycle time) across the full industrial temperature range (–40°C to +85°C). This frequency is guaranteed with pipelined output mode enabled and meets all AC timing parameters including tCH2, tCL2, and tCD2 as specified in the official datasheet revision DSC-5623/13.
Does the 70V3399S133BFI support flow-through output mode?
No, the 70V3399S133BFI in the 128-pin TQFP package (PKG128) supports pipelined output mode only. Flow-through mode is explicitly disabled due to insufficient pin count - a design constraint noted in datasheet section "Pin Configuration" and confirmed in Note 8 on page 4.
Can both ports of the 70V3399S133BFI operate at different I/O voltages simultaneously?
Yes. The 70V3399S133BFI allows independent I/O voltage configuration: OPTL sets left-port VDDQL to 3.3 V or 2.5 V, and OPTR sets right-port VDDQR accordingly. This enables direct interfacing with mixed-voltage systems - for example, a 3.3 V FPGA and a 2.5 V DSP - without external level shifters.
What is the function of the ADS pin on the 70V3399S133BFI?
The ADSL and ADSR pins (Address Strobe Enable) on the 70V3399S133BFI latch the current address into the internal address counter on the rising clock edge. When used with CNTEN and REPEAT, ADS enables hardware-accelerated burst-mode sequential access - eliminating the need for external address increment logic in circular buffer or FIFO applications.
Is JTAG supported on the 70V3399S133BFI in the TQFP package?
No. JTAG (TCK, TMS, TDI, TDO, TRST) is not supported on the 70V3399S133BFI in the 128-pin TQFP package due to pin count limitations. JTAG functionality is available only on the 208-pin fpBGA and 256-pin BGA variants, as explicitly stated in Note 9 on page 4 of the datasheet.
70V3399S133BFI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 2Mbit
- Memory Organization:
- 128K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3399S133BFI FAQ
1.How can I place an order for 70V3399S133BFI through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3399S133BFI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3399S133BFI reliable?
The price and inventory of 70V3399S133BFI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3399S133BFI is usually 5 days.
3.What payment methods are accepted for 70V3399S133BFI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3399S133BFI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3399S133BFI?
70V3399S133BFI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3399S133BFI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3399S133BFI?
For technical support, including 70V3399S133BFI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3399S133BFI requirements.
6.How does Aetrix verify that 70V3399S133BFI is sourced from the original manufacturer or authorized distributors?
All 70V3399S133BFI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3399S133BFI meets industry standards.
7.What is the process for return or replacement of 70V3399S133BFI?
All 70V3399S133BFI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3399S133BFI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3399S133BFI part is unused and in its original packaging.
Return procedure for 70V3399S133BFI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3399S133BFI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
