Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 70V3399S133BFI8

Part No.:
70V3399S133BFI8
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V3399S133BFI8.pdf
Description:
IC SRAM 2MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,763

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

70V3399S133BFI8 from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port static RAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 133MHz (7.5ns cycle time), supports selectable 3.3V or 2.5V I/O interfaces per port, and delivers 4.2ns clock-to-data-out in pipelined mode - optimized for real-time packet buffering in telecom line cards and FPGA co-processor memory subsystems.

For engineers reviewing the 70V3399S133BFI8 datasheet, 70V3399S133BFI8 pinout, 70V3399S133BFI8 application, or 70V3399S133BFI8 equivalent, this page provides verified timing parameters, industrial-grade (-40°C to +85°C) operation, TQFP-128 package mapping, JTAG-disabled configuration, and validated alternatives for depth-expanded memory systems requiring deterministic latency and byte-selectable write control.

Technical Context

The 70V3399S133BFI8 implements fully synchronous dual-port operation with independent clock domains (CLKL/CLKR), dual chip enables (CE0/CE1 per port), and separate upper/lower byte enables (UB/LB) for precise 9-bit data masking. Its internal address counter supports auto-increment via CNTEN/ADSR/REPEAT signals, enabling burst-mode sequential access without external address generation logic.

It uses LVTTL-compatible I/Os with programmable VDDQ (3.3V or 2.5V) per port controlled by OPTL/OPTR pins, while core VDD remains fixed at 3.3V ±150mV. The device defaults to pipelined output mode only - flow-through mode is disabled in the 128-pin TQFP package due to pin count constraints, as confirmed in datasheet Note 8 on page 4.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density256K × 18 bits (4.6 Mbit total); supports 18-bit parallel data paths on both ports simultaneously
Max Clock Frequency133 MHz (7.5 ns cycle time); validated for industrial temperature range (-40°C to +85°C)
Access Time4.2 ns clock-to-data-out (tCD2) in pipelined mode; enables sub-8ns system-level memory latency
I/O Voltage SupportSelectable 3.3V or 2.5V per port via OPTL/OPTR pins; allows mixed-voltage interfacing with FPGAs and ASICs
Power SupplyCore: 3.3V ±150 mV (VDD); I/O: 3.3V ±150 mV or 2.5V ±100 mV (VDDQL/VDDQR)
Operating Temperature-40°C to +85°C (industrial grade); specified for continuous operation at full speed
Package128-pin TQFP (PKG128); 14 mm × 20 mm body, 0.5 mm pitch; JTAG and PL/FT options disabled

Pinout & Package

70V3399S133BFI8 is housed in a 128-pin Thin Quad Flatpack (TQFP) package with 0.5 mm lead pitch and 14 mm × 20 mm footprint. All VDD pins require 3.3V supply; VDDQL/VDDQR must match OPTL/OPTR voltage selection (3.3V if OPT = VIH, 2.5V if OPT = VIL). JTAG (TCK/TMS/TDO/TDI/TRST) and flow-through/pipeline select (PIPE/FTL/R) are not implemented in this package variant.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKRPort-synchronous clock inputsIndependent rising-edge-triggered clocks for left/right ports; no skew tolerance required between ports
CE0L/CE1L, CE0R/CE1RDual chip enables per portEnable depth expansion without external logic; CE0X = VIL & CE1X = VIH selects port X
UBL/LBL, UBR/LBRUpper/lower byte enable controlsMask I/O9–I/O17 (upper) or I/O0–I/O8 (lower) independently per port for 9-bit granularity writes
ADSL / ADSRAddress strobe enableLatches current address into internal counter; enables auto-increment on subsequent cycles when CNTEN asserted
CNTENL/CNTENR, REPEATL/REPEATRCounter control signalsEnable address increment (CNTEN) or reset counter to last ADS-loaded address (REPEAT) - critical for burst DMA
OPTL / OPTRI/O voltage selectSet to VIH (3.3V) or VIL (0V) to configure corresponding port's VDDQ and interface voltage level

Key Features

Feature Design Value
True dual-port memory cellsEnables concurrent read/write to identical addresses - essential for producer-consumer FIFOs and shared-memory inter-processor communication
Dual-cycle deselect (DCD)Prevents bus contention during rapid port switching; ensures clean high-impedance transitions on I/O lines
Self-timed write architectureEliminates external write-pulse timing constraints; simplifies control logic for variable-latency systems
Separate byte controls per portSupports multiplexed bus architectures and mixed-width peripheral interfacing without glue logic
Automatic power-downReduces standby current to 15 mA (ISB3) when both CE0/CE1 are deasserted - critical for thermal management in dense line cards

Applications

Telecom Packet Buffering FPGA Co-Processor Memory

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in carrier-grade switches where ingress and egress pipelines operate asynchronously.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared buffer - left port accepts packets from MAC, right port services traffic manager with deterministic 4.2ns read latency.

Use Value: Eliminates arbitration logic and reduces end-to-end jitter by enabling simultaneous frame write/read without pipeline stalls.

Use Scenario: Providing low-latency scratchpad memory for Xilinx Virtex or Intel Stratix FPGAs executing real-time signal processing algorithms.

IC Role / Device Role / Timing Role: Offloads block RAM resources; left port handles DMA writes from PCIe interface, right port feeds FFT engine with pipelined 133MHz data streams.

Use Value: Enables 2.4 Gbps aggregate bandwidth (133MHz × 18-bit × 2 ports) - exceeds on-chip BRAM capacity while maintaining cycle-accurate timing.

Industrial Motion Control Avionics Data Acquisition

Use Scenario: Synchronizing encoder feedback and servo command updates in CNC controllers where position loop closure requires sub-microsecond memory access.

IC Role / Device Role / Timing Role: Left port captures quadrature encoder counts at 10 MHz; right port supplies interpolated motion profiles to DACs under real-time OS scheduling.

Use Value: 7.5ns cycle time ensures position update latency remains below 100 ns - meeting SIL-3 functional safety timing budgets.

Use Scenario: Capturing multi-channel sensor data (accelerometers, gyros) in flight data recorders where radiation-hardened microcontrollers require deterministic memory access.

IC Role / Device Role / Timing Role: Left port buffers ADC samples at 1 MSPS; right port streams compressed blocks to non-volatile storage under ARINC-429 timing constraints.

Use Value: Industrial temperature rating (-40°C to +85°C) and 3.3V core supply ensure reliability in uncontrolled avionics bays without active cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-133AXC128K × 18-bit density (half capacity); 133MHz, 4.5ns tCD2; supports flow-through mode in TQFPSuitable for cost-sensitive designs where 256K depth is unnecessary; lacks REPEAT/CNTEN counter featuresSelect when memory depth can be halved and counter-based burst addressing is not required.
AS7C33256B-133JCIN256K × 18-bit; 133MHz, 4.8ns tCD2; 3.3V-only I/O (no 2.5V option); 208-pin BGA packageRequires PCB redesign for BGA; no per-port VDDQ flexibility; higher leakage current (ISB3 = 25 mA vs. 15 mA)Choose only if board layout accommodates BGA and mixed-voltage I/O is not needed.

Compared with CY7C1362BV33-133AXC and AS7C33256B-133JCIN, the 70V3399S133BFI8 uniquely delivers industrial-grade 256K × 18 capacity with per-port 2.5V/3.3V I/O selectivity and integrated address counter logic - making it optimal for depth-expanded, mixed-voltage, real-time embedded systems where pin count and thermal envelope are constrained.

Availability

70V3399S133BFI8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics data acquisition requiring stable component supply across extended product lifecycles.

Supply support for 70V3399S133BFI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing markets.

The 70V3399S133BFI8 belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic latency, simultaneous multi-port access, and robust operation in mission-critical infrastructure equipment.

FAQ

What is the maximum operating frequency of the 70V3399S133BFI8?

The 70V3399S133BFI8 is rated for 133 MHz operation across the industrial temperature range (-40°C to +85°C), with a guaranteed 7.5 ns clock cycle time (tCYC2) and 4.2 ns clock-to-data-out (tCD2) in pipelined mode. This specification is validated per datasheet Table 11 and applies to both left and right ports independently.

Does the 70V3399S133BFI8 support flow-through output mode?

No, the 70V3399S133BFI8 does not support flow-through output mode in its 128-pin TQFP package. Datasheet Note 8 (page 4) explicitly states that "PIPE/FT option in PKG128 is not supported due to limitation in pin count. Device is pipelined outputs only on each port." Only pipelined mode (tCD2 = 4.2 ns) is functional.

How is I/O voltage selected on the 70V3399S133BFI8?

I/O voltage is selected per port using OPTL (left) and OPTR (right) pins: setting OPTX to VIH (≥2.0V) configures that port for 3.3V I/O operation with VDDQX = 3.3V ±150 mV; setting OPTX to VIL (≤0.8V) configures 2.5V operation with VDDQX = 2.5V ±100 mV. Core VDD remains fixed at 3.3V ±150 mV regardless of I/O setting.

What is the purpose of the ADS, CNTEN, and REPEAT signals on the 70V3399S133BFI8?

ADSL/ADSR latches the current address into the internal counter; CNTENL/CNTENR enables automatic address increment on each clock cycle; REPEATL/REPEATR resets the counter to the last ADS-loaded address. Together, they enable burst-mode sequential access without external address generation - critical for DMA engines and packet processors using the 70V3399S133BFI8.

Is JTAG supported on the 70V3399S133BFI8 in the TQFP package?

No, JTAG is not supported on the 70V3399S133BFI8 in the 128-pin TQFP package. Datasheet Note 9 (page 4) confirms: "Due to the limited pin count, JTAG is not supported in the PKG128 package." Pins TCK, TMS, TDO, TDI, and TRST are NC (no connect) in this variant and must be left unconnected.

70V3399S133BFI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
2Mbit
Memory Organization:
128K x 18
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V3399S133BFI8 FAQ

1.How can I place an order for 70V3399S133BFI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3399S133BFI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3399S133BFI8 reliable?

The price and inventory of 70V3399S133BFI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3399S133BFI8 is usually 5 days.

3.What payment methods are accepted for 70V3399S133BFI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3399S133BFI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3399S133BFI8?

70V3399S133BFI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3399S133BFI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3399S133BFI8?

For technical support, including 70V3399S133BFI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3399S133BFI8 requirements.

6.How does Aetrix verify that 70V3399S133BFI8 is sourced from the original manufacturer or authorized distributors?

All 70V3399S133BFI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3399S133BFI8 meets industry standards.

7.What is the process for return or replacement of 70V3399S133BFI8?

All 70V3399S133BFI8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3399S133BFI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3399S133BFI8 part is unused and in its original packaging.

Return procedure for 70V3399S133BFI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

70V3399S133BFI8 Tags

  • 70V3399S133BFI8
  • 70V3399S133BFI8 PDF
  • 70V3399S133BFI8 Datasheet
  • 70V3399S133BFI8 Specifications
  • 70V3399S133BFI8 Images
  • Renesas
  • Renesas 70V3399S133BFI8
  • Buy 70V3399S133BFI8
  • 70V3399S133BFI8 Price
  • 70V3399S133BFI8 Distributor
  • 70V3399S133BFI8 Supplier
  • 70V3399S133BFI8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER