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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70V3399S166BC8

Name: 70V3399S166BC8
Brand: Renesas
SKU: 70V3399S166BC8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70V3399S166BC8

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70V3399S166BC8.pdf

Description:: IC SRAM 2MBIT PARALLEL 256CABGA

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Product details

Overview

70V3399S166BC8 from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 6Gbps aggregate bandwidth, supports selectable 3.3V or 2.5V I/O interfaces per port, and features pipelined output mode only (no flow-through due to 128-pin TQFP pin count limitation). It is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70V3399S166BC8 datasheet, 70V3399S166BC8 pinout, 70V3399S166BC8 application, or 70V3399S166BC8 equivalent, key selection criteria include guaranteed 166MHz operation under commercial temperature range (0°C to +70°C), 3.6ns clock-to-data-out timing, dual chip enables for depth expansion, JTAG support exclusion in this package, and strict 3.3V core supply with independently configurable I/O voltage per port.

Technical Context

This device implements full synchronous operation on both ports with registered address, data, and control inputs-enabling minimal 1.7ns setup and 0.5ns hold times at 166MHz. Its self-timed write architecture ensures fast cycle time without external wait-state generation.

The memory array uses true dual-port cells, allowing concurrent access without arbitration logic. The 128-pin TQFP package omits JTAG and PL/FT select functionality, fixing pipelined output mode and disabling boundary-scan test capability-making it suitable for cost-optimized, high-throughput embedded systems where deterministic latency and bus-matching compatibility are critical.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	256K × 18 bits (4.6 Mbit total); supports 18-bit multiplexed data bus with separate byte enables for upper/lower 9-bit lanes.
Max Clock Frequency	166MHz (6ns cycle time); enables 6Gbps aggregate bandwidth across both ports with no external wait states.
Access Time	3.6ns clock-to-data-out (tCD2) in pipelined mode; guarantees deterministic latency for real-time buffer applications.
I/O Voltage Support	Selectable 3.3V or 2.5V per port via OPTL/OPTR pins; allows mixed-voltage system interfacing without level shifters.
Operating Temperature	Commercial grade only: 0°C to +70°C; not rated for industrial temperature range in this speed grade.
Core Supply	3.3V ±150mV (VDD); all VDD pins must be tied to 3.3V-no core voltage scaling or tolerance beyond specification.
Package	128-pin TQFP (PKG128); 14mm × 20mm body, 0.5mm lead pitch; excludes JTAG and flow-through mode due to pin count constraints.

Pinout & Package

128-pin Thin Quad Flatpack (TQFP), 14mm × 20mm body, 0.5mm lead pitch. Pin functions validated per IDT datasheet 5623, revision November 2019. JTAG and FT/PIPE select pins omitted; pipelined output mode is fixed.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port Synchronous Clock Input	Registers all address, data, and control signals on rising edge; defines timing domain for left/right port operations.
CE0L/CE1L, CE0R/CE1R	Dual Chip Enable Inputs	Enable depth expansion without external logic: CE0X = active-low enable, CE1X = active-high disable; both required for power-down control.
R/WL / R/WR	Read/Write Control	Synchronous command input determining data direction per port; combined with CE and byte enables to define read/write/hold cycles.
OEL / OER	Asynchronous Output Enable	Independent tri-state control per port; overrides clocked outputs immediately-critical for bus sharing and hot-swap isolation.
UBL/LBL, UBR/LBR	Upper/Lower Byte Enables	Per-port 9-bit granularity control: UBL/LBL select I/O9–I/O17 or I/O0–I/O8 for writes/reads-enables 16-bit bus matching and partial-word updates.
OPTL / OPTR	I/O Voltage Selection	DC-level inputs setting VDDQL/VDDQR voltage: VIH = 3.3V, VIL = 2.5V; configures interface voltage before applying any I/O signals.
A0L–A16L, A0R–A16R	Address Inputs	17-bit address bus per port (A17 is NC per datasheet note); supports full 256K × 18 addressing with no external decoding.
I/O0L–I/O17L, I/O0R–I/O17R	Bidirectional Data Bus	18-bit parallel I/O per port; internally latched on clock edge-eliminates need for external bus transceivers in synchronous designs.

Key Features

Feature	Design Value
True Dual-Port Memory Cells	Enables simultaneous, independent read/write access to identical addresses-eliminates arbitration logic and lock-step synchronization overhead in multi-processor systems.
Dual Cycle Deselect (DCD)	Prevents bus contention during rapid chip enable toggling by enforcing two-cycle deselect delay-ensures clean transitions between active and high-Z states.
Separate Byte Controls	Independent upper (I/O9–I/O17) and lower (I/O0–I/O8) byte enables per port allow 9-bit partial writes-reducing bus traffic and power in protocol stack processing.
Counter Enable & Repeat	Hardware address counter with REPEAT latch enables burst sequential access without CPU intervention-ideal for FIFO emulation and DMA-driven streaming buffers.
Self-Timed Write	Internal timing circuitry automatically adjusts write pulse width based on process/voltage/temperature-guarantees reliable writes across full operating range without external timing calibration.

Applications

Telecom Line Card Buffering	Real-Time Signal Processing
Use Scenario: Storing and forwarding variable-length ATM or Ethernet packets between ingress and egress ASICs in carrier-grade line cards. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory buffer-left port accepts incoming packet data while right port feeds outgoing scheduler, synchronized by independent clocks. Use Value: 166MHz operation and 3.6ns tCD2 enable sub-6ns inter-port data transfer latency, supporting OC-192 (10 Gbps) line rates without packet loss under burst load.	Use Scenario: Real-time FFT or FIR filter coefficient/data exchange between DSP core and FPGA accelerator in radar or medical imaging systems. IC Role / Device Role / Timing Role: Shared memory interface between heterogeneous processors-DSP writes processed samples to RAM while FPGA reads for display rendering or further analysis. Use Value: Pipelined output mode ensures deterministic 3.6ns data valid window, eliminating timing uncertainty that would otherwise require complex handshake protocols or added pipeline stages.
Network Packet Classification	Industrial Motion Controller
Use Scenario: Accelerating deep packet inspection by storing rule tables and match results for parallel lookup engines in firewall or IDS appliances. IC Role / Device Role / Timing Role: High-bandwidth memory resource accessed concurrently by multiple TCAM match units and result aggregation logic-each unit owns one port. Use Value: Dual chip enables (CE0/CE1) allow seamless depth expansion across multiple 70V3399S166BC8 devices without external decode logic-scaling rule table size linearly with chip count.	Use Scenario: Coordinating position feedback (encoder) and motion command (PWM) data between servo drive microcontroller and FPGA-based trajectory planner. IC Role / Device Role / Timing Role: Deterministic latency buffer ensuring synchronized update of setpoint and actual position values every 100µs control loop cycle. Use Value: 1.7ns address setup and 0.5ns hold time at 166MHz guarantee timing closure in high-speed motion control loops-even with PCB trace skew up to 1.2ns.

Telecom Line Card Buffering

Real-Time Signal Processing

Use Scenario: Storing and forwarding variable-length ATM or Ethernet packets between ingress and egress ASICs in carrier-grade line cards.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory buffer-left port accepts incoming packet data while right port feeds outgoing scheduler, synchronized by independent clocks.

Use Value: 166MHz operation and 3.6ns tCD2 enable sub-6ns inter-port data transfer latency, supporting OC-192 (10 Gbps) line rates without packet loss under burst load.

Use Scenario: Real-time FFT or FIR filter coefficient/data exchange between DSP core and FPGA accelerator in radar or medical imaging systems.

IC Role / Device Role / Timing Role: Shared memory interface between heterogeneous processors-DSP writes processed samples to RAM while FPGA reads for display rendering or further analysis.

Use Value: Pipelined output mode ensures deterministic 3.6ns data valid window, eliminating timing uncertainty that would otherwise require complex handshake protocols or added pipeline stages.

Network Packet Classification

Industrial Motion Controller

Use Scenario: Accelerating deep packet inspection by storing rule tables and match results for parallel lookup engines in firewall or IDS appliances.

IC Role / Device Role / Timing Role: High-bandwidth memory resource accessed concurrently by multiple TCAM match units and result aggregation logic-each unit owns one port.

Use Value: Dual chip enables (CE0/CE1) allow seamless depth expansion across multiple 70V3399S166BC8 devices without external decode logic-scaling rule table size linearly with chip count.

Use Scenario: Coordinating position feedback (encoder) and motion command (PWM) data between servo drive microcontroller and FPGA-based trajectory planner.

IC Role / Device Role / Timing Role: Deterministic latency buffer ensuring synchronized update of setpoint and actual position values every 100µs control loop cycle.

Use Value: 1.7ns address setup and 0.5ns hold time at 166MHz guarantee timing closure in high-speed motion control loops-even with PCB trace skew up to 1.2ns.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-166AXC	166MHz, 256K × 18, 3.3V core + 3.3V I/O only (no 2.5V option); 208-pin BGA package.	Requires board redesign for BGA footprint and lacks per-port I/O voltage flexibility-unsuitable for mixed-voltage backplanes.	Select when JTAG testability and higher pin count for future feature enablement (e.g., flow-through mode) are required.
AS7C3256B-166JCIN	166MHz, 256K × 18, 3.3V only, 128-pin TQFP-but no dual chip enables or address counter features.	Missing CNTEN/REPEAT and dual CE logic; cannot emulate burst FIFO or support depth expansion without glue logic.	Select only for basic dual-port buffering where address sequencing and scalability are handled externally.

Compared with CY7C1362BV33-166AXC and AS7C3256B-166JCIN, the 70V3399S166BC8 uniquely combines per-port I/O voltage selection, hardware address counter with repeat latch, and dual chip enables in a 128-pin TQFP-enabling compact, mixed-voltage, scalable buffer designs without layout or logic overhead.

Availability

70V3399S166BC8 is available at Aetrix Electronics and suitable for telecom line card buffering, real-time signal processing, network packet classification, and industrial motion controller applications requiring stable component supply, long-term lifecycle support, and guaranteed commercial-temperature performance.

Supply support for 70V3399S166BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The 70V33xx family was designed specifically for high-throughput, low-latency dual-port memory applications in telecom infrastructure, test equipment, and real-time embedded systems-emphasizing synchronous timing integrity, voltage flexibility, and deterministic pipelined access.

FAQ

What is the maximum operating frequency of the 70V3399S166BC8?

The 70V3399S166BC8 is rated for 166MHz operation (6ns clock cycle time) under commercial temperature conditions (0°C to +70°C). This is confirmed by AC Electrical Characteristics Table 11 in the datasheet, which specifies tCYC2 ≤ 6ns max for pipelined mode. It does not support 166MHz in industrial temperature range-the 133MHz grade (70V3399S133BC8) is required for -40°C to +85°C operation.

Does the 70V3399S166BC8 support flow-through output mode?

No, the 70V3399S166BC8 in the 128-pin TQFP package (PKG128) does not support flow-through output mode. As explicitly stated in the datasheet notes on pages 4 and 5, "PIPE/FT option in PKG128 is not supported due to limitation in pin count. Device is pipelined outputs only on each port." The FT/PIPEL and FT/FTR pins are unconnected in this package variant.

Can the left and right ports of the 70V3399S166BC8 operate at different I/O voltages?

Yes, the 70V3399S166BC8 supports independent I/O voltage selection per port: OPTL sets VDDQL (left port) to either 3.3V or 2.5V, and OPTR sets VDDQR (right port) identically but independently. This allows one port to interface with a 3.3V FPGA while the other connects to a 2.5V ASIC-without external level shifters-as confirmed in Datasheet Note 3 on page 5.

Is JTAG boundary scan supported on the 70V3399S166BC8?

No, JTAG is not supported on the 70V3399S166BC8 in the 128-pin TQFP package. The datasheet explicitly states on page 4, "Due to the limited pin count, JTAG is not supported in the PKG128 package," and lists TDI, TDO, TCK, TMS, and TRST as NC (no-connect) pins in the PKG128 pin configuration diagram (page 4).

What is the function of the CNTEN and REPEAT pins on the 70V3399S166BC8?

The CNTEN (counter enable) and REPEAT pins implement a hardware address counter: when CNTEN = VIL, the internal address increments on each CLK rising edge; REPEAT, when asserted, resets the counter to the last valid address loaded via ADS. This enables burst sequential access without CPU involvement-critical for FIFO emulation and DMA-driven streaming, as detailed in Truth Table II (page 6) and Figure 6 (page 12).

70V3399S166BC8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 2Mbit

Memory Organization:: 128K x 18

Memory Interface:: Parallel

Clock Frequency:: 166 MHz

Write Cycle Time - Word, Page:: -

Access Time:: 3.6 ns

Voltage - Supply:: 3.15V ~ 3.45V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70V3399S166BC8 FAQ

1.How can I place an order for 70V3399S166BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3399S166BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 70V3399S166BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3399S166BC8 is usually 5 days.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3399S166BC8?

For technical support, including 70V3399S166BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3399S166BC8 requirements.

6.How does Aetrix verify that 70V3399S166BC8 is sourced from the original manufacturer or authorized distributors?

All 70V3399S166BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3399S166BC8 meets industry standards.

7.What is the process for return or replacement of 70V3399S166BC8?

All 70V3399S166BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3399S166BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3399S166BC8 part is unused and in its original packaging.

Return procedure for 70V3399S166BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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