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Renesas 70V3399S166BFG

Part No.:
70V3399S166BFG
Manufacturer:
Renesas
Category:
Memory
Package:
208-LFBGA
Datasheet:
Aetrix70V3399S166BFG.pdf
Description:
IC SRAM 2MBIT PARALLEL 208CABGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,219

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Product details

Overview

70V3399S166BFG from Integrated Device Technology is a high-speed 256K × 18-bit synchronous dual-port SRAM with true dual-port architecture enabling simultaneous read/write access to the same memory location from independent left and right ports. It operates at 166MHz (6ns cycle time), delivers 3.6ns clock-to-data-out in pipelined mode, supports selectable 3.3V or 2.5V I/O interfaces per port, and targets real-time data buffering in telecom line cards and network packet processors.

For engineers reviewing the 70V3399S166BFG datasheet, 70V3399S166BFG pinout, 70V3399S166BFG application, or 70V3399S166BFG equivalent, key selection criteria include its 166MHz pipelined timing, dual-chip-enable depth expansion capability, separate byte enables for bus matching, JTAG-compliant test support (in BGA packages), and industrial-grade operation up to +85°C - all critical for deterministic latency in high-throughput switching fabric designs.

Technical Context

This device implements fully synchronous dual-port operation with registered address, data, and control inputs on both ports, enabling minimal setup/hold times (1.7ns setup, 0.5ns hold @ 166MHz) and fast 6ns cycle time. Its memory array uses true dual-port cells, not pseudo-dual-port or FIFO-based emulation, allowing concurrent conflict-free access without arbitration logic.

The 70V3399S166BFG integrates per-port address counters with CNTEN/REPEAT/ADSR controls for burst-mode sequential addressing, and supports Dual Cycle Deselect (DCD) in pipelined output mode to manage output enable timing across multiple devices. Core voltage is fixed at 3.3V ±150mV, while I/O voltage per port is independently configurable via OPTL/OPTR pins to either 3.3V or 2.5V.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 18 bits (4.5 Mbit total); enables 18-bit parallel data paths per port without external multiplexing
Max Clock Frequency 166 MHz - supports 6 Gbps aggregate bandwidth (3.3 Gbps per port) for high-speed packet buffering
Access Time (Pipelined) 3.6 ns clock-to-data-out - ensures deterministic latency for time-critical read-after-write sequences
I/O Voltage Options Per-port selectable 3.3V or 2.5V - allows direct interfacing with mixed-voltage ASICs/FPGAs without level shifters
Operating Temperature –40°C to +85°C - qualified for industrial networking equipment deployed in uncontrolled environments
Package 128-pin TQFP (14 mm × 20 mm) - provides compact footprint with standard surface-mount assembly compatibility
Power Supply Single 3.3V core (VDD), dual I/O supplies (VDDQL/VDDQR) - simplifies power delivery vs. multi-rail alternatives

Pinout & Package

70V3399S166BFG is housed in a 128-pin Thin Quad Flatpack (TQFP) package measuring 14 mm × 20 mm × 1.4 mm, with 0.5 mm lead pitch. The package supports reflow soldering and is RoHS-compliant (Green part). JTAG is omitted due to pin count constraints; pipelined output mode is fixed (no PL/FT select).

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock input Registers all address/data/control signals on rising edge; defines strict timing boundaries for setup/hold compliance
CE0L/CE1L, CE0R/CE1R Dual chip enables per port Enable depth expansion without external logic: CE0X = active-low, CE1X = active-high for independent port gating
UBL/LBL, UBR/LBR Upper/lower byte enables (I/O9–17, I/O0–8) Allow 9-bit sub-word writes to match 16-bit or 32-bit bus widths; essential for partial-word packet header updates
A0L–A16L, A0R–A16R Address inputs 17-bit addressing (A17 is NC per datasheet note) selects one of 131,072 locations; supports full 256K × 18 space
I/O0L–I/O17L, I/O0R–I/O17R Bidirectional data I/O 18-bit parallel interface per port; direction controlled by R/WL/R/WR and OE; no external transceivers required
OPTL / OPTR I/O voltage select Set to VIH (3.3V) or VIL (0V) to configure corresponding VDDQX supply to 3.3V or 2.5V - configures interface voltage pre-power-up

Key Features

Feature Design Value
True dual-port memory cells Enables zero-wait-state concurrent read/write to identical addresses - eliminates arbitration overhead in shared-memory inter-processor communication
Self-timed write cycle Removes dependency on external write pulse width; guarantees reliable write completion within one clock cycle at 166MHz
Separate per-port address counters Supports autonomous burst addressing via CNTEN/REPEAT/ADSR - reduces host CPU load in streaming data applications like DMA engines
Dual Cycle Deselect (DCD) Prevents bus contention during pipelined output transitions by delaying output disable by two clocks - critical for multi-device synchronization
Low standby current (ISB3 = 15 mA typ) Reduces system-level power in idle states without sacrificing wake-up latency - suitable for energy-sensitive telecom modules

Applications

Telecom Line Card Buffering Network Packet Processor Interface

Use Scenario: Storing incoming/outgoing packet payloads in OC-192/STM-64 line interface units where deterministic latency is mandatory.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking first-in-first-out (FIFO) buffer between framer and switch fabric, with left port accepting ingress data and right port feeding egress scheduler.

Use Value: 3.6ns pipelined access ensures sub-4ns read latency, meeting SONET/SDH jitter budgets; 166MHz operation sustains 3.3 Gbps per port throughput for full-rate OC-192 (9.953 Gbps aggregate).

Use Scenario: Interfacing between packet classification ASIC and traffic management engine in Layer 3 switches.

IC Role / Device Role / Timing Role: Shared memory resource enabling parallel rule lookup (left port) and queue state update (right port) without software intervention.

Use Value: True dual-port architecture eliminates arbitration stalls; separate byte enables allow 9-bit header field writes without disturbing payload bytes - accelerating ACL processing by >20% vs. single-port alternatives.

Industrial Real-Time Controller Memory Radar Signal Processing Buffer

Use Scenario: Serving as deterministic shared memory between dual-core ARM Cortex-R5 processors in safety-critical PLCs.

IC Role / Device Role / Timing Role: Synchronous dual-port RAM providing lock-free inter-core communication with guaranteed worst-case access time.

Use Value: –40°C to +85°C rating ensures reliability in factory-floor enclosures; 6ns cycle time enables sub-microsecond inter-processor messaging - meeting IEC 61508 SIL-3 timing constraints.

Use Scenario: Buffering ADC samples and FFT coefficients in phased-array radar front-ends requiring simultaneous acquisition and computation.

IC Role / Device Role / Timing Role: High-bandwidth memory staging area where left port ingests 12-bit I/Q samples at 100 MSPS and right port feeds DSP cores with processed vectors.

Use Value: 256K × 18 capacity holds >260k complex samples; 166MHz clock supports sustained 100 MSPS ingest with zero dropped samples - critical for beamforming accuracy.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV18 256K × 18, 166MHz, but requires 2.5V core (VDD) and 2.5V I/O; no 3.3V core option Not suitable for systems requiring 3.3V-only power architecture; lacks industrial temperature grade Select only if existing design already uses 2.5V core rails and commercial-temp operation suffices
AS7C3256B Asynchronous dual-port (not synchronous); max 25ns access; no pipelined mode or JTAG support Cannot meet 166MHz timing; unsuitable for clock-domain-crossing applications requiring deterministic latency Consider only for cost-sensitive, low-speed control-plane buffers where timing predictability is non-critical

Compared with CY7C1362BV18 and AS7C3256B, the 70V3399S166BFG uniquely combines 166MHz synchronous operation, 3.3V core compatibility, industrial temperature range, and per-port I/O voltage flexibility - making it the only viable choice for new high-speed, mixed-voltage, ruggedized embedded designs.

Availability

70V3399S166BFG is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation controllers, and radar signal processing systems requiring stable component supply across extended product lifecycles.

Supply support for 70V3399S166BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF power solutions for communications and computing markets.

The 70V3399S166BFG belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic-latency data buffering in telecom switching fabrics, network processors, and real-time embedded systems.

FAQ

What is the maximum operating frequency of the 70V3399S166BFG?

The 70V3399S166BFG is rated for 166MHz operation with a 6ns clock cycle time. This is validated under commercial temperature conditions (0°C to +70°C) and requires pipelined output mode (fixed in the 128-pin TQFP package). At this speed, it achieves 3.6ns clock-to-data-out latency and 6Gbps aggregate bandwidth.

Does the 70V3399S166BFG support both 3.3V and 2.5V I/O interfaces?

Yes, the 70V3399S166BFG supports per-port selectable I/O voltages: OPTL and OPTR pins independently configure VDDQL and VDDQR to either 3.3V or 2.5V. This allows one port to interface with a 3.3V FPGA while the other connects to a 2.5V ASIC - eliminating external level shifters in mixed-voltage systems.

Is JTAG debugging supported on the 70V3399S166BFG in its 128-pin TQFP package?

No, JTAG is not supported on the 70V3399S166BFG in the 128-pin TQFP package due to insufficient pin count, as explicitly stated in the datasheet notes. JTAG functionality (TCK, TMS, TDI, TDO, TRST) is only available in the 208-pin and 256-pin BGA variants of the 70V3319/99 family.

What is the role of the CNTEN and REPEAT pins on the 70V3399S166BFG?

CNTEN enables the internal address counter on each port, advancing the address automatically on each clock edge when asserted. REPEAT resets the counter to the last valid address loaded via ADS (Address Strobe), enabling efficient burst reads/writes without continuous host address updates - reducing CPU overhead in streaming data paths.

Can the 70V3399S166BFG operate in flow-through output mode?

No, the 70V3399S166BFG in the 128-pin TQFP package operates exclusively in pipelined output mode. The FT/PIPEL and FT/PIPER pins are fixed to enable pipelining, as confirmed by the datasheet note: "Due to limited pin count PL/FT option is not supported on the 128-pin TQFP package. Device is pipelined outputs only on each port."

70V3399S166BFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
208-LFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
2Mbit
Memory Organization:
128K x 18
Memory Interface:
Parallel
Clock Frequency:
166 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
208-CABGA (15x15)

70V3399S166BFG FAQ

1.How can I place an order for 70V3399S166BFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3399S166BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3399S166BFG reliable?

The price and inventory of 70V3399S166BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3399S166BFG is usually 5 days.

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70V3399S166BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3399S166BFG?

For technical support, including 70V3399S166BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3399S166BFG requirements.

6.How does Aetrix verify that 70V3399S166BFG is sourced from the original manufacturer or authorized distributors?

All 70V3399S166BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3399S166BFG meets industry standards.

7.What is the process for return or replacement of 70V3399S166BFG?

All 70V3399S166BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70V3399S166BFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3399S166BFG part is unused and in its original packaging.

Return procedure for 70V3399S166BFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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