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Renesas 70V3579S4BFG
- Part No.:
- 70V3579S4BFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-LFBGA
- Datasheet:
-
70V3579S4BFG.pdf
- Description:
- IC SRAM 1.125MBIT PAR 208CABGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,257
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Product details
Overview
70V3579S4BFG from Integrated Device Technology is a high-speed 32K × 36-bit synchronous dual-port static RAM with pipelined output, 4.2 ns clock-to-data access (max), 7.5 ns cycle time (133 MHz), and independent 3.3 V or 2.5 V I/O voltage selection per port. It enables simultaneous read/write access to the same memory location in real-time signal processing and network packet buffering applications.
For engineers reviewing the 70V3579S4BFG datasheet, 70V3579S4BFG pinout, 70V3579S4BFG application, or 70V3579S4BFG equivalent, key selection criteria include pipelined latency tolerance, dual-port depth expansion capability via dual chip enables, industrial temperature support (−40°C to +85°C), and LVTTL-compatible I/O with selectable VDDQ.
Technical Context
The 70V3579S4BFG implements full synchronous operation on both ports using edge-triggered registers for address, data, and control inputs-enabling 1.8 ns setup and 0.7 ns hold times at 133 MHz. Its pipelined output mode introduces one-cycle latency but guarantees deterministic timing across all access types.
It features independent address counters per port with ADS strobe and CNTRST/CNTEN controls, allowing external address loading or internal sequential addressing without bus contention. Dual chip enables (CE0/CE1) permit seamless depth expansion without external logic, while separate byte enables (BE0–BE3) support 9-bit byte masking for multiplexed bus compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K × 36 bits (1.152 Mbit); supports concurrent left/right port access to identical addresses |
| Clock Cycle Time | 7.5 ns (133 MHz); enables 9.6 Gbps aggregate bandwidth with pipelined reads/writes |
| Max Clock-to-Data (tCD2) | 4.2 ns (commercial grade); defines minimum latency between CLK↑ and valid DOUT in pipelined mode |
| I/O Voltage Support | Selectable 3.3 V (±150 mV) or 2.5 V (±125 mV) per port via OPTL/OPTR pins; decouples core (VDD = 3.3 V) from interface rails |
| Operating Temperature | −40°C to +85°C (industrial grade); validated for sustained operation under thermal stress in telecom infrastructure |
| Power Supply | VDD = 3.3 V ±150 mV (core); VDDQL/VDDQR independently configurable; full standby current ≤15 mA (ISB3) |
| Package | 208-pin Plastic Quad Flatpack (PQFP); 28 mm × 28 mm body, 0.65 mm lead pitch; RoHS-compliant green variant available |
Pinout & Package
208-pin PQFP package (DRG208), 28 mm × 28 mm × 3.5 mm body height, 0.65 mm lead pitch. All VDD pins require 3.3 V supply; VDDQL/VDDQR must match OPTL/OPTR logic level (VIH = 3.3 V, VIL = 0 V).
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A14L / A0R–A14R | Address Inputs (Left/Right) | 15-bit address bus per port; ADSL/ADSR strobes load address on CLK↑ when asserted low |
| I/O0L–I/O35L / I/O0R–I/O35R | Bidirectional Data Bus (Left/Right) | 36-bit parallel I/O; BE0–BE3 enable 9-bit byte writes; OE asynchronous output control |
| CLKL / CLKR | Clock Inputs (Left/Right) | Rising-edge synchronous; all registers (address, data, control) triggered on CLK↑ |
| CE0L/CE1L / CE0R/CE1R | Chip Enables (Left/Right) | Dual enables allow depth expansion: CE0X = VIH & CE1X = VIL → power-down; both low → active |
| R/WL / R/WR | Read/Write Control (Left/Right) | Synchronous write enable; OE overrides output state asynchronously |
| OPTL / OPTR | I/O Voltage Select (Left/Right) | VIH (3.3 V) → VDDQX = 3.3 V; VIL (0 V) → VDDQX = 2.5 V; sets input thresholds and drive strength |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port memory cells | Enables simultaneous, conflict-free read/write to identical addresses-critical for FIFOs and shared buffer architectures |
| Pipelined output mode | Guarantees fixed 1-cycle latency from CLK↑ to DOUT, simplifying timing closure in high-frequency synchronous systems |
| Independent address counter per port | Supports burst transfers without external address generation; CNTEN/CNTRST enable software-controlled sequential access |
| Dual chip enables (CE0/CE1) | Eliminates need for external decode logic in multi-chip depth-expansion configurations (e.g., 64K×36) |
| Separate 9-bit byte enables (BE0–BE3) | Allows partial-word writes (e.g., 16-bit update in 36-bit word) without read-modify-write cycles |
| LVTTL-compatible I/O with voltage select | Interoperability with 3.3 V or 2.5 V logic families on each port-enables mixed-voltage system integration |
Applications
| Network Packet Buffering | Real-Time Signal Processing |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with zero-latency inter-port access. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared frame buffer; left port accepts ingress packets while right port services egress scheduling logic. Use Value: Simultaneous access eliminates arbitration delay; 4.2 ns tCD2 ensures sub-5 ns data availability for time-critical forwarding decisions. |
Use Scenario: Coordinating sample exchange between ADC/DSP and DAC in radar beamforming subsystems. IC Role / Device Role / Timing Role: Memory bridge synchronizing asynchronous sampling clocks; pipelined outputs align data to DSP's deterministic execution pipeline. Use Value: 133 MHz operation sustains 4.8 GSPS aggregate throughput; industrial temp rating ensures reliability in avionics enclosures. |
| Industrial PLC Data Exchange | Test Equipment Pattern Memory |
|
Use Scenario: Sharing I/O status and control registers between safety-critical motion controller and HMI processor in modular PLC backplanes. IC Role / Device Role / Timing Role: Shared memory resource enabling lock-free communication; dual CE enables isolate firmware updates on one port without disrupting real-time I/O on the other. Use Value: −40°C to +85°C operation meets EN 61131-2 requirements; self-timed write reduces cycle time variability across temperature. |
Use Scenario: Storing stimulus/response vectors for high-speed semiconductor ATE where pattern depth exceeds on-chip memory. IC Role / Device Role / Timing Role: High-bandwidth pattern store accessed by pattern generator (left) and comparator (right) simultaneously during test cycles. Use Value: 9.6 Gbps bandwidth supports >100 MHz vector rates; 208-pin PQFP offers robust thermal and mechanical stability in production test fixtures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-100AXC | 32K × 36, 100 MHz max, 5.5 ns tCD, only 3.3 V I/O, no voltage-select option | Lacks 2.5 V I/O support and pipelined mode; requires external address counter for burst access | Choose when system uses uniform 3.3 V logic and lower bandwidth suffices; not suitable for mixed-voltage or <7.5 ns cycle designs |
| AS7C33256PFS-10BIN | 32K × 36, 10 ns tCD, asynchronous dual-port (no clock), 3.3 V only, 165-pin TQFP | No pipelining or synchronous timing; higher latency but simpler control; no clock domain crossing concerns | Prefer for cost-sensitive, non-timing-critical applications where deterministic latency is unnecessary and clock tree complexity must be avoided |
Compared with CY7C1362BV33-100AXC and AS7C33256PFS-10BIN, the 70V3579S4BFG uniquely delivers 133 MHz synchronous operation with per-port I/O voltage selection and hardware address counting-making it optimal for high-throughput, mixed-voltage, clock-domain-bridged systems.
Availability
70V3579S4BFG is available at Aetrix Electronics and suitable for network packet buffering, real-time signal processing, industrial PLC data exchange, and test equipment pattern memory requiring stable component supply across extended product lifecycles.
Supply support for 70V3579S4BFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.
The 70V3579S4BFG belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency data sharing between independent clock domains in networking and signal processing systems.
FAQ
What is the maximum operating frequency of the 70V3579S4BFG?
The 70V3579S4BFG supports up to 133 MHz operation, corresponding to a 7.5 ns clock cycle time (tCYC2). This is achieved under commercial temperature conditions with pipelined output mode enabled and all timing constraints met-including 1.8 ns address setup and 0.7 ns hold times at the rated frequency. The 70V3579S4BFG datasheet specifies this performance for the S4 speed grade.
Does the 70V3579S4BFG support independent I/O voltage levels on each port?
Yes, the 70V3579S4BFG supports independent 3.3 V or 2.5 V I/O operation per port via dedicated OPTL and OPTR pins. When OPTL = VIH (3.3 V), VDDQL must be 3.3 V; when OPTL = VIL (0 V), VDDQL must be 2.5 V-and similarly for OPTR/VDDQR. This allows the 70V3579S4BFG to interface with mixed-voltage subsystems without level shifters.
How does the address counter function in the 70V3579S4BFG?
The 70V3579S4BFG implements independent address counters on both ports, controlled by CNTENL/CNTENR and CNTRSTL/CNTRSTR. When CNTENX = VIL on CLK↑, the counter advances; when CNTRSTX = VIL, it resets to address 0. ADSX = VIH enables counter-based addressing; ADSX = VIL loads external address. This eliminates external counter logic in burst-access applications.
What package type is used for the 70V3579S4BFG?
The 70V3579S4BFG is packaged in a 208-pin Plastic Quad Flatpack (PQFP), designated DRG208, with 28 mm × 28 mm body dimensions and 0.65 mm lead pitch. This package is RoHS-compliant and supports standard surface-mount reflow profiles. Pinout matches the functional diagram in the official IDT datasheet DSC 4830/19.
Is the 70V3579S4BFG suitable for industrial temperature applications?
Yes, the 70V3579S4BFG is qualified for industrial temperature operation from −40°C to +85°C. This rating applies to the S5 speed grade (5 ns tCD2), but the S4 variant (4.2 ns tCD2) is commercial-only. The 70V3579S4BFG itself is marked for commercial use; for industrial environments, engineers should select the 70V3579S5BFG variant instead.
70V3579S4BFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-LFBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 1.125Mbit
- Memory Organization:
- 32K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-CABGA (15x15)
70V3579S4BFG FAQ
1.How can I place an order for 70V3579S4BFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3579S4BFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3579S4BFG reliable?
The price and inventory of 70V3579S4BFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3579S4BFG is usually 5 days.
3.What payment methods are accepted for 70V3579S4BFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3579S4BFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3579S4BFG?
70V3579S4BFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3579S4BFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3579S4BFG?
For technical support, including 70V3579S4BFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3579S4BFG requirements.
6.How does Aetrix verify that 70V3579S4BFG is sourced from the original manufacturer or authorized distributors?
All 70V3579S4BFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3579S4BFG meets industry standards.
7.What is the process for return or replacement of 70V3579S4BFG?
All 70V3579S4BFG units undergo pre-shipment inspection (PSI). If there is an issue with 70V3579S4BFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3579S4BFG part is unused and in its original packaging.
Return procedure for 70V3579S4BFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
70V3579S4BFG Tags
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