Renesas 70V3579S4DR
- Part No.:
- 70V3579S4DR
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 208-BFQFP
- Datasheet:
-
70V3579S4DR.pdf
- Description:
- IC SRAM 1.125MBIT PAR 208PQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
70V3579S4DR from Integrated Device Technology is a high-speed 32K × 36-bit synchronous dual-port static RAM with pipelined output, 4.2 ns clock-to-data access (max), 7.5 ns cycle time (133 MHz), and independent 3.3 V or 2.5 V I/O voltage selection per port. It enables simultaneous read/write access to the same memory location in real-time networking and packet buffering applications.
For engineers reviewing the 70V3579S4DR datasheet, 70V3579S4DR pinout, 70V3579S4DR application, or 70V3579S4DR equivalent, this page delivers verified timing parameters, dual-port interface behavior, industrial-grade thermal operation (–40°C to +85°C), and PQFP-208 package implementation details required for deterministic latency design in telecom switching and FPGA co-processing systems.
Technical Context
The 70V3579S4DR implements full synchronous operation on both ports using edge-triggered registers for address, data, and control inputs-enabling minimal setup (1.8 ns) and hold (0.7 ns) times at 133 MHz. Its pipelined output mode introduces one-cycle latency but guarantees deterministic tCD2 ≤ 4.2 ns under commercial conditions.
Each port supports independent VDDQ selection (3.3 V or 2.5 V) via OPTL/OPTR pins, allowing mixed-voltage system interfacing without level shifters. The integrated address counter-enabled by CNTEN and reset by CNTRST-provides burst-addressing capability without external logic, while dual chip enables (CE0/CE1 per port) support seamless depth expansion.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 32K × 36 bits (1.152 Mbit total); supports concurrent left/right port access to identical addresses. |
| Clock Cycle Time | 7.5 ns (133 MHz); enables 9.6 Gbps aggregate bandwidth across both ports. |
| Max Clock-to-Data (tCD2) | 4.2 ns (commercial grade); defines worst-case latency from CLK rise to valid output in pipelined read mode. |
| Input Timing Margins | 1.8 ns setup / 0.7 ns hold on all control/data/address inputs at 133 MHz; reduces PCB routing constraints. |
| Supply Configuration | 3.3 V ±150 mV core (VDD); selectable 3.3 V or 2.5 V ± tolerance I/O (VDDQL/VDDQR) per port via OPT pins. |
| Operating Temperature | –40°C to +85°C (industrial range); validated for deployment in base station and industrial control environments. |
| Power Modes | Four standby states (ISB1–ISB4) down to 6 mA full CMOS standby; enables dynamic power gating per port. |
Pinout & Package
70V3579S4DR is packaged in a 208-pin Plastic Quad Flatpack (PQFP) with 0.5 mm lead pitch and 28 mm × 28 mm body size. All VDD pins require 3.3 V supply; VDDQL/VDDQR must match OPTL/OPTR logic levels (3.3 V if VIH, 2.5 V if VIL).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A14L, A0R–A14R | Address Inputs (Left/Right) | 15-bit address bus per port; ADSL/ADSR strobes enable asynchronous address latching. |
| I/O0L–I/O35L, I/O0R–I/O35R | Bidirectional Data Bus (36-bit) | Four 9-bit byte lanes (BE0–BE3); supports partial writes/reads without disturbing adjacent bytes. |
| CLKL, CLKR | Port Clock Inputs | Rising-edge synchronous; controls register sampling of all inputs and pipelined output timing. |
| OEL, OER | Asynchronous Output Enables | Independent per-port tri-state control; overrides clock-synchronized output behavior. |
| CE0L/CE1L, CE0R/CE1R | Dual Chip Enables | Enable/disable port logic independently; CE0 = VIL & CE1 = VIH activates port; both VIH disables. |
| OPTL, OPTR | I/O Voltage Select | Set to VIH (3.3 V) or VIL (0 V) to configure corresponding VDDQX supply voltage and input thresholds. |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Memory Cells | Enables simultaneous, conflict-free read/write access to identical memory locations-critical for producer-consumer FIFOs. |
| Pipelined Output Mode | Guarantees fixed 1-cycle output latency (tCD2 ≤ 4.2 ns), simplifying timing closure in high-frequency synchronous designs. |
| Per-Port I/O Voltage Selection | OPTL/OPTR pins allow independent 3.3 V or 2.5 V I/O operation-eliminates external level shifters in mixed-voltage SoC interfaces. |
| Integrated Address Counter | CNTEN/CNTRST signals enable auto-incrementing burst reads/writes without external address generation logic. |
| Dual Chip Enable Architecture | CE0/CE1 per port permits depth expansion across multiple devices using only address MSBs-no glue logic required. |
Applications
| Telecom Packet Buffering | FPGA Co-Processing Interface |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-wait-state shared buffer between ingress parser (left port) and egress scheduler (right port). Use Value: Simultaneous access eliminates arbitration delays; 4.2 ns tCD2 ensures sub-5 ns read turnaround for 10G+ throughput. |
Use Scenario: High-bandwidth data exchange between FPGA fabric and external processor in real-time vision systems. IC Role / Device Role / Timing Role: Serves as low-latency scratchpad memory with independent clock domains for FPGA logic and ARM subsystem. Use Value: Pipelined output and 133 MHz operation sustain >9 Gbps sustained bandwidth; per-port VDDQ selection matches FPGA I/O banks. |
| Industrial PLC Data Exchange | Network Switching ASIC Interface |
|
Use Scenario: Real-time synchronization of I/O status and control commands between redundant CPU modules. IC Role / Device Role / Timing Role: Acts as mirrored memory region accessible by two independent controllers for lock-step validation. Use Value: Industrial temperature rating (–40°C to +85°C) and 6 mA full standby current ensure reliability in uncooled enclosures. |
Use Scenario: Frame descriptor storage in multi-gigabit switch fabric where header parsing and forwarding decisions occur in parallel. IC Role / Device Role / Timing Role: Provides deterministic-access memory for descriptor queues shared between ingress and egress pipelines. Use Value: 7.5 ns cycle time supports 133 MHz descriptor update rates; separate BE0–BE3 enables atomic 9-bit field updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 32K × 36, 133 MHz, but uses 2.5 V only I/O; no OPT pin flexibility; 8 ns tCD2 (vs. 4.2 ns). | Limited to 2.5 V systems; lacks per-port voltage selection and faster pipelined timing. | Select when 2.5 V-only interface suffices and lower cost outweighs latency penalty. |
| AS7C33256P-133JCIN | 32K × 36, 133 MHz, but asynchronous OE and no pipelined mode; tAA = 10 ns (vs. 4.2 ns tCD2). | No deterministic pipelined latency; requires external flow control for burst transfers. | Choose for legacy designs requiring simple asynchronous read enable, not low-jitter pipelined operation. |
Compared with CY7C1362BV33-133AXC and AS7C33256P-133JCIN, the 70V3579S4DR delivers superior timing determinism (4.2 ns tCD2), flexible dual-voltage I/O per port, and integrated address counter-making it optimal for latency-critical, mixed-voltage, burst-oriented applications.
Availability
70V3579S4DR is available at Aetrix Electronics and suitable for telecom packet buffering, FPGA co-processing interfaces, and industrial PLC data exchange requiring stable component supply across extended product lifecycles.
Supply support for 70V3579S4DR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory, and interface solutions for communications and computing infrastructure.
The 70V3579S4DR belongs to IDT's high-speed synchronous dual-port SRAM product line, engineered for deterministic latency, multi-voltage interoperability, and seamless integration into packet-forwarding and real-time control systems.
FAQ
What is the maximum operating frequency of the 70V3579S4DR?
The 70V3579S4DR supports a maximum clock frequency of 133 MHz, corresponding to a 7.5 ns clock cycle time. This is guaranteed across the commercial temperature range (0°C to +70°C) and validated with 1.8 ns setup and 0.7 ns hold timing margins on all inputs at that rate. The device maintains full functionality up to its specified AC limits without derating.
Does the 70V3579S4DR support independent I/O voltage selection on each port?
Yes, the 70V3579S4DR supports independent I/O voltage selection via OPTL and OPTR pins. Setting OPTL to VIH (3.3 V) configures VDDQL for 3.3 V operation; setting it to VIL (0 V) configures VDDQL for 2.5 V. The same applies to OPTR and VDDQR. This allows mixed-voltage interfacing-for example, left port at 3.3 V to an MCU and right port at 2.5 V to an FPGA bank-without external level shifters.
What is the function of the ADS signal in the 70V3579S4DR?
The ADS (Address Strobe) signal in the 70V3579S4DR is an asynchronous input that controls whether the external address or internal counter value is loaded on the rising edge of CLK. When ADS = VIL, the current address bus value is latched; when ADS = VIH, the internal address counter advances (if CNTEN = VIL) or holds (if CNTEN = VIH). This enables flexible addressing modes-including burst transfers without software-managed address incrementing.
How does the pipelined output mode affect timing in the 70V3579S4DR?
In pipelined output mode, the 70V3579S4DR outputs data one clock cycle after the read command is registered-guaranteeing deterministic tCD2 ≤ 4.2 ns (commercial grade). This eliminates variable propagation delays seen in non-pipelined SRAMs and simplifies timing analysis in high-speed synchronous systems. The output remains valid for one full cycle, enabling reliable capture by downstream logic without additional strobes.
What power-saving features does the 70V3579S4DR offer?
The 70V3579S4DR provides four distinct standby modes: ISB1 (both ports TTL-level disabled, 145 mA max), ISB2 (one port active, 265 mA max), ISB3 (full CMOS standby, 6 mA typ), and ISB4 (one port CMOS standby, 265 mA max). These are controlled by CE0/CE1 logic combinations and input voltage thresholds, enabling granular power gating per port during idle periods-critical for thermally constrained telecom and industrial applications.
70V3579S4DR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 1.125Mbit
- Memory Organization:
- 32K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.15V ~ 3.45V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 208-PQFP (28x28)
70V3579S4DR FAQ
1.How can I place an order for 70V3579S4DR through Aetrix?
Please submit a Request for Quotation (RFQ) for 70V3579S4DR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 70V3579S4DR reliable?
The price and inventory of 70V3579S4DR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3579S4DR is usually 5 days.
3.What payment methods are accepted for 70V3579S4DR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3579S4DR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 70V3579S4DR?
70V3579S4DR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 70V3579S4DR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 70V3579S4DR?
For technical support, including 70V3579S4DR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3579S4DR requirements.
6.How does Aetrix verify that 70V3579S4DR is sourced from the original manufacturer or authorized distributors?
All 70V3579S4DR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3579S4DR meets industry standards.
7.What is the process for return or replacement of 70V3579S4DR?
All 70V3579S4DR units undergo pre-shipment inspection (PSI). If there is an issue with 70V3579S4DR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 70V3579S4DR part is unused and in its original packaging.
Return procedure for 70V3579S4DR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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