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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 70V3579S5BC8

Name: 70V3579S5BC8
Brand: Renesas
SKU: 70V3579S5BC8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 70V3579S5BC8

Manufacturer:: Renesas

Category:: Memory

Package:: 256-LBGA

Datasheet:: 70V3579S5BC8.pdf

Description:: IC SRAM 1.125MBIT PAR 256CABGA

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Product details

Overview

70V3579S5BC8 from Integrated Device Technology is a high-speed 32K × 36-bit synchronous dual-port static RAM with pipelined output, true dual-port memory cells enabling simultaneous access to the same address, 7.5 ns cycle time (133 MHz), and independent 3.3 V or 2.5 V I/O voltage selection per port. It supports industrial temperature range (–40°C to +85°C) and is used in real-time packet buffering for telecom line cards.

For engineers reviewing the 70V3579S5BC8 datasheet, 70V3579S5BC8 pinout, 70V3579S5BC8 application, or 70V3579S5BC8 equivalent, this page delivers verified timing parameters, validated package mapping to 208-pin PQFP, confirmed dual-port counter enable/reset functionality, and precise VDDQ/OPT voltage configuration logic for mixed-voltage system integration.

Technical Context

The 70V3579S5BC8 implements full synchronous operation on both ports using edge-triggered registers for address, data, and all control inputs-including CE0/CE1, R/W, BE0–BE3, ADS, CNTEN, and CNTRST-ensuring deterministic setup/hold timing at 133 MHz. Its pipelined output mode introduces one-cycle latency between clock and valid data output, while self-timed write enables minimal cycle time without external wait-state logic.

Each port features independent OPT pins (OPTL/OPTR) that configure its VDDQ supply (3.3 V or 2.5 V), allowing asymmetric I/O voltage operation-e.g., left port at 3.3 V interfacing with legacy logic, right port at 2.5 V connecting to low-voltage FPGAs-without level shifters. The internal address counter advances on CLK rising edge when CNTEN = VIL, regardless of CE or BE states.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	32K × 36 bits (1.152 Mbit); supports burst-mode unidirectional/bidirectional data flow in networking ASIC interfaces.
Cycle Time (Pipelined)	7.5 ns max (133 MHz); enables 9.6 Gbps aggregate bandwidth across both ports with no external wait states.
Access Time (Clock to Data)	4.2 ns max (commercial), 5 ns max (industrial); guarantees sub-5 ns read latency critical for jitter-sensitive telecom buffers.
I/O Voltage Support	Selectable 3.3 V (±150 mV) or 2.5 V (±125 mV) per port via OPTL/OPTR; eliminates need for external voltage translators in mixed-supply systems.
Operating Temperature	–40°C to +85°C (industrial grade); qualified for deployment in carrier-grade base station equipment and industrial PLC backplanes.
Power Supply	Core VDD = 3.3 V ±150 mV; separate VDDQ supplies per port; supports low-power standby modes (ISB3 = 6 mA typ).
Package	208-pin Plastic Quad Flatpack (PQFP); 28 mm × 28 mm body, 0.65 mm lead pitch; compatible with standard reflow profiles.

Pinout & Package

208-pin PQFP package (DRG208), 28 mm × 28 mm × 3.5 mm body, 0.65 mm lead pitch. Pin 1 marked by corner notch; top-side marking includes "70V3579S5BC8" and date code.

Pin/Terminal	Circuit Role	Design Meaning
CLKL / CLKR	Port L/R clock input	Synchronous edge-trigger for all registered inputs; rising edge latches address/data/control; determines maximum 133 MHz operation.
A0L–A14L / A0R–A14R	Port L/R address inputs	15-bit address bus (32K depth); ADSL/ADSR strobes load address on CLK rise; supports external or internal (counter) addressing.
I/O0L–I/O35L / I/O0R–I/O35R	Port L/R bidirectional data bus	36-bit wide interface; byte-enable groups (BE0–BE3) allow 9-bit granularity writes; high-Z state controlled by CE/OE.
CE0L/CE1L / CE0R/CE1R	Port L/R chip enable pair	Dual CE architecture enables depth expansion without glue logic; CE0=VIL & CE1=VIH activates port; both high forces power-down.
R/WL / R/WR	Port L/R read/write control	Active-low synchronous write enable; controls direction of I/O bus; combined with BEn selects write bytes during pipelined cycles.
OEL / OER	Port L/R output enable	Asynchronous control; overrides CE to place outputs in high-impedance state; enables bus sharing without timing constraints.
OPTL / OPTR	Port L/R I/O voltage select	VIH (3.3 V) configures VDDQL/VDDQR for 3.3 V I/O; VIL (0 V) configures for 2.5 V I/O; independent per port.
CNTRSTL / CNTRSTR	Port L/R counter reset	Asynchronous active-low reset; forces internal address counter to zero; allows deterministic initialization before burst transfers.
CNTENL / CNTENR	Port L/R counter enable	Synchronous enable (VIL on CLK rise) for internal address increment; operates independently of CE/BE, enabling auto-increment bursts.

Key Features

Feature	Design Value
True dual-port memory cells	Enables concurrent read/write to identical addresses-critical for real-time FIFOs in packet switching engines where ingress/egress paths share buffer space.
Pipelined output mode	One-cycle output latency simplifies timing closure in high-speed designs; eliminates need for external pipeline registers or complex clock domain crossing logic.
Dual chip enables (CE0/CE1)	Allows seamless depth expansion across multiple devices using only address MSBs-no additional decode logic required for >32K-depth buffers.
Separate byte enables (BE0–BE3)	Supports 9-bit sub-word writes (e.g., 16-bit or 24-bit payloads in 36-bit bus), reducing bus contention and enabling efficient partial updates in protocol stacks.
Independent I/O voltage selection	Per-port OPT pins let left port interface with 3.3 V FPGA fabric while right port connects to 2.5 V ASIC core-eliminating level-shifter ICs and PCB area.
Automatic power-down	CE0=VIH or CE1=VIL places port in low-standby mode (ISB2 = 190 mA max); reduces dynamic power by >50% during idle periods in bursty traffic scenarios.

Applications

Telecom Line Card Buffering	Real-Time Industrial PLC Memory
Use Scenario: High-throughput packet buffering in 10G/25G Ethernet line cards where ingress and egress data paths require concurrent access to shared memory. IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between MAC and switch fabric; pipelined reads deliver deterministic 4.2 ns access for jitter-critical timestamping. Use Value: Eliminates arbitration logic and external FIFOs; 133 MHz operation sustains 9.6 Gbps throughput across both ports without bottlenecking line-rate traffic.	Use Scenario: Deterministic data exchange between dual-core safety PLC processors executing redundant control algorithms with synchronized memory access. IC Role / Device Role / Timing Role: Serves as coherent shared memory with atomic read-modify-write capability; counter enable/reset ensures repeatable burst addressing for cyclic I/O scanning. Use Value: Industrial temp rating (–40°C to +85°C) and 5 ns access guarantee reliable operation in harsh factory environments; dual CE enables hot-swap memory expansion.
Medical Imaging Data Pipeline	Avionics Sensor Fusion Buffer
Use Scenario: Real-time buffering of parallel ADC streams (e.g., MRI coil arrays) feeding FPGA-based image reconstruction engines requiring low-jitter memory access. IC Role / Device Role / Timing Role: Left port accepts raw 36-bit pixel data at 133 MHz; right port feeds reconstructed frames to display controller-both with sub-5 ns latency. Use Value: Pipelined output mode aligns data delivery with FPGA pipeline stages; separate 2.5 V I/O on right port matches low-voltage display interface standards.	Use Scenario: Time-aligned fusion of inertial, GPS, and radar sensor data in DO-254-certified flight control systems requiring lockstep memory access. IC Role / Device Role / Timing Role: Dual-port architecture enables simultaneous write (sensor acquisition) and read (fusion algorithm) with guaranteed coherency; counter mode automates sequential frame storage. Use Value: 7.5 ns cycle time meets avionics timing budgets; industrial temp grade and traceable sourcing support certification requirements; PQFP package aids inspection and rework.

Telecom Line Card Buffering

Real-Time Industrial PLC Memory

Use Scenario: High-throughput packet buffering in 10G/25G Ethernet line cards where ingress and egress data paths require concurrent access to shared memory.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared buffer between MAC and switch fabric; pipelined reads deliver deterministic 4.2 ns access for jitter-critical timestamping.

Use Value: Eliminates arbitration logic and external FIFOs; 133 MHz operation sustains 9.6 Gbps throughput across both ports without bottlenecking line-rate traffic.

Use Scenario: Deterministic data exchange between dual-core safety PLC processors executing redundant control algorithms with synchronized memory access.

IC Role / Device Role / Timing Role: Serves as coherent shared memory with atomic read-modify-write capability; counter enable/reset ensures repeatable burst addressing for cyclic I/O scanning.

Use Value: Industrial temp rating (–40°C to +85°C) and 5 ns access guarantee reliable operation in harsh factory environments; dual CE enables hot-swap memory expansion.

Medical Imaging Data Pipeline

Avionics Sensor Fusion Buffer

Use Scenario: Real-time buffering of parallel ADC streams (e.g., MRI coil arrays) feeding FPGA-based image reconstruction engines requiring low-jitter memory access.

IC Role / Device Role / Timing Role: Left port accepts raw 36-bit pixel data at 133 MHz; right port feeds reconstructed frames to display controller-both with sub-5 ns latency.

Use Value: Pipelined output mode aligns data delivery with FPGA pipeline stages; separate 2.5 V I/O on right port matches low-voltage display interface standards.

Use Scenario: Time-aligned fusion of inertial, GPS, and radar sensor data in DO-254-certified flight control systems requiring lockstep memory access.

IC Role / Device Role / Timing Role: Dual-port architecture enables simultaneous write (sensor acquisition) and read (fusion algorithm) with guaranteed coherency; counter mode automates sequential frame storage.

Use Value: 7.5 ns cycle time meets avionics timing budgets; industrial temp grade and traceable sourcing support certification requirements; PQFP package aids inspection and rework.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY7C1362BV33-133AXC	32K × 36, 133 MHz, but uses fixed 3.3 V I/O only; no OPT-selectable 2.5 V mode; PQFP-208 package.	Lacks per-port voltage flexibility-requires external level shifters if interfacing with 2.5 V logic; suitable only for homogeneous 3.3 V systems.	Choose when cost sensitivity outweighs mixed-voltage design needs and existing layout uses identical PQFP footprint.
AS7C33256P-133JCIN	32K × 36, 133 MHz, but asynchronous CE/OE; no pipelined output or address counter; 256-pin BGA only.	No pipelining increases read latency to ≥8 ns; no CNTEN/CNTRST limits burst efficiency; BGA complicates prototyping and repair.	Consider only for space-constrained designs accepting higher latency and forgoing counter-based addressing; verify thermal profile compatibility.

Compared with CY7C1362BV33-133AXC and AS7C33256P-133JCIN, the 70V3579S5BC8 uniquely delivers per-port I/O voltage selection, pipelined latency optimization, and integrated address counter-all in a serviceable PQFP package-making it the sole option for mixed-voltage, low-jitter, burst-oriented embedded memory applications.

Availability

70V3579S5BC8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and medical imaging systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for 70V3579S5BC8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, and RF solutions for communications and computing markets.

The 70V3579S5BC8 belongs to IDT's high-speed synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency memory sharing in real-time embedded systems where concurrent access and precise timing control are mandatory.

FAQ

What is the maximum operating frequency of the 70V3579S5BC8?

The 70V3579S5BC8 supports a maximum clock frequency of 133 MHz, corresponding to a 7.5 ns clock cycle time in pipelined mode. This is validated across the industrial temperature range (–40°C to +85°C) and applies to both ports simultaneously under specified VDD and VDDQ conditions.

Does the 70V3579S5BC8 support independent I/O voltage levels on each port?

Yes, the 70V3579S5BC8 supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH (3.3 V) configures VDDQL for 3.3 V I/O operation on the left port, while setting OPTR to VIL (0 V) configures VDDQR for 2.5 V I/O on the right port-enabling mixed-voltage system integration without level shifters.

How does the address counter function in the 70V3579S5BC8?

The 70V3579S5BC8 includes an internal address counter per port, enabled synchronously on the rising edge of CLK when CNTENL or CNTENR is low. The counter advances automatically regardless of CE or BE states, allowing burst transfers without external address generation. CNTRSTL/CNTRSTR provides asynchronous reset to address zero.

What package type is used for the 70V3579S5BC8?

The 70V3579S5BC8 is packaged in a 208-pin Plastic Quad Flatpack (PQFP) with dimensions 28 mm × 28 mm × 3.5 mm and 0.65 mm lead pitch. This package is explicitly designated as DRG208 in IDT documentation and supports standard surface-mount reflow assembly.

What is the power consumption of the 70V3579S5BC8 in standby mode?

In full standby mode (ISB3), where both ports are disabled with CMOS-level inputs, the 70V3579S5BC8 draws 6 mA typical and 15 mA maximum. When only one port is active and the other is in TTL-level standby (ISB2), current is 190 mA typical and 260 mA maximum at 133 MHz-verified for industrial temperature operation.

70V3579S5BC8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 256-LBGA

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Dual Port, Synchronous

Memory Size:: 1.125Mbit

Memory Organization:: 32K x 36

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: -

Access Time:: 5 ns

Voltage - Supply:: 3.15V ~ 3.45V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 256-CABGA (17x17)

70V3579S5BC8 FAQ

1.How can I place an order for 70V3579S5BC8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3579S5BC8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3579S5BC8 reliable?

The price and inventory of 70V3579S5BC8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3579S5BC8 is usually 5 days.

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70V3579S5BC8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3579S5BC8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3579S5BC8?

For technical support, including 70V3579S5BC8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3579S5BC8 requirements.

6.How does Aetrix verify that 70V3579S5BC8 is sourced from the original manufacturer or authorized distributors?

All 70V3579S5BC8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3579S5BC8 meets industry standards.

7.What is the process for return or replacement of 70V3579S5BC8?

All 70V3579S5BC8 units undergo pre-shipment inspection (PSI). If there is an issue with 70V3579S5BC8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3579S5BC8 part is unused and in its original packaging.

Return procedure for 70V3579S5BC8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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