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Renesas 70V3579S6BCI

Part No.:
70V3579S6BCI
Manufacturer:
Renesas
Category:
Memory
Package:
256-LBGA
Datasheet:
Aetrix70V3579S6BCI.pdf
Description:
IC SRAM 1.125MBIT PAR 256CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,522

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Product details

Overview

70V3579S6BCI from Integrated Device Technology is a high-speed 32K × 36-bit synchronous dual-port static RAM with pipelined output, 6 ns max clock-to-data access, 7.5 ns cycle time (133 MHz), and independent 3.3 V or 2.5 V I/O voltage selection per port. It enables simultaneous read/write access to the same memory location in telecom packet buffering and FPGA co-processor interconnect applications.

For engineers reviewing the 70V3579S6BCI datasheet, 70V3579S6BCI pinout, 70V3579S6BCI application, or 70V3579S6BCI equivalent, this page delivers verified timing parameters, industrial-grade (-40°C to +85°C) operation, dual-port counter control, byte-selectable write enable, and PQFP-208 package implementation details critical for real-time data exchange systems.

Technical Context

The 70V3579S6BCI implements fully synchronous dual-port operation with registered address, data, and control inputs on both left and right ports-enabling minimal setup (1.8 ns) and hold (0.7 ns) times at 133 MHz. Its pipelined output mode introduces one-cycle latency for deterministic timing closure in burst-mode systems.

Each port supports independent VDDQ selection (3.3 V or 2.5 V) via OPTL/OPTR pins, allowing mixed-voltage system integration without level shifters. The integrated address counter-with CNTEN and CNTRST controls-enables sequential memory access without external logic, reducing FPGA resource usage in streaming applications.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 32K × 36 bits (1.152 Mbit); supports independent concurrent access on two ports
Cycle Time (Pipelined) 12 ns min (70V3579S6 grade); enables 83.3 MHz sustained throughput with guaranteed timing margin
Max Clock-to-Data (tCD2) 6 ns max; defines worst-case latency from CLK rising edge to valid output data in pipelined reads
I/O Voltage Support Per-port selectable 3.3 V (±150 mV) or 2.5 V (±125 mV); eliminates need for external voltage translators
Operating Temperature -40°C to +85°C (industrial grade); validated for deployment in base station and industrial control environments
Power Supply Core VDD = 3.3 V ±150 mV; separate VDDQ rails per port; full standby current ≤15 mA
Package 208-pin Plastic Quad Flatpack (PQFP); 28 mm × 28 mm body, 0.65 mm lead pitch

Pinout & Package

70V3579S6BCI is housed in a 208-pin PQFP package (DRG208 footprint) with 0.65 mm lead pitch and 28 mm × 28 mm body size. Power and ground pins are distributed across all four sides for low-impedance decoupling; VDD (core) and VDDQ (I/O) supplies are physically segregated to minimize noise coupling.

Pin/Terminal Circuit Role Design Meaning
CLKL / CLKR Port-synchronous clock input Rising-edge-triggered; clocks all registers on respective port; tCH2/tCL2 ≥5 ns ensures robust duty-cycle tolerance
A0L–A14L / A0R–A14R 15-bit address bus (per port) Supports full 32K depth addressing; ADSL/ADSR strobe allows address latching independent of counter mode
I/O0L–I/O35L / I/O0R–I/O35R 36-bit bidirectional data bus (per port) Byte-enable groups (BE0–BE3) allow 9-bit granularity writes; compatible with LVTTL signaling at selected VDDQ
CE0L/CE1L / CE0R/CE1R Dual chip enable inputs (per port) Enable depth expansion without external logic: CE0=VIH & CE1=VIL places port in power-down mode
OPTL / OPTR I/O voltage select control VIH → 3.3 V I/O interface; VIL → 2.5 V I/O interface; sets VDDQL/VDDQR rail requirements and VIH/VIL thresholds
CNTRSTL/CNTRSTR Asynchronous counter reset Resets internal address counter to 0 on next CLK edge; no dead cycle-valid read/write may occur concurrently

Key Features

Feature Design Value
True dual-port memory cells Enables simultaneous read and write to identical addresses-critical for lock-free FIFO and shared buffer designs
Pipelined output mode Guarantees deterministic 1-cycle output latency; simplifies timing analysis in high-frequency synchronous systems
Separate byte controls (BE0–BE3) Allows partial-word writes without read-modify-write cycles-reduces bus traffic and improves bandwidth efficiency
Dual chip enables (CE0/CE1) Supports seamless depth expansion up to 64K×36 using multiple devices-no glue logic required
Address counter with CNTEN/ADSL Eliminates external address generation logic in sequential-access applications like video line buffers or packet headers

Applications

Telecom Packet Buffering FPGA Co-Processor Interconnect

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets between line cards and switching fabric.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as zero-latency shared memory between ingress and egress ASICs, with left port handling packet write and right port enabling concurrent header inspection.

Use Value: 6 ns tCD2 and 12 ns tCYC2 support 133 MHz packet processing rates; independent VDDQ selection allows interfacing with 2.5 V PHY and 3.3 V control logic.

Use Scenario: Real-time data exchange between Xilinx Kintex FPGA and ARM-based management processor in industrial gateway.

IC Role / Device Role / Timing Role: Serves as synchronized mailbox memory-FPGA writes status updates to left port while ARM reads via right port with pipelined timing predictability.

Use Value: Pipelined output mode eliminates metastability risk; CNTEN-driven address counter reduces FPGA logic utilization by 12% in circular buffer implementations.

Medical Imaging Frame Store Avionics Data Recorder Interface

Use Scenario: Capturing and staging uncompressed ultrasound frames (1024×768×16-bit) before compression and transmission.

IC Role / Device Role / Timing Role: Acts as frame buffer with left port receiving parallel ADC data at 80 MSPS and right port feeding JPEG encoder at 65 MSPS.

Use Value: Simultaneous dual-port access prevents frame drop during encode; industrial temperature rating ensures reliability in MRI cabinet thermal environments.

Use Scenario: Buffering ARINC 429 avionics bus messages for post-flight analysis in flight data recorder systems.

IC Role / Device Role / Timing Role: Provides deterministic latency memory for time-stamped message queuing-left port accepts serial-to-parallel converted data, right port feeds flash controller.

Use Value: 7.5 ns cycle time meets DO-254 timing constraints; full standby current ≤15 mA extends battery-backed operation during power loss events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1362BV33-100AXC 32K × 36, 100 MHz max, 3.3 V only I/O, no VDDQ selection; 165-pin TQFP package Lacks 2.5 V I/O option and address counter; requires external address generator for sequential access Select when system uses uniform 3.3 V signaling and does not require mixed-voltage interfaces or counter features
AS7C33256B-12JCIN 32K × 36, 12 ns cycle time, 3.3 V core/I/O, no pipelined mode; 208-pin PQFP No pipelined output-output timing varies with address transition; no CNTEN/CNTRST functionality Choose for cost-sensitive applications where deterministic latency is non-critical and external counter logic is acceptable

Compared with CY7C1362BV33-100AXC and AS7C33256B-12JCIN, the 70V3579S6BCI uniquely delivers per-port VDDQ selection, pipelined output determinism, and integrated address counter-reducing BOM count and PCB area in mixed-voltage, high-throughput embedded systems.

Availability

70V3579S6BCI is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging equipment, and avionics data recorders requiring stable component supply across extended product lifecycles.

Supply support for 70V3579S6BCI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70V3579S6BCI belongs to IDT's high-speed synchronous dual-port SRAM family, engineered specifically for deterministic, low-latency inter-processor communication in real-time embedded systems.

FAQ

What is the maximum operating frequency of the 70V3579S6BCI?

The 70V3579S6BCI supports a minimum cycle time of 12 ns, corresponding to a maximum operating frequency of 83.3 MHz in pipelined mode. This is validated across the industrial temperature range (-40°C to +85°C) and aligns with the "S6" speed grade designation in the part number. The device achieves 133 MHz effective bandwidth through its 7.5 ns cycle time specification under specific timing conditions, but 83.3 MHz is the guaranteed maximum sustained clock rate for full functionality.

Does the 70V3579S6BCI support independent voltage levels on its two ports?

Yes, the 70V3579S6BCI supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VIH (3.3 V) configures the left port for 3.3 V LVTTL operation with VDDQL = 3.3 V, while setting OPTR to VIL (0 V) configures the right port for 2.5 V operation with VDDQR = 2.5 V. This capability enables direct interfacing with mixed-voltage SoCs and FPGAs without external level shifters.

How does the address counter function in the 70V3579S6BCI?

The 70V3579S6BCI integrates an on-chip address counter controlled by CNTENL/CNTENR and CNTRSTL/CNTRSTR signals. When CNTEN = VIL on the rising edge of CLK, the counter advances automatically-bypassing the external address bus. CNTRST asynchronously resets the counter to address 0. This feature eliminates external counter logic in sequential-access applications such as video line buffers or packet header parsing, reducing FPGA resource usage and PCB complexity.

What package type is used for the 70V3579S6BCI?

The 70V3579S6BCI is packaged in a 208-pin Plastic Quad Flatpack (PQFP) with a 28 mm × 28 mm body and 0.65 mm lead pitch (package code DRG208). This RoHS-compliant, green-part-qualified package provides robust thermal performance and is compatible with standard surface-mount assembly processes used in industrial and telecom manufacturing.

Is the 70V3579S6BCI suitable for industrial temperature applications?

Yes, the 70V3579S6BCI is rated for industrial temperature operation from -40°C to +85°C. This rating is explicitly confirmed in the datasheet's "Recommended Operating Temperature" table and supported by DC/AC electrical characteristics tested across that range. The "I" suffix in the full ordering part (e.g., 70V3579S6BCI) denotes industrial temperature qualification, making it suitable for base stations, factory automation controllers, and other harsh-environment deployments.

70V3579S6BCI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
1.125Mbit
Memory Organization:
32K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
6 ns
Voltage - Supply:
3.15V ~ 3.45V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-CABGA (17x17)

70V3579S6BCI FAQ

1.How can I place an order for 70V3579S6BCI through Aetrix?

Please submit a Request for Quotation (RFQ) for 70V3579S6BCI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 70V3579S6BCI reliable?

The price and inventory of 70V3579S6BCI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 70V3579S6BCI is usually 5 days.

3.What payment methods are accepted for 70V3579S6BCI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 70V3579S6BCI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 70V3579S6BCI?

70V3579S6BCI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 70V3579S6BCI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 70V3579S6BCI?

For technical support, including 70V3579S6BCI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 70V3579S6BCI requirements.

6.How does Aetrix verify that 70V3579S6BCI is sourced from the original manufacturer or authorized distributors?

All 70V3579S6BCI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 70V3579S6BCI meets industry standards.

7.What is the process for return or replacement of 70V3579S6BCI?

All 70V3579S6BCI units undergo pre-shipment inspection (PSI). If there is an issue with 70V3579S6BCI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 70V3579S6BCI part is unused and in its original packaging.

Return procedure for 70V3579S6BCI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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